IN2014KN01462A - - Google Patents

Info

Publication number
IN2014KN01462A
IN2014KN01462A IN1462KON2014A IN2014KN01462A IN 2014KN01462 A IN2014KN01462 A IN 2014KN01462A IN 1462KON2014 A IN1462KON2014 A IN 1462KON2014A IN 2014KN01462 A IN2014KN01462 A IN 2014KN01462A
Authority
IN
India
Prior art keywords
module
recycling
apparatuses
solder removal
metals
Prior art date
Application number
Other languages
English (en)
Inventor
Tianniu Chen
Michael B Korzenski
Ping Jiang
Original Assignee
Advanced Tech Materials
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Tech Materials filed Critical Advanced Tech Materials
Publication of IN2014KN01462A publication Critical patent/IN2014KN01462A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/018—Unsoldering; Removal of melted solder or other residues
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B09—DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
    • B09B—DISPOSAL OF SOLID WASTE NOT OTHERWISE PROVIDED FOR
    • B09B3/00—Destroying solid waste or transforming solid waste into something useful or harmless
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B09—DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
    • B09B—DISPOSAL OF SOLID WASTE NOT OTHERWISE PROVIDED FOR
    • B09B5/00—Operations not covered by a single other subclass or by a single other group in this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
    • B29B17/00—Recovery of plastics or other constituents of waste material containing plastics
    • B29B17/02—Separating plastics from other materials
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B1/00—Preliminary treatment of ores or scrap
    • C22B1/005—Preliminary treatment of scrap
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B11/00—Obtaining noble metals
    • C22B11/04—Obtaining noble metals by wet processes
    • C22B11/042—Recovery of noble metals from waste materials
    • C22B11/046—Recovery of noble metals from waste materials from manufactured products, e.g. from printed circuit boards, from photographic films, paper or baths
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B3/00—Extraction of metal compounds from ores or concentrates by wet processes
    • C22B3/02—Apparatus therefor
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B3/00—Extraction of metal compounds from ores or concentrates by wet processes
    • C22B3/04—Extraction of metal compounds from ores or concentrates by wet processes by leaching
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B4/00—Electrothermal treatment of ores or metallurgical products for obtaining metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B7/00—Working up raw materials other than ores, e.g. scrap, to produce non-ferrous metals and compounds thereof; Methods of a general interest or applied to the winning of more than two metals
    • C22B7/006—Wet processes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25C—PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
    • C25C1/00—Electrolytic production, recovery or refining of metals by electrolysis of solutions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/178—Demolishing, e.g. recycling, reverse engineering, destroying for security purposes; Using biodegradable materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00—Technologies related to metal processing
    • Y02P10/20—Recycling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
    • Y02W30/00—Technologies for solid waste management
    • Y02W30/50—Reuse, recycling or recovery technologies
    • Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Geology (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacture And Refinement Of Metals (AREA)
  • Processing Of Solid Wastes (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
IN1462KON2014 2011-12-15 2012-12-13 IN2014KN01462A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161576035P 2011-12-15 2011-12-15
US201261589583P 2012-01-23 2012-01-23
PCT/US2012/069404 WO2013090517A1 (en) 2011-12-15 2012-12-13 Apparatus and method for stripping solder metals during the recycling of waste electrical and electronic equipment

Publications (1)

Publication Number Publication Date
IN2014KN01462A true IN2014KN01462A (ko) 2015-10-23

Family

ID=48613157

Family Applications (1)

Application Number Title Priority Date Filing Date
IN1462KON2014 IN2014KN01462A (ko) 2011-12-15 2012-12-13

Country Status (12)

Country Link
US (4) US9221114B2 (ko)
EP (1) EP2790845B1 (ko)
JP (2) JP2014529500A (ko)
KR (2) KR101699136B1 (ko)
CN (2) CN106944452A (ko)
AP (1) AP2014007781A0 (ko)
BR (1) BR112014014495A2 (ko)
ES (1) ES2619568T3 (ko)
IN (1) IN2014KN01462A (ko)
SG (2) SG10201604733WA (ko)
TW (4) TW201544164A (ko)
WO (1) WO2013090517A1 (ko)

Families Citing this family (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9919939B2 (en) 2011-12-06 2018-03-20 Delta Faucet Company Ozone distribution in a faucet
SG10201604733WA (en) 2011-12-15 2016-08-30 Entegris Inc Apparatus and method for stripping solder metals during the recycling of waste electrical and electronic equipment
US9765288B2 (en) 2012-12-05 2017-09-19 Entegris, Inc. Compositions for cleaning III-V semiconductor materials and methods of using same
US20140217157A1 (en) * 2013-02-07 2014-08-07 Greene Lyon Group, Inc. Removal of electronic chips and other components from printed wire boards using liquid heat media
TWI471457B (zh) * 2013-02-22 2015-02-01 Uwin Nanotech Co Ltd 金屬剝除添加劑、含其之組合物、及使用該組合物以剝除金屬的方法
DE102013009586A1 (de) 2013-02-26 2014-08-28 Ulrich Loser Hydrometallurgisches Verfahren zur Rückgewinnung von lll-V-, ll-Vl- oder l-lll-Vl2- Verbindungshalbleitermaterialien aus High-Tech- bzw, Green-Tech-Abfällen, bzw. Elektro- und Elektronikabfällen
KR102294726B1 (ko) 2013-03-04 2021-08-30 엔테그리스, 아이엔씨. 티타늄 나이트라이드를 선택적으로 에칭하기 위한 조성물 및 방법
JP6379179B2 (ja) * 2013-04-12 2018-08-22 ウルリッヒ・ローザー 金属含有スクラップから金属を濃縮する方法
SG11201509933QA (en) 2013-06-06 2016-01-28 Advanced Tech Materials Compositions and methods for selectively etching titanium nitride
CN112442374A (zh) 2013-07-31 2021-03-05 恩特格里斯公司 用于去除金属硬掩模和蚀刻后残余物的具有Cu/W相容性的水性制剂
EP2861046B1 (en) * 2013-08-15 2016-11-16 Hitachi Metals, Ltd. Ceramic circuit board manufacturing method, and ceramic circuit board
WO2015031620A1 (en) 2013-08-30 2015-03-05 Advanced Technology Materials, Inc. Compositions and methods for selectively etching titanium nitride
US10340150B2 (en) 2013-12-16 2019-07-02 Entegris, Inc. Ni:NiGe:Ge selective etch formulations and method of using same
WO2015095726A1 (en) 2013-12-20 2015-06-25 Entegris, Inc. Use of non-oxidizing strong acids for the removal of ion-implanted resist
US20160319444A1 (en) 2013-12-20 2016-11-03 Greene Lyon Group, Inc. Method and apparatus for recovery of noble metals, including recovery of noble metals from plated and/or filled scrap
KR102290209B1 (ko) 2013-12-31 2021-08-20 엔테그리스, 아이엔씨. 규소 및 게르마늄을 선택적으로 에칭하기 위한 배합물
TWI659098B (zh) 2014-01-29 2019-05-11 美商恩特葛瑞斯股份有限公司 化學機械研磨後配方及其使用方法
US11127587B2 (en) 2014-02-05 2021-09-21 Entegris, Inc. Non-amine post-CMP compositions and method of use
CN103801554B (zh) * 2014-03-07 2016-07-06 袁志刚 用废旧电子线路板生产粉体材料的方法
MX2016014770A (es) 2014-05-12 2017-05-25 Summit Mining Int Inc Proceso de lixiviado de salmuera para la recuperacion de metales valiosos de materiales de oxido.
TWI521097B (zh) * 2014-06-25 2016-02-11 優勝奈米科技有限公司 剝錫添加劑及其應用
WO2016022755A2 (en) 2014-08-06 2016-02-11 Greene Lyon Group, Inc. Rotational removal of electronic chips and other components from printed wire boards using liquid heat media
RU2610180C2 (ru) * 2014-12-18 2017-02-08 Бочкарёва Ксения Ивановна Способ переработки использованных электронных плат и система для его осуществления
FI20155187A (fi) * 2015-03-18 2016-09-19 Outotec Finland Oy Kullan talteenotto liuoksesta
WO2016168933A1 (en) 2015-04-21 2016-10-27 University Of Saskatchewan Methods for selective leaching and extraction of precious metals in organic solvents
US11136681B2 (en) 2015-06-24 2021-10-05 Greene Lyon Group, Inc. Selective removal of noble metals using acidic fluids, including fluids containing nitrate ions
WO2017037625A1 (en) * 2015-09-02 2017-03-09 Attero Recycling Pvt. Ltd. A method and process of recovering metal values from waste monolithic ceramic capacitors
CN115093008B (zh) 2015-12-21 2024-05-14 德尔塔阀门公司 包括消毒装置的流体输送系统
CA3028584A1 (en) * 2016-06-24 2017-12-28 Enviroleach Technologies Inc. Methods, materials and techniques for precious metal recovery
US10526682B2 (en) 2017-07-17 2020-01-07 Enviroleach Technologies Inc. Methods, materials and techniques for precious metal recovery
KR102045824B1 (ko) * 2017-11-02 2019-11-18 주식회사 라온솔루션 디스플레이 구동칩 리워크 방법 및 이를 이용한 디스플레이 구동칩 자동 리워크 장치
KR20190058758A (ko) * 2017-11-21 2019-05-30 삼성디스플레이 주식회사 식각액 조성물 및 이를 이용한 디스플레이 장치의 제조방법
WO2019107429A1 (ja) * 2017-11-28 2019-06-06 京セラ株式会社 金属回収剤、金属回収液、金属化合物回収方法および金属回収方法
CN108160672A (zh) * 2017-12-25 2018-06-15 武汉大学 一种用于分类回收的微机电系统的拆卸的方法
WO2019168902A1 (en) * 2018-02-28 2019-09-06 Raytheon Company A system and method for reworking a flip chip mounted on an electronic device using a mill to remove the chip and replacing the chip with a new chip in the milled area
CN109609783B (zh) * 2018-12-22 2020-11-10 励福(江门)环保科技股份有限公司 一种从含钯、铑合金的合金片中高效分离提纯钯和铑的方法
JP7268382B2 (ja) * 2019-02-09 2023-05-08 三菱マテリアル株式会社 使用済みリチウムイオン電池の処理方法
JP7430871B2 (ja) * 2019-08-16 2024-02-14 国立大学法人京都大学 スズ含有物からスズを分離する方法
US11666955B2 (en) 2019-09-04 2023-06-06 Jabil Inc. System and method for obtaining mineral rich powder from electronic waste
CN110883396A (zh) * 2019-11-15 2020-03-17 西安居正知识产权运营管理有限公司 一种印刷电路板脱焊分离方法
CN111074078A (zh) * 2019-12-23 2020-04-28 贵州正业工程技术投资有限公司 一种碱性硫脲浸出卡林型金矿的方法
JP6742049B1 (ja) * 2020-06-10 2020-08-19 エー・アンド・エイチ・ジャパン株式会社 有価物の回収方法
CN111826691B (zh) * 2020-08-21 2021-09-21 东北大学 一种溶剂化离子液体制备锌钽合金的方法
AU2021390415A1 (en) * 2020-12-01 2023-07-13 Singapore Polytechnic Method for high and selective extraction of silver
WO2023212815A1 (en) * 2022-05-04 2023-11-09 Seneca Experts-Conseils Inc. Process for extraction of common and precious metals from wasted circuit boards

Family Cites Families (220)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US873583A (en) 1906-12-08 1907-12-10 Charlie M Nichols Polishing-machine.
