JP2011029636A5 - - Google Patents

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JP2011029636A5
JP2011029636A5 JP2010151626A JP2010151626A JP2011029636A5 JP 2011029636 A5 JP2011029636 A5 JP 2011029636A5 JP 2010151626 A JP2010151626 A JP 2010151626A JP 2010151626 A JP2010151626 A JP 2010151626A JP 2011029636 A5 JP2011029636 A5 JP 2011029636A5
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layer
diffusion barrier
barrier layer
deposited
copper
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JP2010151626A
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JP2011029636A (ja
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Priority claimed from US12/825,822 external-priority patent/US8592995B2/en
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JP2010151626A 2009-07-02 2010-07-02 銅柱バンプ上の金属間化合物の接合のための方法と構造 Pending JP2011029636A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US22286009P 2009-07-02 2009-07-02
US12/825,822 US8592995B2 (en) 2009-07-02 2010-06-29 Method and structure for adhesion of intermetallic compound (IMC) on Cu pillar bump

Related Child Applications (1)

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JP2013076744A Division JP5756140B2 (ja) 2009-07-02 2013-04-02 銅柱バンプ上の金属間化合物の接合のための方法

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JP2011029636A JP2011029636A (ja) 2011-02-10
JP2011029636A5 true JP2011029636A5 (https=) 2012-07-05

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Application Number Title Priority Date Filing Date
JP2010151626A Pending JP2011029636A (ja) 2009-07-02 2010-07-02 銅柱バンプ上の金属間化合物の接合のための方法と構造
JP2013076744A Active JP5756140B2 (ja) 2009-07-02 2013-04-02 銅柱バンプ上の金属間化合物の接合のための方法
JP2015031242A Active JP6352205B2 (ja) 2009-07-02 2015-02-20 銅柱バンプ上の金属間化合物の接合のための構造

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JP2013076744A Active JP5756140B2 (ja) 2009-07-02 2013-04-02 銅柱バンプ上の金属間化合物の接合のための方法
JP2015031242A Active JP6352205B2 (ja) 2009-07-02 2015-02-20 銅柱バンプ上の金属間化合物の接合のための構造

Country Status (5)

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US (1) US8592995B2 (https=)
JP (3) JP2011029636A (https=)
KR (1) KR101344553B1 (https=)
CN (1) CN101944496B (https=)
TW (1) TWI498981B (https=)

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