HK1044570A1 - 銅合金 - Google Patents

銅合金

Info

Publication number
HK1044570A1
HK1044570A1 HK02106354.5A HK02106354A HK1044570A1 HK 1044570 A1 HK1044570 A1 HK 1044570A1 HK 02106354 A HK02106354 A HK 02106354A HK 1044570 A1 HK1044570 A1 HK 1044570A1
Authority
HK
Hong Kong
Prior art keywords
copper alloy
alloy
copper
Prior art date
Application number
HK02106354.5A
Other languages
English (en)
Inventor
阿肖克‧K‧巴爾加瓦
Original Assignee
沃特伯里軋機公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 沃特伯里軋機公司 filed Critical 沃特伯里軋機公司
Publication of HK1044570A1 publication Critical patent/HK1044570A1/zh

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)
  • Contacts (AREA)
  • Powder Metallurgy (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
HK02106354.5A 1999-06-07 2002-08-28 銅合金 HK1044570A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/325,036 US6241831B1 (en) 1999-06-07 1999-06-07 Copper alloy
PCT/US2000/014028 WO2000075392A1 (en) 1999-06-07 2000-05-19 Copper alloy

Publications (1)

Publication Number Publication Date
HK1044570A1 true HK1044570A1 (zh) 2002-10-25

Family

ID=23266159

Family Applications (1)

Application Number Title Priority Date Filing Date
HK02106354.5A HK1044570A1 (zh) 1999-06-07 2002-08-28 銅合金

Country Status (13)

Country Link
US (2) US6241831B1 (zh)
EP (1) EP1063309A3 (zh)
JP (1) JP2003501554A (zh)
KR (1) KR20010093083A (zh)
CN (1) CN1182271C (zh)
AU (1) AU4858800A (zh)
BR (1) BR0007604A (zh)
CA (1) CA2346635A1 (zh)
HK (1) HK1044570A1 (zh)
HU (1) HUP0104203A3 (zh)
MX (1) MXPA01005075A (zh)
PL (1) PL193301B1 (zh)
WO (1) WO2000075392A1 (zh)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6749699B2 (en) * 2000-08-09 2004-06-15 Olin Corporation Silver containing copper alloy
SE522583C2 (sv) * 2000-11-22 2004-02-24 Emerson Energy Systems Ab Förbindelseelement av metall för förbindelse mellan elkraftsfördelningsmoduler
JP2002319550A (ja) * 2001-04-23 2002-10-31 Sony Corp 金属膜の形成方法および半導体装置の製造方法
US20030188615A1 (en) * 2002-04-03 2003-10-09 3M Innovative Properties Company Angled product transfer conveyor
JP2004353011A (ja) * 2003-05-27 2004-12-16 Ykk Corp 電極材料及びその製造方法
JP4441467B2 (ja) * 2004-12-24 2010-03-31 株式会社神戸製鋼所 曲げ加工性及び耐応力緩和特性を備えた銅合金
KR101125525B1 (ko) * 2008-10-20 2012-03-23 한국생산기술연구원 크롬을 함유하지 않는 고전기전도도 및 고강도 동합금 및 그 제조방법
US20110123643A1 (en) * 2009-11-24 2011-05-26 Biersteker Robert A Copper alloy enclosures
RU2637869C2 (ru) * 2013-03-15 2017-12-07 Мэтерион Корпорейшн Равномерный размер зерен в горячеобработанном спинодальном сплаве
CN103773989B (zh) * 2014-03-04 2015-11-04 南京信息工程大学 一种铁磁元素钆改性的导电铜材料及制备方法
CN104232984B (zh) * 2014-09-25 2016-06-22 江苏鑫成铜业有限公司 一种制备高耐蚀铜合金的方法
CN104711449A (zh) * 2015-04-03 2015-06-17 北京金鹏振兴铜业有限公司 微合金化铜镁合金
CN105463236A (zh) * 2015-12-02 2016-04-06 芜湖楚江合金铜材有限公司 一种高效能复合铜合金线材及其加工工艺
CN105543533B (zh) * 2015-12-14 2017-06-20 中南大学 一种高强度高导电率铜镁系合金及其制备方法
CN105382797A (zh) * 2015-12-23 2016-03-09 常熟市三荣装饰材料有限公司 五金工具箱
RU2677902C1 (ru) * 2017-12-27 2019-01-22 Федеральное государственное автономное образовательное учреждение высшего образования "Белгородский государственный национальный исследовательский университет" (НИУ "БелГУ") Высокопрочный медный сплав
CN116083750A (zh) * 2023-03-10 2023-05-09 江西铜业集团有限公司 一种铜合金带材及制备方法、引线框架和连接器