US1362381A (en) * 1919-08-16 1920-12-14 Steel Works Appliances Company Detinning
US1527076A (en) * 1922-03-02 1925-02-17 Wilbur H Peck Means and apparatus for centrifugal concentration and separation of mixed minerals, metals, etc.
GB299454A (en) * 1927-10-28 1929-01-17 Krupp Ag Improvements in and relating to centrifugal separator drums
US1826755A (en) * 1928-11-16 1931-10-13 Us Metals Refining Company Apparatus for recovering easily-fusible metals
US1861878A (en) * 1928-12-06 1932-06-07 Francisco A Quiroz Separating apparatus
US1858669A (en) * 1930-01-14 1932-05-17 African Tin Recovery Company L Recovery of tin from scrap tinned plate and like tin-carrying material
US2233213A (en) * 1938-11-18 1941-02-25 Laucks I F Inc Fiber-free proteinous adhesive from seed materials
US2704707A (en) * 1954-02-18 1955-03-22 Rca Corp Method of salvaging brazed assemblies
NL237527A (ko) 1958-03-26
US3399090A (en) 1965-04-28 1968-08-27 Fmc Corp Process of etching metal with ammonium persulfate with recovery and recycling
US3498303A (en) * 1966-03-17 1970-03-03 Hewlett Packard Co Apparatus for washing and drying printed circuit boards
NL6814635A (ko) 1968-10-12 1970-04-14
US3625763A (en) * 1968-12-04 1971-12-07 Bunker Ramo Conformal coating stripping method and composition
US3644155A (en) * 1969-05-01 1972-02-22 Fmc Corp Cleaning and brightening of lead-tin alloy-resisted circuit boards
US3947351A (en) 1971-12-22 1976-03-30 Asahi Glass Company, Ltd. Acid diffusion-dialysis process utilizing anion exchange membrane of 4-55 micron thickness
US3866893A (en) * 1974-02-05 1975-02-18 Richard Hoberman Apparatus for desoldering scrap radiator cores and recovering separated metals
US3984090A (en) * 1974-04-02 1976-10-05 Leopold I. Cohen, Jr. Metal recovery method
US3935125A (en) 1974-06-25 1976-01-27 Chemed Corporation Method and composition for inhibiting corrosion in aqueous systems
US3957505A (en) 1974-08-05 1976-05-18 Bayside Refining And Chemical Company Gold reclamation process
US3953265A (en) * 1975-04-28 1976-04-27 International Business Machines Corporation Meniscus-contained method of handling fluids in the manufacture of semiconductor wafers
US4021278A (en) * 1975-12-12 1977-05-03 International Business Machines Corporation Reduced meniscus-contained method of handling fluids in the manufacture of semiconductor wafers
CA1073681A (en) 1976-02-20 1980-03-18 Roman M. Genik-Sas-Berezowsky Recovery of precious metals from metal sulphides
GB1602376A (en) * 1977-06-09 1981-11-11 Encomech Eng Services Ltd Material separation
US4315042A (en) * 1978-07-14 1982-02-09 Hybrid Technology Corporation Solder removal technique
US4270260A (en) * 1978-10-10 1981-06-02 Krueger Ellison F Method for the salvage and restoration of integrated circuits from a substrate
US4344923A (en) * 1978-10-21 1982-08-17 Interox Chemicals Limited In-situ leaching
US4261738A (en) 1979-10-01 1981-04-14 Arthur D. Little, Inc. Process for recovering precious metals from bimetallic material
US4269622A (en) 1979-12-28 1981-05-26 Kerley Jr Bernard J Recovery of precious metals from difficult ores
US4369061A (en) 1979-12-28 1983-01-18 Kerley Jr Bernard J Recovery of precious metals from difficult ores
US4401522A (en) * 1980-09-29 1983-08-30 Micro-Plate, Inc. Plating method and apparatus
US4462879A (en) * 1981-02-24 1984-07-31 Mar Industries, Inc. Gold recovery process
JPS57164984A (en) 1981-04-06 1982-10-09 Metsuku Kk Exfoliating solution for tin or tin alloy
EP0062692B1 (de) * 1981-04-15 1986-12-30 Siemens-Albis Aktiengesellschaft Verfahren und Einrichtung zum Entfernen des Lotes aus den Bohrlöchern von mit Lot beschichteten unbestückten Leiterplatten
US4426225A (en) 1982-09-29 1984-01-17 Storage Technology Corporation Gold recovery method
US4426251A (en) 1982-09-29 1984-01-17 Storage Technology Corporation Portable gold recovery apparatus and method for using same
US4452706A (en) * 1982-11-11 1984-06-05 Interox Chemicals Limited Metals recovery
EP0124213A1 (en) 1983-02-25 1984-11-07 Hydromet Mineral (Uk) Limited Extraction process
US4437928A (en) 1983-08-22 1984-03-20 Dart Industries Inc. Dissolution of metals utilizing a glycol ether
US4541358A (en) * 1983-11-28 1985-09-17 The Htc Corporation Method and apparatus for solder removal
