DE69400980T2 - Elektrische Anschlussvorrichtung und zugehöriges Herstellungsverfahren - Google Patents
Elektrische Anschlussvorrichtung und zugehöriges HerstellungsverfahrenInfo
- Publication number
- DE69400980T2 DE69400980T2 DE69400980T DE69400980T DE69400980T2 DE 69400980 T2 DE69400980 T2 DE 69400980T2 DE 69400980 T DE69400980 T DE 69400980T DE 69400980 T DE69400980 T DE 69400980T DE 69400980 T2 DE69400980 T2 DE 69400980T2
- Authority
- DE
- Germany
- Prior art keywords
- manufacturing process
- electrical connection
- connection device
- associated manufacturing
- electrical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3405—Edge mounted components, e.g. terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10386—Clip leads; Terminals gripping the edge of a substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Multi-Conductor Connections (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9305818A FR2705500B1 (fr) | 1993-05-14 | 1993-05-14 | Dispositif de raccordement électrique et procédé de fabrication correspondant. |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69400980D1 DE69400980D1 (de) | 1997-01-09 |
DE69400980T2 true DE69400980T2 (de) | 1997-06-26 |
Family
ID=9447123
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69400980T Expired - Lifetime DE69400980T2 (de) | 1993-05-14 | 1994-05-06 | Elektrische Anschlussvorrichtung und zugehöriges Herstellungsverfahren |
Country Status (4)
Country | Link |
---|---|
US (1) | US5569056A (de) |
EP (1) | EP0624921B1 (de) |
DE (1) | DE69400980T2 (de) |
FR (1) | FR2705500B1 (de) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5906496A (en) * | 1996-12-23 | 1999-05-25 | Thomas & Betts International, Inc. | Miniature card edge clip |
US5899759A (en) * | 1997-12-29 | 1999-05-04 | Ford Motor Company | Electrical connector for rigid circuit boards |
US6325682B1 (en) | 1998-12-14 | 2001-12-04 | North American Specialties Corporation | Collapsible electrical leads for engaging a substrate |
DE10057460C1 (de) * | 2000-11-20 | 2002-08-08 | Tyco Electronics Amp Gmbh | Halteelement mit einer Halteklammer, Anordnung mit einer Trägerplatte und einem Halteelement und Anordnung mit Halteelement und Trägerstreifen |
US6547597B2 (en) * | 2001-07-10 | 2003-04-15 | Littelfuse, Inc. | Apparatus and method for incorporating surface mount components into connectors |
CN101223677B (zh) * | 2005-07-15 | 2011-06-15 | 泛达公司 | 带有串扰补偿装置的通信连接器 |
DE102005046053B4 (de) * | 2005-09-27 | 2021-11-18 | Robert Bosch Gmbh | Elektrische Vorrichtung mit einer Leiterplatte und einem Bauteil |
JP6227481B2 (ja) * | 2014-05-23 | 2017-11-08 | 日本航空電子工業株式会社 | コネクタ組立体 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL7502006A (nl) * | 1975-02-20 | 1976-08-24 | Du Pont | Werkwijze voor het vervaardigen van een rij, aan een draagstrook bevestigde randopsteek- contacten en rij randopsteekcontacten vervaar- digd volgens deze werkwijze. |
DE3827473A1 (de) * | 1987-09-09 | 1989-03-30 | Siemens Ag | Leiterplatte zum bestuecken mit smd-bausteinen |
US4900279A (en) * | 1989-04-24 | 1990-02-13 | Die Tech, Inc. | Solder terminal |
US5015206A (en) * | 1990-04-05 | 1991-05-14 | Die Tech, Inc. | Solder terminal |
US5090926A (en) * | 1991-02-26 | 1992-02-25 | North American Specialties Corporation | Solderable lead |
US5236628A (en) * | 1991-02-27 | 1993-08-17 | Metallon Engineered Materials Corporation | Noble metal and solid-phase lubricant composition and electrically conductive interconnector |
US5236789A (en) * | 1991-07-01 | 1993-08-17 | Olin Corporation | Palladium alloys having utility in electrical applications |
US5281176A (en) * | 1991-07-22 | 1994-01-25 | Daido Tokushuko Kabushiki Kaisha | Contact member with composite sintered metal paste strip having 1-5 wt % carbon diffusion bonded therein |
-
1993
- 1993-05-14 FR FR9305818A patent/FR2705500B1/fr not_active Expired - Lifetime
-
1994
- 1994-05-06 EP EP94400993A patent/EP0624921B1/de not_active Expired - Lifetime
- 1994-05-06 DE DE69400980T patent/DE69400980T2/de not_active Expired - Lifetime
-
1995
- 1995-07-17 US US08/503,260 patent/US5569056A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US5569056A (en) | 1996-10-29 |
EP0624921A1 (de) | 1994-11-17 |
EP0624921B1 (de) | 1996-11-27 |
FR2705500A1 (fr) | 1994-11-25 |
DE69400980D1 (de) | 1997-01-09 |
FR2705500B1 (fr) | 1995-08-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |