JP2004523912A5 - - Google Patents

Download PDF

Info

Publication number
JP2004523912A5
JP2004523912A5 JP2002570303A JP2002570303A JP2004523912A5 JP 2004523912 A5 JP2004523912 A5 JP 2004523912A5 JP 2002570303 A JP2002570303 A JP 2002570303A JP 2002570303 A JP2002570303 A JP 2002570303A JP 2004523912 A5 JP2004523912 A5 JP 2004523912A5
Authority
JP
Japan
Prior art keywords
die
dies
digital
package
bond wires
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2002570303A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004523912A (ja
Filing date
Publication date
Priority claimed from US09/798,198 external-priority patent/US6472747B2/en
Application filed filed Critical
Publication of JP2004523912A publication Critical patent/JP2004523912A/ja
Publication of JP2004523912A5 publication Critical patent/JP2004523912A5/ja
Withdrawn legal-status Critical Current

Links

JP2002570303A 2001-03-02 2002-02-22 混合アナログおよびデジタル集積回路 Withdrawn JP2004523912A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/798,198 US6472747B2 (en) 2001-03-02 2001-03-02 Mixed analog and digital integrated circuits
PCT/US2002/005405 WO2002071486A2 (en) 2001-03-02 2002-02-22 Mixed analog and digital integrated circuits

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2009000324A Division JP2009152616A (ja) 2001-03-02 2009-01-05 混合アナログおよびデジタル集積回路

Publications (2)

Publication Number Publication Date
JP2004523912A JP2004523912A (ja) 2004-08-05
JP2004523912A5 true JP2004523912A5 (enExample) 2005-12-22

Family

ID=25172776

Family Applications (5)

Application Number Title Priority Date Filing Date
JP2002570303A Withdrawn JP2004523912A (ja) 2001-03-02 2002-02-22 混合アナログおよびデジタル集積回路
JP2009000324A Pending JP2009152616A (ja) 2001-03-02 2009-01-05 混合アナログおよびデジタル集積回路
JP2013169931A Expired - Lifetime JP5931814B2 (ja) 2001-03-02 2013-08-19 混合アナログおよびデジタル集積回路
JP2014148230A Expired - Lifetime JP6537789B2 (ja) 2001-03-02 2014-07-18 混合アナログおよびデジタル集積回路
JP2017176737A Ceased JP2018022903A (ja) 2001-03-02 2017-09-14 混合アナログおよびデジタル集積回路

Family Applications After (4)

Application Number Title Priority Date Filing Date
JP2009000324A Pending JP2009152616A (ja) 2001-03-02 2009-01-05 混合アナログおよびデジタル集積回路
JP2013169931A Expired - Lifetime JP5931814B2 (ja) 2001-03-02 2013-08-19 混合アナログおよびデジタル集積回路
JP2014148230A Expired - Lifetime JP6537789B2 (ja) 2001-03-02 2014-07-18 混合アナログおよびデジタル集積回路
JP2017176737A Ceased JP2018022903A (ja) 2001-03-02 2017-09-14 混合アナログおよびデジタル集積回路

Country Status (10)

Country Link
US (1) US6472747B2 (enExample)
EP (1) EP1407491A2 (enExample)
JP (5) JP2004523912A (enExample)
KR (4) KR20080050638A (enExample)
CN (1) CN100355071C (enExample)
AU (1) AU2002238123A1 (enExample)
BR (1) BR0207798A (enExample)
MY (1) MY122792A (enExample)
TW (1) TWI246737B (enExample)
WO (1) WO2002071486A2 (enExample)