GB8418481D0 (en) 1984-07-19 1984-08-22 Nl Petroleum Prod Rotary drill bits
US4662938A (en) * 1984-10-11 1987-05-05 Whitney John W Recovery of silver and gold
US4661180A (en) * 1985-03-25 1987-04-28 Gte Valeron Corporation Method of making diamond tool
US4654078A (en) 1985-07-12 1987-03-31 Perez Ariel E Method for recovery of precious metals from difficult ores with copper-ammonium thiosulfate
US4637865A (en) 1985-08-16 1987-01-20 Great Lakes Chemical Corporation Process for metal recovery and compositions useful therein
US4668289A (en) 1985-11-22 1987-05-26 Wisconsin Alumni Research Foundation Method for reclaiming gold
GB8609340D0 (en) 1986-04-16 1986-05-21 Imperial College Metal recovery
US4678552A (en) 1986-04-22 1987-07-07 Pennwalt Corporation Selective electrolytic stripping of metal coatings from base metal substrates
US4799616A (en) * 1986-06-11 1989-01-24 International Business Machines Corporation Solder leveling method and apparatus
US4713144A (en) 1986-08-01 1987-12-15 Ardrox Inc. Composition and method for stripping films from printed circuit boards
US4938257A (en) * 1986-11-21 1990-07-03 Teledyne Industries, Inc. Printed circuit cleaning apparatus
US5279803A (en) 1987-01-20 1994-01-18 Ensci, Inc. Precious metal recovery process from carbonaceous ores
US4855572A (en) * 1987-01-23 1989-08-08 Pace Incorporated Heater for use as either primary or auxiliary heat source and improved circuitry for controlling the heater
JPS63215372A (ja) * 1987-03-04 1988-09-07 Toshiba Corp はんだの精製方法
CA1306613C (en) 1987-05-15 1992-08-25 Guy Deschenes Recovery of gold from aqueous solutions
US5137700A (en) 1987-07-02 1992-08-11 Nelson H. Shapiro Processes employing iodine-iodide etching solutions
PL158889B1 (pl) 1989-03-15 1992-10-30 Sposób odzyskiwania zlota i niklu ze zlomu i odpadów elektronicznych PL
US4957653A (en) 1989-04-07 1990-09-18 Macdermid, Incorporated Composition containing alkane sulfonic acid and ferric nitrate for stripping tin or tin-lead alloy from copper surfaces, and method for stripping tin or tin-lead alloy
JP2739495B2 (ja) * 1989-05-12 1998-04-15 日鉱金属株式会社 金含有ヨウ素浸出貴液の浄液方法
US4944851A (en) * 1989-06-05 1990-07-31 Macdermid, Incorporated Electrolytic method for regenerating tin or tin-lead alloy stripping compositions
JPH0331494A (ja) 1989-06-29 1991-02-12 Tokuriki Honten Co Ltd 金属の回収方法およびその装置
US4921571A (en) 1989-07-28 1990-05-01 Macdermid, Incorporated Inhibited composition and method for stripping tin, lead or tin-lead alloy from copper surfaces
JPH0375386A (ja) 1989-08-18 1991-03-29 Metsuku Kk 錫又は錫‐鉛合金の剥離方法
CA2013537A1 (en) 1990-03-30 1991-09-30 Farouk T. Awadalla Recovery of gold from solution by reduction-precipitation with stabilized alkali metal borohydride
US5017267A (en) 1990-07-17 1991-05-21 Macdermid, Incorporated Composition and method for stripping tin or tin-lead alloy from copper surfaces
JPH0575222A (ja) 1991-09-12 1993-03-26 Matsushita Electric Ind Co Ltd 電気回路用印刷配線基板とその識別管理方法と印刷配線基板への符号の形成方法
US5366522A (en) * 1991-11-07 1994-11-22 Sumitomo Electric Industries, Ltd. Polycrystalline diamond cutting tool and method of manufacturing the same
JPH05140769A (ja) 1991-11-15 1993-06-08 Sumitomo Electric Ind Ltd 多結晶ダイヤモンド工具素材及びその工具母材への接合方法
US5217171A (en) 1991-12-06 1993-06-08 F&T Technology Corporation Method for processing scrap of electronic instruments
US5190578A (en) 1991-12-09 1993-03-02 F & T Technology Corporation Method for hydrometallurgical processing of friable concentration products
US5244539A (en) 1992-01-27 1993-09-14 Ardrox, Inc. Composition and method for stripping films from printed circuit boards
US5234542A (en) * 1992-03-04 1993-08-10 Macdermid, Incorporated Composition and process for stripping tin from copper surfaces
US5221421A (en) * 1992-03-25 1993-06-22 Hewlett-Packard Company Controlled etching process for forming fine-geometry circuit lines on a substrate
JP2714520B2 (ja) 1992-08-28 1998-02-16 株式会社日立製作所 実装部品着脱装置
DE4241412C2 (de) * 1992-12-09 1994-10-06 F E S Used Electronics Elektro Anlage zur simultanen Entfernung oberflächenmontierter Bauelemente
FR2705102B1 (fr) 1993-05-12 1995-08-11 Rhone Poulenc Chimie Procede de traitement de compositions contenant des metaux precieux et autres elements de valeur en vue de leur recuperation.
JP2666876B2 (ja) 1993-06-18 1997-10-22 工業技術院長 金の精製方法
US5348588A (en) * 1993-06-29 1994-09-20 Church & Dwight Co., Inc. Evaporative treatment of inorganic saponifier wash water
GB9405418D0 (en) * 1994-03-18 1994-05-04 Apple House Electronics Ltd Solder recovery
US5405430A (en) 1994-04-12 1995-04-11 Groves; William D. Recovery of precious metals from evaporite sediments
KR0145346B1 (ko) 1994-06-10 1998-08-17 케네스 앤. 한 할로겐 염을 이용하여 광물 또는 다른 귀금속 함유물질에서 귀금속을 추출하는 방법
JP3444557B2 (ja) * 1994-06-15 2003-09-08 千住金属工業株式会社 はんだの回収方法およびその装置
US5458281A (en) * 1994-06-30 1995-10-17 International Business Machines Corporation Method for removing meltable material from a substrate
US5672212A (en) * 1994-07-01 1997-09-30 Texas Instruments Incorporated Rotational megasonic cleaner/etcher for wafers
US5520205A (en) * 1994-07-01 1996-05-28 Texas Instruments Incorporated Apparatus for wafer cleaning with rotation
US5552579A (en) 1994-07-11 1996-09-03 Krueger; Ellison System for salvage and restoration on electrical components from a substrate
JP2755225B2 (ja) * 1995-02-10 1998-05-20 日本電気株式会社 部品搭載プリント配線板の分離解体装置
US5715592A (en) 1994-11-08 1998-02-10 Nec Corporation Parts disassembling apparatus
US5542957A (en) 1995-01-27 1996-08-06 South Dakota School Of Mines And Technology Recovery of platinum group metals and rhenium from materials using halogen reagents
US5512201A (en) 1995-02-13 1996-04-30 Applied Chemical Technologies, Inc. Solder and tin stripper composition
US5630554A (en) 1995-02-21 1997-05-20 Dowa Mining Co., Ltd. Method of separating and recovering valuable metals and non-metals from composite materials
US5520794A (en) 1995-05-15 1996-05-28 Elf Atochem North America, Inc. Electrowinning of lead
DE19518277C1 (de) 1995-05-18 1996-05-23 Daimler Benz Ag Verfahren zum Aufbereiten von Schrott aus bestückten Leiterplatten aus Elektro- oder Elektronikgeräten
US5505872A (en) * 1995-05-23 1996-04-09 Applied Electroless Concepts, Inc. Solder stripper recycle and reuse
US5755950A (en) 1995-06-07 1998-05-26 Dulin Metals Company Process for removing plating materials from copper-based substrates
US5911907A (en) 1995-08-30 1999-06-15 Surface Tek Specialty Products, Inc. Composition and method for stripping tin and tin-lead from copper surfaces
US6276589B1 (en) * 1995-09-25 2001-08-21 Speedline Technologies, Inc. Jet soldering system and method
US5707585A (en) * 1996-02-05 1998-01-13 Aea Technology Plc Liquid metal pump and apparatus for use in cleaning and recycling solder
JPH09217133A (ja) 1996-02-13 1997-08-19 Santoku Kinzoku Kogyo Kk 希土類−ニッケル系合金からの有用元素の回収方法
JP3243412B2 (ja) 1996-05-29 2002-01-07 千住金属工業株式会社 プリント基板のはんだ除去方法、はんだ除去装置およびキャリヤー
US5735450A (en) * 1996-06-21 1998-04-07 International Business Machines Corporation Apparatus and method for heating a board-mounted electrical module for rework
JPH1017948A (ja) * 1996-06-27 1998-01-20 Senju Metal Ind Co Ltd プリント基板のはんだ除去方法およびはんだ除去装置
US5938956A (en) * 1996-09-10 1999-08-17 Micron Technology, Inc. Circuit and method for heating an adhesive to package or rework a semiconductor die
JPH10183264A (ja) 1996-12-19 1998-07-14 Matsushita Electric Ind Co Ltd ガラスエポキシ基板からの銅の回収方法
JP3544834B2 (ja) * 1997-03-17 2004-07-21 株式会社東芝 混合廃棄物の処理装置
DE19715319C2 (de) 1997-04-04 2001-03-01 Werner Fabian Dreistufiges hydrometallurgisches Verfahren zur Metallabtrennung von Elektronikschrott insbesondere von Leiterplatten und metallhaltigen Kunststoffrückständen
US5901898A (en) * 1997-05-14 1999-05-11 Easy-Braid Company System for removing solder
JPH1126918A (ja) * 1997-07-01 1999-01-29 Matsushita Electric Ind Co Ltd 回路基板の処理方法および再生方法
JPH1176980A (ja) 1997-09-10 1999-03-23 Hitachi Ltd プリント基板の処理方法
US6258294B1 (en) 1997-10-01 2001-07-10 Morton International, Inc. Composition for stripping solder and tin from printed circuit boards
DE19803692C2 (de) 1998-01-30 2001-02-08 Tobias Marschner Verfahren zum Verwerten von Altplatinen und mit diesem hergestellte Verbundplatte
EP0938944B1 (en) 1998-02-27 2004-11-24 Matsushita Electric Industrial Co., Ltd. Soldering apparatus and method of separating solder and solder oxides
US6083848A (en) * 1998-03-31 2000-07-04 Lsi Logic Corporation Removing solder from integrated circuits for failure analysis
