HUP0300498A3 - Silver containing copper alloy - Google Patents

Silver containing copper alloy

Info

Publication number
HUP0300498A3
HUP0300498A3 HU0300498A HUP0300498A HUP0300498A3 HU P0300498 A3 HUP0300498 A3 HU P0300498A3 HU 0300498 A HU0300498 A HU 0300498A HU P0300498 A HUP0300498 A HU P0300498A HU P0300498 A3 HUP0300498 A3 HU P0300498A3
Authority
HU
Hungary
Prior art keywords
copper alloy
containing copper
silver containing
silver
alloy
Prior art date
Application number
HU0300498A
Other languages
English (en)
Original Assignee
Olin Corp Clayton
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olin Corp Clayton filed Critical Olin Corp Clayton
Publication of HUP0300498A2 publication Critical patent/HUP0300498A2/hu
Publication of HUP0300498A3 publication Critical patent/HUP0300498A3/hu
Publication of HU227988B1 publication Critical patent/HU227988B1/hu

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Conductive Materials (AREA)
  • Contacts (AREA)
  • Adornments (AREA)
  • Laminated Bodies (AREA)
  • Extrusion Of Metal (AREA)
  • Dental Preparations (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Wire Processing (AREA)
HU0300498A 2000-08-09 2001-08-07 Silver containing copper alloy HU227988B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US22405400P 2000-08-09 2000-08-09
PCT/US2001/024854 WO2002012583A1 (en) 2000-08-09 2001-08-07 Silver containing copper alloy

Publications (3)

Publication Number Publication Date
HUP0300498A2 HUP0300498A2 (hu) 2003-09-29
HUP0300498A3 true HUP0300498A3 (en) 2005-04-28
HU227988B1 HU227988B1 (en) 2012-07-30

Family

ID=22839111

Family Applications (2)

Application Number Title Priority Date Filing Date
HU0300498A HU227988B1 (en) 2000-08-09 2001-08-07 Silver containing copper alloy
HU0600421A HU228707B1 (en) 2000-08-09 2001-08-07 Method for producing copper alloy band or bar

Family Applications After (1)

Application Number Title Priority Date Filing Date
HU0600421A HU228707B1 (en) 2000-08-09 2001-08-07 Method for producing copper alloy band or bar

Country Status (16)

Country Link
US (2) US6749699B2 (hu)
EP (1) EP1179606B1 (hu)
JP (2) JP2002180159A (hu)
KR (1) KR100842726B1 (hu)
CN (2) CN1302145C (hu)
AT (1) ATE252651T1 (hu)
AU (1) AU2001284756A1 (hu)
CA (1) CA2416574C (hu)
DE (1) DE60101026T2 (hu)
ES (1) ES2204790T3 (hu)
HK (1) HK1042732B (hu)
HU (2) HU227988B1 (hu)
MX (1) MXPA03000958A (hu)
PL (1) PL196643B1 (hu)
TW (1) TWI237665B (hu)
WO (1) WO2002012583A1 (hu)

