TWI279881B - Self-coplanarity bumping shape for flip chip - Google Patents

Self-coplanarity bumping shape for flip chip Download PDF

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Publication number
TWI279881B
TWI279881B TW091103580A TW91103580A TWI279881B TW I279881 B TWI279881 B TW I279881B TW 091103580 A TW091103580 A TW 091103580A TW 91103580 A TW91103580 A TW 91103580A TW I279881 B TWI279881 B TW I279881B
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TW
Taiwan
Prior art keywords
wire forming
gold
gold wire
rti
base portion
Prior art date
Application number
TW091103580A
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English (en)
Chinese (zh)
Inventor
Young-Do Kweon
Rajendra Pendse
Nazir Ahmad
Kyung-Moon Kim
Original Assignee
Chippac Inc
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Publication date
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Publication of TWI279881B publication Critical patent/TWI279881B/zh

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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress

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  • General Physics & Mathematics (AREA)
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TW091103580A 2001-02-27 2002-02-27 Self-coplanarity bumping shape for flip chip TWI279881B (en)

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US10/080,384 US6940178B2 (en) 2001-02-27 2002-02-22 Self-coplanarity bumping shape for flip chip

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WO2002069372A2 (en) 2002-09-06
WO2002069372A8 (en) 2003-02-20
US20020151228A1 (en) 2002-10-17
US7211901B2 (en) 2007-05-01
US7407877B2 (en) 2008-08-05
US20050221535A1 (en) 2005-10-06
WO2002069372A3 (en) 2003-10-30
KR20030080033A (ko) 2003-10-10
JP2005503660A (ja) 2005-02-03
AU2002244124A1 (en) 2002-09-12
US6940178B2 (en) 2005-09-06
US20050218515A1 (en) 2005-10-06

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