GB2336122A (en) * 1998-04-08 1999-10-13 Ibm Reworking of a ball grid array module
US5979033A (en) * 1998-05-05 1999-11-09 Cleanevi' Engineering Consultant Co., Ltd. Method of recycling waste printed circuit boards
JP3003684B1 (ja) * 1998-09-07 2000-01-31 日本電気株式会社 基板洗浄方法および基板洗浄液
EP1008395A3 (en) 1998-12-11 2003-05-02 Matsushita Electric Industrial Co., Ltd. Method for separating metallic material from waste printed circuit boards, and dry distilation apparatus used for waste treatment
GB9901586D0 (en) * 1999-01-25 1999-03-17 Alpha Fry Ltd Process for the recovery of lead and/or tin or alloys thereof from substrate surfaces
JP4344053B2 (ja) * 1999-11-19 2009-10-14 千住金属工業株式会社 プリント基板のはんだ除去装置
AU2001295097A1 (en) 2000-08-29 2002-03-13 Sasol Technology (Pty) Ltd. Selective recovery of aluminium, cobalt and platinum values from a spent catalyst composition
KR100382848B1 (ko) 2000-09-21 2003-05-09 씨티 리싸이클링 주식회사 폐광미, 폐인쇄회로기판 또는 저품위 광석으로부터의유가금속의 효율적인 회수방법
US6271048B1 (en) 2000-10-20 2001-08-07 Unisys Corporation Process for recycling a substrate from an integrated circuit package
US6638363B2 (en) * 2000-11-22 2003-10-28 Gunter Erdmann Method of cleaning solder paste
US6666370B2 (en) * 2002-01-18 2003-12-23 Speedline Technologies, Inc. Solder-dross mixture separation method and apparatus
US6948650B2 (en) 2001-01-12 2005-09-27 Speedline Technologies, Inc. Dross removal and solder reclamation improvements
JP2002233856A (ja) 2001-02-06 2002-08-20 Narifumi Uemura プリント基板からの金属類の分離方法および装置
US6592680B2 (en) * 2001-03-22 2003-07-15 Agilent Technologies, Inc. Integrated circuit assembly cleaning apparatus and method
US7217312B2 (en) * 2001-04-24 2007-05-15 Corus Aluminium Voerde Gmbh Method of recycling metallic coated scrap pieces
US20020162579A1 (en) * 2001-05-02 2002-11-07 Taiwan Semiconductor Manufacturing Co., Ltd. Wet stripping apparatus and method of using
US6719892B2 (en) * 2001-05-04 2004-04-13 United Technologies Corporation Selective removal of brazing compound from joined assemblies
US6497357B2 (en) * 2001-05-07 2002-12-24 International Business Machines Corporation Apparatus and method for removing interconnections
AUPR552601A0 (en) * 2001-06-07 2001-07-12 Unisearch Limited Selective recovery of precious metal(s)
JP3662522B2 (ja) 2001-06-26 2005-06-22 独立行政法人科学技術振興機構 Ｃｕ抽出用混合溶媒
KR100421937B1 (ko) 2001-07-16 2004-03-12 오치정 폐 인쇄회로기판으로부터 유가금속을 회수하는 방법
US6686202B2 (en) 2001-08-08 2004-02-03 Placer Dome, Inc. Methods for detecting and extracting gold
TWI231831B (en) 2001-10-11 2005-05-01 Shipley Co Llc Stripping solution
US7772043B2 (en) * 2001-12-12 2010-08-10 Sanyo Electric Co., Ltd. Plating apparatus, plating method and manufacturing method for semiconductor device
JP3979464B2 (ja) * 2001-12-27 2007-09-19 株式会社荏原製作所 無電解めっき前処理装置及び方法
CN1385383A (zh) * 2002-06-20 2002-12-18 上海交通大学 废旧计算机的生物法无害化预处理方法
US20040011850A1 (en) * 2002-07-22 2004-01-22 Bayot Arthur Allan Centrifugal apparatus for removing excess solder
US7067090B2 (en) 2002-10-25 2006-06-27 South Dakota School Of Mines And Technology Recovery of platinum group metals
US6986192B2 (en) 2002-12-02 2006-01-17 Fitch Michael K Method for reclamation of precious metals from circuit board scrap
US6716290B1 (en) * 2002-12-04 2004-04-06 The United States Of America As Represented By The Secretary Of The Navy Method for removing soldering flux residue from a substrate
TWI250180B (en) 2003-01-30 2006-03-01 Hsieh-Sen Wu Treatment method of waste containing brominated epoxy resin and glass fiber and it apparatus
US20040155096A1 (en) 2003-02-07 2004-08-12 General Electric Company Diamond tool inserts pre-fixed with braze alloys and methods to manufacture thereof
ITMI20030468A1 (it) * 2003-03-12 2004-09-13 Engitec S R L Processo per recuperare metalli in particolare metalli
US20040181923A1 (en) 2003-03-17 2004-09-23 Dills James Carl Process for reusing and recycling circuit boards
US7000409B2 (en) * 2003-05-23 2006-02-21 Marit Jagtoyen Mazzetti Use of flow through capacitor in the recovery and purification of water from exhaust gases of internal combustion engines
US7473406B2 (en) 2003-05-30 2009-01-06 Council Of Scientific And Industrial Research Process for recovery of palladium from spent catalyst
