JP2005503660A - フリップチップ用の自己平面保持バンプの形状 - Google Patents

フリップチップ用の自己平面保持バンプの形状 Download PDF

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Publication number
JP2005503660A
JP2005503660A JP2002568401A JP2002568401A JP2005503660A JP 2005503660 A JP2005503660 A JP 2005503660A JP 2002568401 A JP2002568401 A JP 2002568401A JP 2002568401 A JP2002568401 A JP 2002568401A JP 2005503660 A JP2005503660 A JP 2005503660A
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Prior art keywords
bump
leg
base
stud
structure according
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JP2002568401A
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Japanese (ja)
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JP2005503660A5 (enExample
Inventor
ヤンドー クゥエオン
ラジェンドラ ペンデス
ナジール アーマッド
キョンムン キム
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チップパック，インク．
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Publication of JP2005503660A publication Critical patent/JP2005503660A/ja
Publication of JP2005503660A5 publication Critical patent/JP2005503660A5/ja
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
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    • H01L2924/351—Thermal stress

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JP2014132635A (ja) * 2012-12-05 2014-07-17 Murata Mfg Co Ltd バンプ付き電子部品及びバンプ付き電子部品の製造方法

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US20020151228A1 (en) 2002-10-17
US7211901B2 (en) 2007-05-01
US7407877B2 (en) 2008-08-05
US20050221535A1 (en) 2005-10-06
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US6940178B2 (en) 2005-09-06
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