KR970007386A - 전자 디바이스 접촉용 테스팅 보드 및 전자 디바이스 테스트 방법 - Google Patents

전자 디바이스 접촉용 테스팅 보드 및 전자 디바이스 테스트 방법 Download PDF

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Publication number
KR970007386A
KR970007386A KR1019960024827A KR19960024827A KR970007386A KR 970007386 A KR970007386 A KR 970007386A KR 1019960024827 A KR1019960024827 A KR 1019960024827A KR 19960024827 A KR19960024827 A KR 19960024827A KR 970007386 A KR970007386 A KR 970007386A
Authority
KR
South Korea
Prior art keywords
electronic device
testing
disposed
die
testing board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1019960024827A
Other languages
English (en)
Korean (ko)
Inventor
더블유. 스타포드 죤
바스퀴즈 바바라
엠. 윌리암스 윌리암
Original Assignee
빈센트 비. 인그라시아
모토로라 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 빈센트 비. 인그라시아, 모토로라 인코포레이티드 filed Critical 빈센트 비. 인그라시아
Publication of KR970007386A publication Critical patent/KR970007386A/ko
Withdrawn legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2886Features relating to contacting the IC under test, e.g. probe heads; chucks
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Structure Of Printed Boards (AREA)
  • Contacts (AREA)
KR1019960024827A 1995-07-03 1996-06-28 전자 디바이스 접촉용 테스팅 보드 및 전자 디바이스 테스트 방법 Withdrawn KR970007386A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US49731595A 1995-07-03 1995-07-03
US497,315 1995-07-03

Publications (1)

Publication Number Publication Date
KR970007386A true KR970007386A (ko) 1997-02-21

Family

ID=23976359

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960024827A Withdrawn KR970007386A (ko) 1995-07-03 1996-06-28 전자 디바이스 접촉용 테스팅 보드 및 전자 디바이스 테스트 방법

Country Status (5)

Country Link
EP (1) EP0752594B1 (enExample)
JP (1) JPH0927524A (enExample)
KR (1) KR970007386A (enExample)
DE (1) DE69608355T2 (enExample)
TW (1) TW308724B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100436878B1 (ko) * 2002-06-18 2004-06-23 건양씨앤이 주식회사 강관압입 추진공법시 사용되는 추진강관의 수평유지방법및 그 장치

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003056346A1 (en) * 2001-12-25 2003-07-10 Sumitomo Electric Industries, Ltd. Contact probe
TWI241669B (en) * 2003-05-01 2005-10-11 Celerity Res Inc Planarizing and testing of BGA packages
WO2006028238A1 (ja) * 2004-09-06 2006-03-16 Nec Corporation テストキャリア
JP4647700B2 (ja) * 2009-10-29 2011-03-09 北陸電気工業株式会社 プッシュオンスイッチ
JP5406310B2 (ja) * 2009-12-11 2014-02-05 日本発條株式会社 コンタクトプローブ

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4975079A (en) * 1990-02-23 1990-12-04 International Business Machines Corp. Connector assembly for chip testing
GB2247565B (en) * 1990-08-22 1994-07-06 Gen Electric Co Plc A method of testing a semiconductor device
JP2591348B2 (ja) * 1993-06-28 1997-03-19 日本電気株式会社 半導体素子の検査治具及び検査方法
GB2279805B (en) * 1993-07-02 1997-09-17 Plessey Semiconductors Ltd Bare die testing

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100436878B1 (ko) * 2002-06-18 2004-06-23 건양씨앤이 주식회사 강관압입 추진공법시 사용되는 추진강관의 수평유지방법및 그 장치

Also Published As

Publication number Publication date
DE69608355T2 (de) 2001-01-04
EP0752594A3 (en) 1997-08-06
JPH0927524A (ja) 1997-01-28
EP0752594A2 (en) 1997-01-08
TW308724B (enExample) 1997-06-21
EP0752594B1 (en) 2000-05-17
DE69608355D1 (de) 2000-06-21

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Legal Events

Date Code Title Description
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 19960628

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid