JP6013705B2 - 部分パット上にバンプを有するフリップチップ相互接続構造を形成する半導体デバイスおよびその方法 - Google Patents

部分パット上にバンプを有するフリップチップ相互接続構造を形成する半導体デバイスおよびその方法 Download PDF

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JP6013705B2
JP6013705B2 JP2011011427A JP2011011427A JP6013705B2 JP 6013705 B2 JP6013705 B2 JP 6013705B2 JP 2011011427 A JP2011011427 A JP 2011011427A JP 2011011427 A JP2011011427 A JP 2011011427A JP 6013705 B2 JP6013705 B2 JP 6013705B2
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bump
interconnect
substrate
semiconductor die
solder
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JP2011258921A (ja
JP2011258921A5 (https=
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ディー． ペンズ ラジェンドラ
ディー． ペンズ ラジェンドラ
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Stats Chippac Pte Ltd
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Stats Chippac Pte Ltd
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Priority claimed from US12/813,335 external-priority patent/US9125332B2/en
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    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
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    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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JP2011011427A 2010-06-10 2011-01-21 部分パット上にバンプを有するフリップチップ相互接続構造を形成する半導体デバイスおよびその方法 Active JP6013705B2 (ja)

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