JP2010206173A - 光電変換装置およびカメラ - Google Patents

光電変換装置およびカメラ Download PDF

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Publication number
JP2010206173A
JP2010206173A JP2009293212A JP2009293212A JP2010206173A JP 2010206173 A JP2010206173 A JP 2010206173A JP 2009293212 A JP2009293212 A JP 2009293212A JP 2009293212 A JP2009293212 A JP 2009293212A JP 2010206173 A JP2010206173 A JP 2010206173A
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JP
Japan
Prior art keywords
region
type
photoelectric conversion
transistor
conversion device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009293212A
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English (en)
Japanese (ja)
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JP2010206173A5 (enExample
Inventor
Hajime Ikeda
一 池田
Yoshihisa Kabaya
欣尚 蒲谷
Takanori Watanabe
高典 渡邉
Takeshi Ichikawa
武史 市川
Mineo Shimotsusa
峰生 下津佐
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2009293212A priority Critical patent/JP2010206173A/ja
Priority to EP10703363A priority patent/EP2394302A1/en
Priority to KR1020117020357A priority patent/KR20110107407A/ko
Priority to PCT/JP2010/050999 priority patent/WO2010090105A1/en
Priority to CN201080006229.6A priority patent/CN102301474B/zh
Priority to US13/139,542 priority patent/US8670059B2/en
Publication of JP2010206173A publication Critical patent/JP2010206173A/ja
Publication of JP2010206173A5 publication Critical patent/JP2010206173A5/ja
Priority to US14/137,100 priority patent/US8953076B2/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/20—Electrodes
    • H10F77/206—Electrodes for devices having potential barriers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • H10F39/014—Manufacture or treatment of image sensors covered by group H10F39/12 of CMOS image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H10F39/199—Back-illuminated image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/802—Geometry or disposition of elements in pixels, e.g. address-lines or gate electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/803—Pixels having integrated switching, control, storage or amplification elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/807—Pixel isolation structures

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Light Receiving Elements (AREA)
JP2009293212A 2009-02-06 2009-12-24 光電変換装置およびカメラ Pending JP2010206173A (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2009293212A JP2010206173A (ja) 2009-02-06 2009-12-24 光電変換装置およびカメラ
EP10703363A EP2394302A1 (en) 2009-02-06 2010-01-20 Photoelectric conversion device and camera
KR1020117020357A KR20110107407A (ko) 2009-02-06 2010-01-20 광전변환장치 및 카메라
PCT/JP2010/050999 WO2010090105A1 (en) 2009-02-06 2010-01-20 Photoelectric conversion device and camera
CN201080006229.6A CN102301474B (zh) 2009-02-06 2010-01-20 光电转换装置和照相机
US13/139,542 US8670059B2 (en) 2009-02-06 2010-01-20 Photoelectric conversion device having an n-type buried layer, and camera
US14/137,100 US8953076B2 (en) 2009-02-06 2013-12-20 Photoelectric conversion device and camera having a photodiode cathode formed by an n-type buried layer

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009026698 2009-02-06
JP2009293212A JP2010206173A (ja) 2009-02-06 2009-12-24 光電変換装置およびカメラ

Publications (2)

Publication Number Publication Date
JP2010206173A true JP2010206173A (ja) 2010-09-16
JP2010206173A5 JP2010206173A5 (enExample) 2013-02-14

Family

ID=42115502

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009293212A Pending JP2010206173A (ja) 2009-02-06 2009-12-24 光電変換装置およびカメラ

Country Status (6)

Country Link
US (2) US8670059B2 (enExample)
EP (1) EP2394302A1 (enExample)
JP (1) JP2010206173A (enExample)
KR (1) KR20110107407A (enExample)
CN (1) CN102301474B (enExample)
WO (1) WO2010090105A1 (enExample)

Cited By (7)

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US20090250778A1 (en) * 2008-04-04 2009-10-08 Canon Kabushiki Kaisha Photoelectric conversion device, imaging system, photoelectric conversion device designing method, and photoelectric conversion device manufacturing method
JP2015138851A (ja) * 2014-01-21 2015-07-30 ルネサスエレクトロニクス株式会社 半導体装置
CN105185699A (zh) * 2015-09-25 2015-12-23 上海华力微电子有限公司 通过c离子注入降低cmos图像传感器白像素的方法
JP2016092137A (ja) * 2014-10-31 2016-05-23 キヤノン株式会社 撮像装置
JP2018186267A (ja) * 2017-04-26 2018-11-22 パナソニックＩｐマネジメント株式会社 光検出装置
JP2019050384A (ja) * 2018-10-18 2019-03-28 キヤノン株式会社 光電変換装置、および、撮像システム
JP2019146130A (ja) * 2018-02-23 2019-08-29 株式会社リコー 光電変換素子、画像読取装置、および画像形成装置

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JP2010206174A (ja) 2009-02-06 2010-09-16 Canon Inc 光電変換装置およびその製造方法ならびにカメラ
JP2010206172A (ja) 2009-02-06 2010-09-16 Canon Inc 撮像装置およびカメラ
JP2012142560A (ja) * 2010-12-15 2012-07-26 Canon Inc 固体撮像装置およびその製造方法ならびにカメラ
US20130256509A1 (en) * 2012-03-27 2013-10-03 Omnivision Technologies, Inc. Dual source follower pixel cell architecture
US9007504B2 (en) * 2012-04-06 2015-04-14 Omnivision Technologies, Inc. Method, apparatus and system for reducing pixel cell noise
JP5985269B2 (ja) * 2012-06-26 2016-09-06 ルネサスエレクトロニクス株式会社 半導体装置
WO2014002330A1 (ja) * 2012-06-27 2014-01-03 パナソニック株式会社 固体撮像装置
JP6278608B2 (ja) 2013-04-08 2018-02-14 キヤノン株式会社 半導体装置およびその製造方法
JP6119432B2 (ja) * 2013-05-31 2017-04-26 ソニー株式会社 固体撮像素子、電子機器、および製造方法
JP6121837B2 (ja) * 2013-08-02 2017-04-26 ソニーセミコンダクタソリューションズ株式会社 撮像素子
JP2016018919A (ja) * 2014-07-09 2016-02-01 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
US9515116B1 (en) * 2015-05-22 2016-12-06 Taiwan Semiconductor Manufacturing Co., Ltd. Vertical transfer gate structure for a back-side illumination (BSI) complementary metal-oxide-semiconductor (CMOS) image sensor using global shutter capture
US10014333B2 (en) * 2015-08-26 2018-07-03 Semiconductor Components Industries, Llc Back-side illuminated pixels with interconnect layers
JP2017135167A (ja) 2016-01-25 2017-08-03 キヤノン株式会社 半導体装置及び情報処理システム

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US8953076B2 (en) 2015-02-10
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