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US6703308B1 (en) 2001-11-26 2004-03-09 Advanced Micro Devices, Inc. Method of inserting alloy elements to reduce copper diffusion and bulk diffusion
US6835655B1 (en) 2001-11-26 2004-12-28 Advanced Micro Devices, Inc. Method of implanting copper barrier material to improve electrical performance
US6861349B1 (en) 2002-05-15 2005-03-01 Advanced Micro Devices, Inc. Method of forming an adhesion layer with an element reactive with a barrier layer
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JP6265582B2 (ja) * 2011-12-22 2018-01-24 古河電気工業株式会社 銅合金材およびその製造方法
JP5802150B2 (ja) * 2012-02-24 2015-10-28 株式会社神戸製鋼所 銅合金
WO2014007259A1 (ja) * 2012-07-02 2014-01-09 古河電気工業株式会社 銅合金線材及びその製造方法
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JP5525101B2 (ja) * 2012-10-22 2014-06-18 Ｊｘ日鉱日石金属株式会社 導電性及び応力緩和特性に優れる銅合金板
JP5718426B2 (ja) * 2012-10-31 2015-05-13 古河電気工業株式会社 銅箔、非水電解質二次電池用負極および非水電解質二次電池
JP5952726B2 (ja) * 2012-12-10 2016-07-13 株式会社神戸製鋼所 銅合金
CN103805802A (zh) * 2014-01-09 2014-05-21 东莞市共民实业有限公司 用于超微细铜漆包线的铜银合金及其生产工艺
DE102014018061B4 (de) * 2014-12-05 2024-06-20 Wieland-Werke Ag Metallischer Verbundwerkstoff und Herstellverfahren
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CN104561487B (zh) * 2015-01-23 2016-08-17 海安县恒昌金属压延有限公司 一种稀土锌铜钛合金带材的形变热处理工艺
JP6611222B2 (ja) * 2015-02-24 2019-11-27 株式会社神戸製鋼所 高強度、高導電率で耐応力緩和特性に優れた電気電子部品用銅合金板及びその製造方法
KR101883608B1 (ko) 2015-03-23 2018-07-30 가부시끼가이샤 도시바 영구 자석, 모터 및 발전기
JP2016211054A (ja) * 2015-05-12 2016-12-15 株式会社神戸製鋼所 銅合金
CN105349819B (zh) * 2015-11-26 2017-11-28 山西春雷铜材有限责任公司 一种高强高导铜合金板带的制备方法
CN107716885B (zh) * 2016-08-12 2019-09-10 北京科技大学 一种高强高导铜合金带材短流程生产方法
KR102075199B1 (ko) * 2017-03-31 2020-02-07 주식회사 솔루에타 구리합금 제조방법 및 구리합금을 원료로 하는 호일 제조방법
CN107377657A (zh) * 2017-06-14 2017-11-24 绍兴市力博电气有限公司 一种磁极线圈用铜材及其生产方法
CN111108222A (zh) 2017-08-10 2020-05-05 田中贵金属工业株式会社 高强度且高导电性铜合金板材及其制造方法
CN107755451B (zh) * 2017-09-30 2019-02-12 重庆鸽牌电线电缆有限公司 大容量调相机用含银铜排的制备方法
CN107739878B (zh) * 2017-11-23 2019-10-18 全南晶环科技有限责任公司 一种高强高导抗软化铜合金及其制备方法
CN109226323A (zh) * 2018-09-11 2019-01-18 安徽楚江科技新材料股份有限公司 一种极耳铜带的冷轧热处理工艺
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KR20210149830A (ko) * 2019-04-12 2021-12-09 마테리온 코포레이션 고 강도 및 고 전도도를 갖는 구리 합금 및 이러한 구리 합금의 제조 방법
CN111014286B (zh) * 2019-12-12 2022-04-26 西安圣泰金属材料有限公司 一种基于织构调控的高扭转性能钛合金丝制备方法
CN111118335B (zh) * 2020-01-17 2022-04-08 河北中泊防爆工具集团股份有限公司 一种钛青铜合金材料及其制备方法和应用
CN111690838B (zh) * 2020-06-22 2021-10-15 宁波金田铜业(集团)股份有限公司 一种易绕制变压器用紫铜带材及其制备方法
CN111996411B (zh) * 2020-07-15 2021-11-30 宁波博威合金板带有限公司 一种高强高导铜合金材料及其制备方法和应用
CN112322917A (zh) * 2020-10-16 2021-02-05 山西春雷铜材有限责任公司 一种Cu-Cr-Si-Ti铜合金板带的制备方法
CN112680623A (zh) * 2021-01-08 2021-04-20 北京中超伟业信息安全技术股份有限公司 一种低辐射高强高导铜合金线材及其制备方法和应用
CN113913642B (zh) * 2021-09-26 2022-07-05 宁波博威合金板带有限公司 一种铜合金带材及其制备方法
CN114507830A (zh) * 2022-01-20 2022-05-17 浙江力博实业股份有限公司 一种高强高导铜铬银合金的制造方法
CN115171973B (zh) * 2022-06-30 2023-03-03 上海超导科技股份有限公司 铜银合金加强的超导带材、加强方法及超导线圈
CN115125413B (zh) * 2022-06-30 2023-08-01 宁波金田铜业(集团)股份有限公司 一种综合性能优异的铜合金带材及其制备方法

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Also Published As

Publication number Publication date
US20040159379A1 (en) 2004-08-19
MXPA03000958A (es) 2004-08-02
WO2002012583A1 (en) 2002-02-14
HUP0300498A2 (hu) 2003-09-29
US20020039542A1 (en) 2002-04-04
PL365670A1 (en) 2005-01-10
CA2416574C (en) 2011-05-31
HK1042732B (zh) 2004-04-23
ES2204790T3 (es) 2004-05-01
KR20030031139A (ko) 2003-04-18
AU2001284756A1 (en) 2002-02-18
EP1179606A3 (en) 2002-08-14
HU228707B1 (en) 2013-05-28
JP5847987B2 (ja) 2016-01-27
DE60101026D1 (de) 2003-11-27
US6749699B2 (en) 2004-06-15
ATE252651T1 (de) 2003-11-15
TWI237665B (en) 2005-08-11
KR100842726B1 (ko) 2008-07-01
JP2008057046A (ja) 2008-03-13
CN1455823A (zh) 2003-11-12
JP2002180159A (ja) 2002-06-26
HK1042732A1 (en) 2002-08-23
PL196643B1 (pl) 2008-01-31
HU227988B1 (en) 2012-07-30
HU0600421D0 (en) 2006-07-28
DE60101026T2 (de) 2004-04-22
EP1179606B1 (en) 2003-10-22
EP1179606A2 (en) 2002-02-13
CN101012519A (zh) 2007-08-08
CN1302145C (zh) 2007-02-28
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