US7147798B2 (en) * 2003-08-22 2006-12-12 Arch Specialty Chemicals, Inc. Aqueous based metal etchant
US20050089440A1 (en) 2003-10-24 2005-04-28 Kembaiyan Kumar T. Braze alloy
US7267187B2 (en) 2003-10-24 2007-09-11 Smith International, Inc. Braze alloy and method of use for drilling applications
US7285229B2 (en) 2003-11-07 2007-10-23 Mec Company, Ltd. Etchant and replenishment solution therefor, and etching method and method for producing wiring board using the same
US7166145B1 (en) 2004-01-09 2007-01-23 South Dakota School Of Mines And Technology Recovery of precious metals
US20050262967A1 (en) * 2004-05-27 2005-12-01 Alcoa Company Of America Method of recycling brazing sheet
US7316062B2 (en) * 2004-05-27 2008-01-08 Honeywell International Inc. Solder extraction tool and method
JP2008502745A (ja) 2004-06-15 2008-01-31 クロース ザ ループ テクノロジーズ ピーティーワイ リミテッド 電気・電子機器廃棄物（ｗｅｅｅ）の混合流を再生利用する方法
WO2006013568A2 (en) 2004-08-04 2006-02-09 Berg Recycling Industries Ltd. Recovery of precious metals from electronic scrap by hydrometallurgical processing
US7544610B2 (en) 2004-09-07 2009-06-09 International Business Machines Corporation Method and process for forming a self-aligned silicide contact
DE102005007743A1 (de) 2005-01-11 2006-07-20 Merck Patent Gmbh Druckfähiges Medium zur Ätzung von Siliziumdioxid- und Siliziumnitridschichten
WO2006113284A2 (en) 2005-04-13 2006-10-26 Metals Recovery Technology Inc. Process for recovering platinum group metals, rhenium and gold
US7703197B2 (en) 2005-07-01 2010-04-27 Moltion James R Process for depopulating a circuit board
CN100554454C (zh) * 2005-08-04 2009-10-28 株式会社神钢环境舒立净 从废弃液晶显示器中的铟的回收方法及其装置
JP5095094B2 (ja) 2005-09-29 2012-12-12 パナソニック株式会社 電気電子機器用回路基板から金属を回収する方法
CN100540163C (zh) 2005-11-17 2009-09-16 深圳市格林美高新技术股份有限公司 汽车和电子废弃金属的回收工艺
WO2007077594A1 (ja) * 2005-12-28 2007-07-12 Fujitsu Limited はんだ除去装置、はんだ除去方法
CN100592939C (zh) 2006-01-20 2010-03-03 巫协森 回收废弃印刷电路板的方法
TWI268184B (en) 2006-01-20 2006-12-11 Hsieh-Sen Wu Recycling method for waste printed circuit board brominated epoxy resin and glass fiber in the resin are recycled and converted into raw material for industry
AU2007236501B2 (en) 2006-04-07 2013-05-09 Metal Asia International Ltd. Precious metal recovery from solution
US20070253179A1 (en) 2006-04-27 2007-11-01 Briggs Randall D Method and apparatus for removing surface mount device from printed circuit board
US7618891B2 (en) 2006-05-01 2009-11-17 International Business Machines Corporation Method for forming self-aligned metal silicide contacts
CN1858277A (zh) 2006-05-25 2006-11-08 东华大学 印刷电路板中提取金属的方法
FR2907352B1 (fr) 2006-10-20 2009-02-20 Terra Nova Procede de traitement de dechets contenant des metaux precieux et dispositif pour la mise en oeuvre de ce procede.
US20080206960A1 (en) 2007-02-27 2008-08-28 International Business Machines Corporation Reworkable chip stack
US8814980B2 (en) 2007-05-03 2014-08-26 Drinkard Metalox, Inc Method of recovering metal values from nickel-containing ores
US7964015B2 (en) 2007-05-23 2011-06-21 Contact Marketing Solutions, Llc Metal extraction without cyanide
CN100543159C (zh) * 2007-09-19 2009-09-23 中国科学院过程工程研究所 一种化学溶涨强化机械破碎线路板的方法
KR100889315B1 (ko) 2007-11-16 2009-03-18 한국지질자원연구원 유기용액을 이용한 폐인쇄회로기판으로부터 금속을회수하는 방법
US7681778B2 (en) * 2007-11-20 2010-03-23 Caterpillar Inc. Electronic assembly remanufacturing system and method
CN102084013A (zh) 2008-04-14 2011-06-01 詹姆斯·R·阿克瑞奇 从电子废料等废物中可持续回收金属化合物的湿化学方法
CN101260469A (zh) * 2008-04-21 2008-09-10 上海大学 从含铂铑的废料中回收提纯铂铑的方法
CN101270411A (zh) 2008-04-23 2008-09-24 北京正康创智科技发展有限公司 从废电路板中回收铜金属的方法
US7886422B1 (en) * 2008-06-07 2011-02-15 Magnecomp Corporation Ultrasonic reclaim method for disk drive suspensions
EP2303462A4 (en) 2008-06-11 2014-01-01 Thomas A Valerio METHOD AND SYSTEM FOR RECYCLING METAL FROM PROCESSED RECYCLED MATERIALS
UA101053C2 (ru) 2008-08-20 2013-02-25 Пи-Фьюел Лтд Способ утилизации электрического и электронного оборудования
FR2938457B1 (fr) 2008-11-14 2011-01-07 Terra Nova Procede de recuperation des metaux contenus dans les dechets electroniques
JP5396879B2 (ja) * 2009-01-23 2014-01-22 株式会社リコー はんだ回収装置
JP2010236080A (ja) * 2009-03-13 2010-10-21 Japan Atomic Energy Agency 金イオン吸着剤と金イオン吸着方法並びに金の回収剤と金の回収方法
