DE69608355D1 - Kontaktstruktur für die elektrische Verbindung von Testplatine und Chip - Google Patents

Kontaktstruktur für die elektrische Verbindung von Testplatine und Chip

Info

Publication number
DE69608355D1
DE69608355D1 DE69608355T DE69608355T DE69608355D1 DE 69608355 D1 DE69608355 D1 DE 69608355D1 DE 69608355 T DE69608355 T DE 69608355T DE 69608355 T DE69608355 T DE 69608355T DE 69608355 D1 DE69608355 D1 DE 69608355D1
Authority
DE
Germany
Prior art keywords
chip
electrical connection
contact structure
test board
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69608355T
Other languages
English (en)
Other versions
DE69608355T2 (de
Inventor
John W Stafford
Barbara Vasquez
William M Williams
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of DE69608355D1 publication Critical patent/DE69608355D1/de
Application granted granted Critical
Publication of DE69608355T2 publication Critical patent/DE69608355T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Structure Of Printed Boards (AREA)
  • Contacts (AREA)
DE69608355T 1995-07-03 1996-06-20 Kontaktstruktur für die elektrische Verbindung von Testplatine und Chip Expired - Fee Related DE69608355T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US49731595A 1995-07-03 1995-07-03

Publications (2)

Publication Number Publication Date
DE69608355D1 true DE69608355D1 (de) 2000-06-21
DE69608355T2 DE69608355T2 (de) 2001-01-04

Family

ID=23976359

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69608355T Expired - Fee Related DE69608355T2 (de) 1995-07-03 1996-06-20 Kontaktstruktur für die elektrische Verbindung von Testplatine und Chip

Country Status (5)

Country Link
EP (1) EP0752594B1 (de)
JP (1) JPH0927524A (de)
KR (1) KR970007386A (de)
DE (1) DE69608355T2 (de)
TW (1) TW308724B (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040069259A (ko) * 2001-12-25 2004-08-05 스미토모덴키고교가부시키가이샤 컨택트 프로브
KR100436878B1 (ko) * 2002-06-18 2004-06-23 건양씨앤이 주식회사 강관압입 추진공법시 사용되는 추진강관의 수평유지방법및 그 장치
TWI241669B (en) * 2003-05-01 2005-10-11 Celerity Res Inc Planarizing and testing of BGA packages
WO2006028238A1 (ja) * 2004-09-06 2006-03-16 Nec Corporation テストキャリア
JP4647700B2 (ja) * 2009-10-29 2011-03-09 北陸電気工業株式会社 プッシュオンスイッチ
JP5406310B2 (ja) * 2009-12-11 2014-02-05 日本発條株式会社 コンタクトプローブ

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4975079A (en) * 1990-02-23 1990-12-04 International Business Machines Corp. Connector assembly for chip testing
GB2247565B (en) * 1990-08-22 1994-07-06 Gen Electric Co Plc A method of testing a semiconductor device
JP2591348B2 (ja) * 1993-06-28 1997-03-19 日本電気株式会社 半導体素子の検査治具及び検査方法
GB2279805B (en) * 1993-07-02 1997-09-17 Plessey Semiconductors Ltd Bare die testing

Also Published As

Publication number Publication date
EP0752594B1 (de) 2000-05-17
TW308724B (de) 1997-06-21
EP0752594A3 (de) 1997-08-06
JPH0927524A (ja) 1997-01-28
EP0752594A2 (de) 1997-01-08
DE69608355T2 (de) 2001-01-04
KR970007386A (ko) 1997-02-21

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8328 Change in the person/name/address of the agent

Free format text: SCHUMACHER & WILLSAU, PATENTANWALTSSOZIETAET, 80335 MUENCHEN

8339 Ceased/non-payment of the annual fee