Families Citing this family (111)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6995808B2 (en) * 2002-01-24 2006-02-07 Sige Semiconductor Inc. Television tuner
US6577018B1 (en) * 2000-08-25 2003-06-10 Micron Technology, Inc. Integrated circuit device having reduced bow and method for making same
US7240254B2 (en) * 2000-09-21 2007-07-03 Inapac Technology, Inc Multiple power levels for a chip within a multi-chip semiconductor package
US6812726B1 (en) * 2002-11-27 2004-11-02 Inapac Technology, Inc. Entering test mode and accessing of a packaged semiconductor device
US7444575B2 (en) * 2000-09-21 2008-10-28 Inapac Technology, Inc. Architecture and method for testing of an integrated circuit device
US8176296B2 (en) 2000-10-26 2012-05-08 Cypress Semiconductor Corporation Programmable microcontroller architecture
US6981090B1 (en) * 2000-10-26 2005-12-27 Cypress Semiconductor Corporation Multiple use of microcontroller pad
US7765095B1 (en) 2000-10-26 2010-07-27 Cypress Semiconductor Corporation Conditional branching in an in-circuit emulation system
US8160864B1 (en) 2000-10-26 2012-04-17 Cypress Semiconductor Corporation In-circuit emulator and pod synchronized boot
US8149048B1 (en) 2000-10-26 2012-04-03 Cypress Semiconductor Corporation Apparatus and method for programmable power management in a programmable analog circuit block
US6724220B1 (en) 2000-10-26 2004-04-20 Cyress Semiconductor Corporation Programmable microcontroller architecture (mixed analog/digital)
US6892310B1 (en) * 2000-10-26 2005-05-10 Cypress Semiconductor Corporation Method for efficient supply of power to a microcontroller
US8103496B1 (en) 2000-10-26 2012-01-24 Cypress Semicondutor Corporation Breakpoint control in an in-circuit emulation system
JP3839267B2 (ja) * 2001-03-08 2006-11-01 株式会社ルネサステクノロジ 半導体装置及びそれを用いた通信端末装置
US6680219B2 (en) * 2001-08-17 2004-01-20 Qualcomm Incorporated Method and apparatus for die stacking
SG102637A1 (en) * 2001-09-10 2004-03-26 Micron Technology Inc Bow control in an electronic package
US20030060185A1 (en) * 2001-09-14 2003-03-27 Fisher Richard J. Wireless control and/or data acquisition system in an integrated circuit package
US7313740B2 (en) * 2002-07-25 2007-12-25 Inapac Technology, Inc. Internally generating patterns for testing in an integrated circuit device
US8166361B2 (en) 2001-09-28 2012-04-24 Rambus Inc. Integrated circuit testing module configured for set-up and hold time testing
US8286046B2 (en) 2001-09-28 2012-10-09 Rambus Inc. Integrated circuit testing module including signal shaping interface
US8001439B2 (en) 2001-09-28 2011-08-16 Rambus Inc. Integrated circuit testing module including signal shaping interface
US7406674B1 (en) 2001-10-24 2008-07-29 Cypress Semiconductor Corporation Method and apparatus for generating microcontroller configuration information
US8078970B1 (en) 2001-11-09 2011-12-13 Cypress Semiconductor Corporation Graphical user interface with user-selectable list-box
US8042093B1 (en) 2001-11-15 2011-10-18 Cypress Semiconductor Corporation System providing automatic source code generation for personalization and parameterization of user modules
US7844437B1 (en) 2001-11-19 2010-11-30 Cypress Semiconductor Corporation System and method for performing next placements and pruning of disallowed placements for programming an integrated circuit
US8069405B1 (en) 2001-11-19 2011-11-29 Cypress Semiconductor Corporation User interface for efficiently browsing an electronic document using data-driven tabs
US7774190B1 (en) 2001-11-19 2010-08-10 Cypress Semiconductor Corporation Sleep and stall in an in-circuit emulation system
US7770113B1 (en) 2001-11-19 2010-08-03 Cypress Semiconductor Corporation System and method for dynamically generating a configuration datasheet
US6971004B1 (en) 2001-11-19 2005-11-29 Cypress Semiconductor Corp. System and method of dynamically reconfiguring a programmable integrated circuit
US8103497B1 (en) 2002-03-28 2012-01-24 Cypress Semiconductor Corporation External interface for event architecture
US7308608B1 (en) 2002-05-01 2007-12-11 Cypress Semiconductor Corporation Reconfigurable testing system and method
US7761845B1 (en) 2002-09-09 2010-07-20 Cypress Semiconductor Corporation Method for parameterizing a user module