DK2411196T3 (da) 2009-03-14 2013-03-18 Alexander Koslow Recycling-fremgangsmåde til elektronikskrot til udvinding af genanvendelige materialer ved at undgå en frigørelse af skadelige stoffer
CN101537522B (zh) * 2009-03-20 2011-07-20 湖南万容科技有限公司 废印制电路板电子元器件拆解与焊锡回收方法及设备
US20120067170A1 (en) 2009-04-24 2012-03-22 Precious Metals Recovery Pty Ltd Extraction of gold from cathode associated gold concentrates
TW201041668A (en) * 2009-05-27 2010-12-01 xie-sen Wu Pyrolysis method of recycled substrate of printed circuit board and device thereof
US8757523B2 (en) 2009-07-31 2014-06-24 Thomas Valerio Method and system for separating and recovering wire and other metal from processed recycled materials
US20110024201A1 (en) 2009-07-31 2011-02-03 Danny Eugene Scott Polycrystalline diamond composite compact elements and tools incorporating same
CN101623698A (zh) 2009-08-13 2010-01-13 中南大学 一种综合回收利用废旧印刷电路板的方法
US8486281B2 (en) 2009-10-05 2013-07-16 Kesheng Feng Nickel-chromium alloy stripper for flexible wiring boards
US20120274008A1 (en) * 2009-10-27 2012-11-01 Akridge James R Oxygen torch reclamation of metals with nitric acid recovery
CN101708500B (zh) * 2009-12-25 2011-08-10 陆刚萍 废旧家电无害化资源化回收方法
US8936770B2 (en) 2010-01-22 2015-01-20 Molycorp Minerals, Llc Hydrometallurgical process and method for recovering metals
US8167189B2 (en) * 2010-03-30 2012-05-01 Lockheed Martin Corporation Methods for rework of a solder
TWI568859B (zh) * 2010-04-15 2017-02-01 恩特葛瑞斯股份有限公司 廢棄印刷電路板之回收利用方法
WO2012021120A1 (en) 2010-08-09 2012-02-16 Empire Technology Development Llc Removing and segregating components from printed circuit boards
BR112013003854A2 (pt) 2010-08-20 2016-06-07 Advanced Tech Materials processo sustentável para reivindicação de metais preciosos e metais de base oriundo de resíduo e
CN102441553B (zh) 2010-10-12 2014-07-02 深圳市格林美高新技术股份有限公司 一种从贵金属电子废料回收贵金属的方法及设备
CN201895152U (zh) * 2010-11-15 2011-07-13 深圳市格林美高新技术股份有限公司 一种脱焊设备
WO2012104806A1 (en) 2011-02-03 2012-08-09 Western Platinum Ltd Refining of platinum group metals concentrates
CN102676822B (zh) 2011-03-11 2014-01-01 深圳市格林美高新技术股份有限公司 一种免焚烧无氰化处理废旧印刷电路板的方法
US8925170B2 (en) * 2011-04-22 2015-01-06 International Business Machines Corporation Method for removing an electronic component from a substrate
EP2705168A4 (en) * 2011-05-02 2015-04-29 Trimetals Mining Inc PROCESS FOR THE RECOVERY OF INDIUM, SILVER, GOLD AND OTHER RARE, PRECIOUS AND BASE METALS FROM COMPLEX OXIDE OR SULPHIDE ORES
TWI426157B (zh) 2011-05-18 2014-02-11 Uwin Nanotech Co Ltd 剝金組成物以及使用方法
US8739708B2 (en) 2011-06-30 2014-06-03 Yuriy Rabiner Method and plant for processing contaminated waste
US9150942B2 (en) 2011-08-15 2015-10-06 Her Majesty The Queen In Righat Of Canada As Represented By The Minister Of Natural Resources Canada Process of leaching precious metals
EP2751296A1 (en) 2011-09-01 2014-07-09 Dedek, Petr Method for the removal and recovery of metals and precious metals from substrates
SG10201604733WA (en) 2011-12-15 2016-08-30 Entegris Inc Apparatus and method for stripping solder metals during the recycling of waste electrical and electronic equipment
US9482056B2 (en) * 2011-12-30 2016-11-01 Smith International, Inc. Solid PCD cutter
EP2662464A1 (en) 2012-05-09 2013-11-13 Inter-Euro Technology Limited Gold recovery
TW201411690A (zh) 2012-09-13 2014-03-16 Saint Gobain Ceramics 回收的晶圓以及用於回收晶圓之方法
US20140217157A1 (en) * 2013-02-07 2014-08-07 Greene Lyon Group, Inc. Removal of electronic chips and other components from printed wire boards using liquid heat media
TWI471457B (zh) 2013-02-22 2015-02-01 Uwin Nanotech Co Ltd 金屬剝除添加劑、含其之組合物、及使用該組合物以剝除金屬的方法
US9228247B2 (en) * 2013-09-11 2016-01-05 Antaya Technologies Corporation Solder recovery unit

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KR101699136B1 (ko) 2017-01-23
JP6397946B2 (ja) 2018-09-26
AP2014007781A0 (en) 2014-07-31
EP2790845A4 (en) 2015-07-08
CN103402659A (zh) 2013-11-20
US9221114B2 (en) 2015-12-29
BR112014014495A2 (pt) 2017-06-13
CN106914470A (zh) 2017-07-04
TW201345601A (zh) 2013-11-16
SG10201604733WA (en) 2016-08-30
TW201544166A (zh) 2015-12-01
EP2790845A1 (en) 2014-10-22
ES2619568T3 (es) 2017-06-26

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