TW308724B - - Google Patents
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- Publication number
- TW308724B TW308724B TW085104899A TW85104899A TW308724B TW 308724 B TW308724 B TW 308724B TW 085104899 A TW085104899 A TW 085104899A TW 85104899 A TW85104899 A TW 85104899A TW 308724 B TW308724 B TW 308724B
- Authority
- TW
- Taiwan
- Prior art keywords
- pad
- contact
- die
- test board
- ring
- Prior art date
Links
- 238000012360 testing method Methods 0.000 claims description 68
- 239000000463 material Substances 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 8
- 229910052703 rhodium Inorganic materials 0.000 claims description 2
- 239000010948 rhodium Substances 0.000 claims description 2
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 claims description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims 4
- 229910052697 platinum Inorganic materials 0.000 claims 2
- 244000025254 Cannabis sativa Species 0.000 claims 1
- 230000002079 cooperative effect Effects 0.000 claims 1
- 230000000875 corresponding effect Effects 0.000 claims 1
- 239000008187 granular material Substances 0.000 claims 1
- 238000012856 packing Methods 0.000 claims 1
- 238000010998 test method Methods 0.000 claims 1
- 238000005242 forging Methods 0.000 description 11
- 230000008901 benefit Effects 0.000 description 9
- 229910000679 solder Inorganic materials 0.000 description 9
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 235000013339 cereals Nutrition 0.000 description 3
- 229920001940 conductive polymer Polymers 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910001020 Au alloy Inorganic materials 0.000 description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920002313 fluoropolymer Polymers 0.000 description 2
- 239000004811 fluoropolymer Substances 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 241001494479 Pecora Species 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000003044 adaptive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000003353 gold alloy Substances 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 235000015170 shellfish Nutrition 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Structure Of Printed Boards (AREA)
- Contacts (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US49731595A | 1995-07-03 | 1995-07-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW308724B true TW308724B (enExample) | 1997-06-21 |
Family
ID=23976359
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW085104899A TW308724B (enExample) | 1995-07-03 | 1996-04-24 |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP0752594B1 (enExample) |
| JP (1) | JPH0927524A (enExample) |
| KR (1) | KR970007386A (enExample) |
| DE (1) | DE69608355T2 (enExample) |
| TW (1) | TW308724B (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003056346A1 (en) * | 2001-12-25 | 2003-07-10 | Sumitomo Electric Industries, Ltd. | Contact probe |
| KR100436878B1 (ko) * | 2002-06-18 | 2004-06-23 | 건양씨앤이 주식회사 | 강관압입 추진공법시 사용되는 추진강관의 수평유지방법및 그 장치 |
| TWI241669B (en) * | 2003-05-01 | 2005-10-11 | Celerity Res Inc | Planarizing and testing of BGA packages |
| WO2006028238A1 (ja) * | 2004-09-06 | 2006-03-16 | Nec Corporation | テストキャリア |
| JP4647700B2 (ja) * | 2009-10-29 | 2011-03-09 | 北陸電気工業株式会社 | プッシュオンスイッチ |
| JP5406310B2 (ja) * | 2009-12-11 | 2014-02-05 | 日本発條株式会社 | コンタクトプローブ |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4975079A (en) * | 1990-02-23 | 1990-12-04 | International Business Machines Corp. | Connector assembly for chip testing |
| GB2247565B (en) * | 1990-08-22 | 1994-07-06 | Gen Electric Co Plc | A method of testing a semiconductor device |
| JP2591348B2 (ja) * | 1993-06-28 | 1997-03-19 | 日本電気株式会社 | 半導体素子の検査治具及び検査方法 |
| GB2279805B (en) * | 1993-07-02 | 1997-09-17 | Plessey Semiconductors Ltd | Bare die testing |
-
1996
- 1996-04-24 TW TW085104899A patent/TW308724B/zh active
- 1996-06-20 EP EP96109960A patent/EP0752594B1/en not_active Expired - Lifetime
- 1996-06-20 DE DE69608355T patent/DE69608355T2/de not_active Expired - Fee Related
- 1996-06-26 JP JP8184232A patent/JPH0927524A/ja active Pending
- 1996-06-28 KR KR1019960024827A patent/KR970007386A/ko not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| DE69608355T2 (de) | 2001-01-04 |
| EP0752594A3 (en) | 1997-08-06 |
| JPH0927524A (ja) | 1997-01-28 |
| EP0752594A2 (en) | 1997-01-08 |
| EP0752594B1 (en) | 2000-05-17 |
| KR970007386A (ko) | 1997-02-21 |
| DE69608355D1 (de) | 2000-06-21 |
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