JP2004111656A (ja) * 2002-09-18 2004-04-08 Nec Electronics Corp 半導体装置及び半導体装置の製造方法
US8063650B2 (en) 2002-11-27 2011-11-22 Rambus Inc. Testing fuse configurations in semiconductor devices
CN100550365C (zh) * 2003-10-10 2009-10-14 Nxp股份有限公司 电子器件及其承载衬底
CN100340970C (zh) * 2004-02-11 2007-10-03 复旦大学 可编程数模混合器
US7295049B1 (en) 2004-03-25 2007-11-13 Cypress Semiconductor Corporation Method and circuit for rapid alignment of signals
US7342310B2 (en) * 2004-05-07 2008-03-11 Avago Technologies General Ip Pte Ltd Multi-chip package with high-speed serial communications between semiconductor die
US7077218B2 (en) * 2004-05-20 2006-07-18 Black & Decker Inc. Motor housing and assembly process for power tool
US7680966B1 (en) 2004-06-29 2010-03-16 National Semiconductor Corporation Memory interface including generation of timing signals for memory operation
US8286125B2 (en) 2004-08-13 2012-10-09 Cypress Semiconductor Corporation Model for a hardware device-independent method of defining embedded firmware for programmable systems
US8069436B2 (en) * 2004-08-13 2011-11-29 Cypress Semiconductor Corporation Providing hardware independence to automate code generation of processing device firmware
US8082531B2 (en) 2004-08-13 2011-12-20 Cypress Semiconductor Corporation Method and an apparatus to design a processing system using a graphical user interface
DE102004049744B4 (de) * 2004-10-13 2009-07-30 Infineon Technologies Ag Schaltungsanordnung
GB2422483B (en) * 2005-01-21 2008-04-16 Artimi Ltd Integrated circuit die connection methods and apparatus
DE602005027804D1 (de) * 2005-02-03 2011-06-16 Texas Instruments Inc Chipverbindungsschnittstelle und Protokoll für gestapelten Halbleiterchip
US7332976B1 (en) 2005-02-04 2008-02-19 Cypress Semiconductor Corporation Poly-phase frequency synthesis oscillator
US8749011B2 (en) * 2005-02-28 2014-06-10 Broadcom Corporation System and method for reducing voltage drops in integrated circuits
JP4748648B2 (ja) * 2005-03-31 2011-08-17 ルネサスエレクトロニクス株式会社 半導体装置
KR101136159B1 (ko) * 2005-04-28 2012-04-17 엘지디스플레이 주식회사 집적회로 및 그를 구비하는 액정표시장치
US7400183B1 (en) 2005-05-05 2008-07-15 Cypress Semiconductor Corporation Voltage controlled oscillator delay cell and method
US8089461B2 (en) 2005-06-23 2012-01-03 Cypress Semiconductor Corporation Touch wake for electronic devices
JP2007036649A (ja) * 2005-07-27 2007-02-08 Orion Denki Kk テレビ放送受信装置
JP4586664B2 (ja) * 2005-07-28 2010-11-24 セイコーエプソン株式会社 半導体装置及び電子機器
US8085067B1 (en) 2005-12-21 2011-12-27 Cypress Semiconductor Corporation Differential-to-single ended signal converter circuit and method
US8710675B2 (en) * 2006-02-21 2014-04-29 Stats Chippac Ltd. Integrated circuit package system with bonding lands
US8067948B2 (en) 2006-03-27 2011-11-29 Cypress Semiconductor Corporation Input/output multiplexer bus
US8537121B2 (en) 2006-05-26 2013-09-17 Cypress Semiconductor Corporation Multi-function slider in touchpad
US8089472B2 (en) * 2006-05-26 2012-01-03 Cypress Semiconductor Corporation Bidirectional slider with delete function
TW200818451A (en) * 2006-06-02 2008-04-16 Renesas Tech Corp Semiconductor device
EP1901085B1 (en) * 2006-09-12 2014-05-28 u-blox AG GNSS Receiver IC package
DE102006044016A1 (de) * 2006-09-15 2008-04-03 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Stapelbare Funktionsschicht für ein modulares mikroelektronisches System
JP2008078367A (ja) * 2006-09-21 2008-04-03 Renesas Technology Corp 半導体装置
US8148816B2 (en) * 2007-01-11 2012-04-03 Nec Corporation Semiconductor device
JP4692503B2 (ja) * 2007-03-23 2011-06-01 セイコーエプソン株式会社 半導体装置及び電子機器
US8130025B2 (en) 2007-04-17 2012-03-06 Cypress Semiconductor Corporation Numerical band gap
US8516025B2 (en) 2007-04-17 2013-08-20 Cypress Semiconductor Corporation Clock driven dynamic datapath chaining
US8026739B2 (en) 2007-04-17 2011-09-27 Cypress Semiconductor Corporation System level interconnect with programmable switching
US8040266B2 (en) 2007-04-17 2011-10-18 Cypress Semiconductor Corporation Programmable sigma-delta analog-to-digital converter
US7737724B2 (en) 2007-04-17 2010-06-15 Cypress Semiconductor Corporation Universal digital block interconnection and channel routing
US8092083B2 (en) 2007-04-17 2012-01-10 Cypress Semiconductor Corporation Temperature sensor with digital bandgap
