JPH0927524A - 検査基板とダイとを電気的に接続する接点構造および接続方法 - Google Patents
検査基板とダイとを電気的に接続する接点構造および接続方法Info
- Publication number
- JPH0927524A JPH0927524A JP8184232A JP18423296A JPH0927524A JP H0927524 A JPH0927524 A JP H0927524A JP 8184232 A JP8184232 A JP 8184232A JP 18423296 A JP18423296 A JP 18423296A JP H0927524 A JPH0927524 A JP H0927524A
- Authority
- JP
- Japan
- Prior art keywords
- die
- bump
- contact
- bumps
- inspection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007689 inspection Methods 0.000 title claims abstract description 38
- 238000000034 method Methods 0.000 title claims abstract description 18
- 239000000758 substrate Substances 0.000 claims description 43
- 238000012360 testing method Methods 0.000 claims description 43
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 4
- 229910052763 palladium Inorganic materials 0.000 claims description 3
- 229910052697 platinum Inorganic materials 0.000 claims description 2
- 229910052703 rhodium Inorganic materials 0.000 claims description 2
- 239000010948 rhodium Substances 0.000 claims description 2
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 abstract description 19
- 239000000463 material Substances 0.000 description 12
- 230000008901 benefit Effects 0.000 description 9
- 239000004065 semiconductor Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 4
- 229920001940 conductive polymer Polymers 0.000 description 3
- 229920002313 fluoropolymer Polymers 0.000 description 3
- 239000004811 fluoropolymer Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910001020 Au alloy Inorganic materials 0.000 description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000003353 gold alloy Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000013519 translation Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Structure Of Printed Boards (AREA)
- Contacts (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US49731595A | 1995-07-03 | 1995-07-03 | |
| US497315 | 1995-07-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0927524A true JPH0927524A (ja) | 1997-01-28 |
Family
ID=23976359
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8184232A Pending JPH0927524A (ja) | 1995-07-03 | 1996-06-26 | 検査基板とダイとを電気的に接続する接点構造および接続方法 |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP0752594B1 (enExample) |
| JP (1) | JPH0927524A (enExample) |
| KR (1) | KR970007386A (enExample) |
| DE (1) | DE69608355T2 (enExample) |
| TW (1) | TW308724B (enExample) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006028238A1 (ja) * | 2004-09-06 | 2006-03-16 | Nec Corporation | テストキャリア |
| JP2006525515A (ja) * | 2003-05-01 | 2006-11-09 | セレリティー・リサーチ・インコーポレイテッド | Ｂｇａパッケージの平坦化及び検査方法ならびに装置 |
| JP2010050105A (ja) * | 2009-10-29 | 2010-03-04 | Hokuriku Electric Ind Co Ltd | プッシュオンスイッチ |
| WO2011071082A1 (ja) * | 2009-12-11 | 2011-06-16 | 日本発條株式会社 | コンタクトプローブ |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003056346A1 (en) * | 2001-12-25 | 2003-07-10 | Sumitomo Electric Industries, Ltd. | Contact probe |
| KR100436878B1 (ko) * | 2002-06-18 | 2004-06-23 | 건양씨앤이 주식회사 | 강관압입 추진공법시 사용되는 추진강관의 수평유지방법및 그 장치 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4975079A (en) * | 1990-02-23 | 1990-12-04 | International Business Machines Corp. | Connector assembly for chip testing |
| GB2247565B (en) * | 1990-08-22 | 1994-07-06 | Gen Electric Co Plc | A method of testing a semiconductor device |
| JP2591348B2 (ja) * | 1993-06-28 | 1997-03-19 | 日本電気株式会社 | 半導体素子の検査治具及び検査方法 |
| GB2279805B (en) * | 1993-07-02 | 1997-09-17 | Plessey Semiconductors Ltd | Bare die testing |
-
1996
- 1996-04-24 TW TW085104899A patent/TW308724B/zh active
- 1996-06-20 EP EP96109960A patent/EP0752594B1/en not_active Expired - Lifetime
- 1996-06-20 DE DE69608355T patent/DE69608355T2/de not_active Expired - Fee Related
- 1996-06-26 JP JP8184232A patent/JPH0927524A/ja active Pending
- 1996-06-28 KR KR1019960024827A patent/KR970007386A/ko not_active Withdrawn
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006525515A (ja) * | 2003-05-01 | 2006-11-09 | セレリティー・リサーチ・インコーポレイテッド | Ｂｇａパッケージの平坦化及び検査方法ならびに装置 |
| WO2006028238A1 (ja) * | 2004-09-06 | 2006-03-16 | Nec Corporation | テストキャリア |
| JP2010050105A (ja) * | 2009-10-29 | 2010-03-04 | Hokuriku Electric Ind Co Ltd | プッシュオンスイッチ |
| WO2011071082A1 (ja) * | 2009-12-11 | 2011-06-16 | 日本発條株式会社 | コンタクトプローブ |
| JP5406310B2 (ja) * | 2009-12-11 | 2014-02-05 | 日本発條株式会社 | コンタクトプローブ |
Also Published As
| Publication number | Publication date |
|---|---|
| DE69608355T2 (de) | 2001-01-04 |
| EP0752594A3 (en) | 1997-08-06 |
| EP0752594A2 (en) | 1997-01-08 |
| TW308724B (enExample) | 1997-06-21 |
| EP0752594B1 (en) | 2000-05-17 |
| KR970007386A (ko) | 1997-02-21 |
| DE69608355D1 (de) | 2000-06-21 |
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