US9564902B2 (en) * 2007-04-17 2017-02-07 Cypress Semiconductor Corporation Dynamically configurable and re-configurable data path
US9720805B1 (en) 2007-04-25 2017-08-01 Cypress Semiconductor Corporation System and method for controlling a target device
US8065653B1 (en) 2007-04-25 2011-11-22 Cypress Semiconductor Corporation Configuration of programmable IC design elements
US8266575B1 (en) 2007-04-25 2012-09-11 Cypress Semiconductor Corporation Systems and methods for dynamically reconfiguring a programmable system on a chip
JP4940064B2 (ja) * 2007-08-28 2012-05-30 ルネサスエレクトロニクス株式会社 半導体装置
US8049569B1 (en) 2007-09-05 2011-11-01 Cypress Semiconductor Corporation Circuit and method for improving the accuracy of a crystal-less oscillator having dual-frequency modes
JP4973443B2 (ja) * 2007-10-22 2012-07-11 株式会社デンソー センサ装置
US8102062B1 (en) * 2007-12-28 2012-01-24 Sandisk Technologies Inc. Optionally bonding either two sides or more sides of integrated circuits
US8049321B2 (en) 2008-05-30 2011-11-01 Mediatek Inc. Semiconductor device assembly and method thereof
CN101593747B (zh) * 2008-05-30 2011-05-18 联发科技股份有限公司 半导体装置组合及在半导体装置组合中建立电连接的方法
US8471582B2 (en) * 2009-01-27 2013-06-25 Qualcomm Incorporated Circuit for detecting tier-to-tier couplings in stacked integrated circuit devices
JP2010192680A (ja) * 2009-02-18 2010-09-02 Elpida Memory Inc 半導体装置
US7821281B2 (en) * 2009-02-23 2010-10-26 Faraday Technology Corp. Method and apparatus of testing die to die interconnection for system in package
US9448964B2 (en) * 2009-05-04 2016-09-20 Cypress Semiconductor Corporation Autonomous control in a programmable system
CN102208382B (zh) * 2010-03-29 2013-05-22 广达电脑股份有限公司 具有侧边接脚的集成电路封装元件
JP2011243790A (ja) * 2010-05-19 2011-12-01 Panasonic Electric Works Co Ltd 配線方法、並びに、表面に配線が設けられた構造物、半導体装置、配線基板、メモリカード、電気デバイス、モジュール及び多層回路基板
KR20120035297A (ko) * 2010-10-05 2012-04-16 삼성전자주식회사 반도체 패키지 및 이의 제조 방법
US8742597B2 (en) * 2012-06-29 2014-06-03 Intel Corporation Package substrates with multiple dice
JP5959097B2 (ja) 2012-07-03 2016-08-02 ルネサスエレクトロニクス株式会社 半導体装置
US10461799B2 (en) 2012-11-08 2019-10-29 Taiwan Semiconductor Manufacturing Company, Ltd. Integrated transmitter and receiver front end module, transceiver, and related method
WO2014132835A1 (ja) * 2013-02-26 2014-09-04 ピーエスフォー ルクスコ エスエイアールエル 半導体装置
KR102064870B1 (ko) 2013-08-16 2020-02-11 삼성전자주식회사 반도체 패키지
US9343418B2 (en) * 2013-11-05 2016-05-17 Xilinx, Inc. Solder bump arrangements for large area analog circuitry
US9304163B2 (en) * 2013-11-07 2016-04-05 Qualcomm Incorporated Methodology for testing integrated circuits
IN2013CH05121A (enExample) * 2013-11-12 2015-05-29 Sandisk Technologies Inc
US10056352B2 (en) 2014-07-11 2018-08-21 Intel IP Corporation High density chip-to-chip connection
US20160329312A1 (en) * 2015-05-05 2016-11-10 Sean M. O'Mullan Semiconductor chip with offloaded logic
US9929123B2 (en) 2015-06-08 2018-03-27 Analog Devices, Inc. Resonant circuit including bump pads
US9438241B1 (en) 2015-08-31 2016-09-06 Avago Technologies General Ip (Singapore) Pte. Ltd. Multipurpose pads used as digital serial and analog interface
KR102653044B1 (ko) * 2015-09-01 2024-04-01 소니그룹주식회사 적층체
US9520356B1 (en) 2015-09-09 2016-12-13 Analog Devices, Inc. Circuit with reduced noise and controlled frequency
JP2018092690A (ja) * 2016-11-30 2018-06-14 ルネサスエレクトロニクス株式会社 半導体装置および半導体集積システム
US10497669B2 (en) 2016-12-21 2019-12-03 Intel Corporation Hybrid die stacking
TWI607223B (zh) * 2017-03-24 2017-12-01 Press-measuring mechanism for stacked package electronic components and test classification equipment for application thereof
US10163763B1 (en) * 2017-06-23 2018-12-25 Infineon Technologies Ag Integrated circuit package with multi-die communication
US20190371681A1 (en) * 2018-06-01 2019-12-05 Synaptics Incorporated Stacked wafer integrated circuit
TWI686924B (zh) * 2018-10-18 2020-03-01 普誠科技股份有限公司 積體電路及其測試方法
CN111294036A (zh) * 2019-07-17 2020-06-16 锐迪科创微电子(北京)有限公司 焊盘复用装置及电子设备
US11211378B2 (en) * 2019-07-18 2021-12-28 International Business Machines Corporation Heterogeneous integration structure for artificial intelligence computing
CN114720856A (zh) * 2022-04-18 2022-07-08 Oppo广东移动通信有限公司 测试方法、装置、系统及计算机可读介质

Family Cites Families (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59143354A (ja) * 1983-02-04 1984-08-16 Mitsubishi Electric Corp 半導体集積回路装置
JPS61287133A (ja) * 1985-06-13 1986-12-17 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
US4922492A (en) * 1988-05-13 1990-05-01 National Semiconductor Corp. Architecture and device for testable mixed analog and digital VLSI circuits
JPH0360062A (ja) * 1989-07-27 1991-03-15 Nec Ic Microcomput Syst Ltd 半導体集積回路装置
JP2822624B2 (ja) * 1990-07-03 1998-11-11 三菱電機株式会社 非接触icカード
JPH0582717A (ja) * 1991-09-24 1993-04-02 Toshiba Corp 半導体集積回路装置
JPH05145021A (ja) * 1991-11-20 1993-06-11 Yamaha Corp 集積回路装置
US5237698A (en) * 1991-12-03 1993-08-17 Rohm Co., Ltd. Microcomputer
JP3180421B2 (ja) 1992-03-30 2001-06-25 日本電気株式会社 テスト回路を内蔵したアナログ・ディジタル混在マスタ
JPH05284024A (ja) * 1992-04-06 1993-10-29 Oki Electric Ind Co Ltd 半導体集積回路
US5422435A (en) * 1992-05-22 1995-06-06 National Semiconductor Corporation Stacked multi-chip modules and method of manufacturing
JPH05343609A (ja) * 1992-06-04 1993-12-24 Nec Corp 半導体集積回路装置
US5581176A (en) * 1993-05-24 1996-12-03 North American Philips Corporation Analog autonomous test bus framework for testing integrated circuits on a printed circuit board
GB2278689B (en) * 1993-06-02 1997-03-19 Ford Motor Co Method and apparatus for testing integrated circuits
JPH07135468A (ja) * 1993-11-10 1995-05-23 Nec Corp D/aコンバータ装置
JPH08167703A (ja) * 1994-10-11 1996-06-25 Matsushita Electric Ind Co Ltd 半導体装置及びその製造方法、ならびにメモリコアチップ及びメモリ周辺回路チップ
TW280897B (enExample) * 1994-10-27 1996-07-11 Ibm
US5861666A (en) * 1995-08-30 1999-01-19 Tessera, Inc. Stacked chip assembly
JP3578366B2 (ja) * 1995-10-17 2004-10-20 株式会社ルネサステクノロジ 混成集積回路装置
US6014586A (en) * 1995-11-20 2000-01-11 Pacesetter, Inc. Vertically integrated semiconductor package for an implantable medical device
JP3492057B2 (ja) * 1995-12-14 2004-02-03 株式会社日立製作所 マルチチップicカード及びそれを用いたicカードシステム
US5723906A (en) * 1996-06-07 1998-03-03 Hewlett-Packard Company High-density wirebond chip interconnect for multi-chip modules
US6057598A (en) * 1997-01-31 2000-05-02 Vlsi Technology, Inc. Face on face flip chip integration
JPH10256473A (ja) * 1997-03-10 1998-09-25 Sanyo Electric Co Ltd 半導体装置
JP3203200B2 (ja) * 1997-03-10 2001-08-27 三洋電機株式会社 半導体装置
JPH10294423A (ja) * 1997-04-17 1998-11-04 Nec Corp 半導体装置
JP3111312B2 (ja) * 1997-10-29 2000-11-20 ローム株式会社 半導体装置
US5969562A (en) 1997-10-30 1999-10-19 Alesis Studio Electronics, Inc. Low noise method for interconnecting analog and digital integrated circuits
JPH11168185A (ja) * 1997-12-03 1999-06-22 Rohm Co Ltd 積層基板体および半導体装置
KR100253397B1 (ko) * 1997-12-30 2000-04-15 김영환 칩단위 패키지 및 그의 제조방법
JP3481444B2 (ja) * 1998-01-14 2003-12-22 シャープ株式会社 半導体装置及びその製造方法
JPH11220091A (ja) * 1998-02-02 1999-08-10 Toshiba Microelectronics Corp 半導体装置
CA2323964A1 (en) * 1998-03-12 1999-09-16 Hironori Akamatsu Bus selector and integrated circuit system
JPH11355387A (ja) * 1998-06-09 1999-12-24 Hitachi Ltd 半導体集積回路
JP3179420B2 (ja) * 1998-11-10 2001-06-25 日本電気株式会社 半導体装置
US6229227B1 (en) * 1998-12-28 2001-05-08 Kawasaki Steel Corporation Programmable-value on-chip passive components for integrated circuit (IC) chips, and systems utilizing same
JP2000206208A (ja) * 1999-01-20 2000-07-28 Mitsubishi Electric Corp 半導体集積回路装置およびそのテスト方法
JP3876088B2 (ja) * 1999-01-29 2007-01-31 ローム株式会社 半導体チップおよびマルチチップ型半導体装置
US6078539A (en) * 1999-02-04 2000-06-20 Saifun Semiconductors Ltd. Method and device for initiating a memory array during power up
JP3876095B2 (ja) * 1999-05-19 2007-01-31 ローム株式会社 マルチチップ型半導体装置
US6198166B1 (en) * 1999-07-01 2001-03-06 Intersil Corporation Power semiconductor mounting package containing ball grid array
JP2001035146A (ja) * 1999-07-22 2001-02-09 Hitachi Ltd 半導体記憶装置
JP2001185676A (ja) * 1999-12-24 2001-07-06 Sharp Corp 半導体装置
US6369448B1 (en) * 2000-01-21 2002-04-09 Lsi Logic Corporation Vertically integrated flip chip semiconductor package
JP3737333B2 (ja) * 2000-03-17 2006-01-18 沖電気工業株式会社 半導体装置
JP2002057270A (ja) * 2000-08-08 2002-02-22 Sharp Corp チップ積層型半導体装置
US7061154B2 (en) * 2004-03-24 2006-06-13 Honeywell International, Inc. Lightweight wedge design for high speed generators

Similar Documents

Publication Publication Date Title
JP2004523912A5 (enExample)
US7659610B2 (en) Flash memory card
US6388313B1 (en) Multi-chip module
JP2582013B2 (ja) 樹脂封止型半導体装置及びその製造方法
JP5535026B2 (ja) スルーシリコンビア(tsv)ワイヤボンド構造
US8089142B2 (en) Methods and apparatus for a stacked-die interposer
JP2006507686A5 (enExample)
JP2004253805A (ja) 積層型半導体パッケージ及びその製造方法
SG102591A1 (en) Dual loc semiconductor assembly employing floating lead finger structure
JP2009540606A (ja) スタックダイパッケージ
US7411292B2 (en) Flash memory card
WO2007058074A1 (ja) 両面電極パッケージ及びその製造方法
JPH08274128A (ja) 集積回路チップ上の出力パッドを接続する方法と、その方法によって作られたマルチチップモジュール
TW200805620A (en) Method of packaging a plurality of integrated circuit devices and semiconductor package so formed
US7262492B2 (en) Semiconducting device that includes wirebonds
TWM343241U (en) Semiconductor chip package structure
TWI325617B (en) Chip package and method of manufacturing the same
US8975745B2 (en) Packaged microelectronic devices recessed in support member cavities, and associated methods
CN208608197U (zh) 层叠封装结构
JP2007221045A (ja) マルチチップ構造を採用した半導体装置
JPH11289047A (ja) マルチチップモジュールおよびその製造方法
US20070045809A1 (en) Quad flat pack (QFP) package and flexible power distribution method therefor
CN102446881B (zh) 一种通用封装基板及其封装方法
JP2001135668A (ja) 半導体装置およびその製造方法
JP2000269376A (ja) 半導体装置