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2171697A (en) 1939-03-09 1939-09-05 Mallory & Co Inc P R Alloy
US3677745A (en) 1969-02-24 1972-07-18 Cooper Range Co Copper base composition
JPS5832220B2 (ja) 1976-08-09 1983-07-12 古河電気工業株式会社 耐軟化性銅合金
GB1562870A (en) 1977-03-09 1980-03-19 Louyot Comptoir Lyon Alemand Copper alloys
JPS5547337A (en) 1978-10-02 1980-04-03 Hitachi Cable Ltd Heat resisting highly conductive copper alloy
JPS58199835A (ja) * 1982-05-19 1983-11-21 Sumitomo Electric Ind Ltd 電気又は電子機器用銅合金
JPS59232244A (ja) * 1983-06-16 1984-12-27 Mitsui Mining & Smelting Co Ltd 耐軟化高伝導性銅合金
US4605532A (en) 1984-08-31 1986-08-12 Olin Corporation Copper alloys having an improved combination of strength and conductivity
JPS6160846A (ja) 1984-08-31 1986-03-28 Tamagawa Kikai Kinzoku Kk 半導体装置用銅合金リ−ド材
IT1196620B (it) 1986-09-11 1988-11-16 Metalli Ind Spa Lega metallica a base di rame di tipo perfezionato,particolarmente per la costruzione di componenti elettronici
US4908275A (en) 1987-03-04 1990-03-13 Nippon Mining Co., Ltd. Film carrier and method of manufacturing same
JPH01263238A (ja) * 1988-04-12 1989-10-19 Sumitomo Metal Mining Co Ltd 高強度高導電性銅合金
JPH0673474A (ja) 1992-08-27 1994-03-15 Kobe Steel Ltd 強度、導電率及び耐マイグレーション性が優れた銅合金
JP3796784B2 (ja) 1995-12-01 2006-07-12 三菱伸銅株式会社 コネクタ製造用銅合金薄板およびその薄板で製造したコネクタ
US5820701A (en) * 1996-11-07 1998-10-13 Waterbury Rolling Mills, Inc. Copper alloy and process for obtaining same
JP3418301B2 (ja) * 1997-01-09 2003-06-23 古河電気工業株式会社 打抜加工性に優れた電気電子機器用銅合金
US5868877A (en) * 1997-07-22 1999-02-09 Olin Corporation Copper alloy having improved stress relaxation
JPH1180863A (ja) * 1997-09-10 1999-03-26 Kobe Steel Ltd 耐応力緩和特性及びばね性が優れた銅合金
US5893953A (en) * 1997-09-16 1999-04-13 Waterbury Rolling Mills, Inc. Copper alloy and process for obtaining same
US6632300B2 (en) 2000-06-26 2003-10-14 Olin Corporation Copper alloy having improved stress relaxation resistance

Also Published As

Publication number Publication date
BR0007604A (pt) 2002-01-08
HUP0104203A2 (hu) 2002-04-29
CN1182271C (zh) 2004-12-29
JP2003501554A (ja) 2003-01-14
PL193301B1 (pl) 2007-01-31
HUP0104203A3 (en) 2003-05-28
CN1353774A (zh) 2002-06-12
US6241831B1 (en) 2001-06-05
WO2000075392A1 (en) 2000-12-14
AU4858800A (en) 2000-12-28
EP1063309A2 (en) 2000-12-27
US20010009168A1 (en) 2001-07-26
CA2346635A1 (en) 2000-12-14
US6689232B2 (en) 2004-02-10
KR20010093083A (ko) 2001-10-27
MXPA01005075A (es) 2002-04-24
EP1063309A3 (en) 2002-09-18
PL353734A1 (en) 2003-12-01

Similar Documents

Publication Publication Date Title
GB2359822B (en) Copper alloy sliding material
EP1038981A4 (en) COPPER-BASED DECOLLETING ALLOY
GB2355016B (en) Sliding material of copper alloy
HUP0300498A3 (en) Silver containing copper alloy
EP1045041A4 (en) LEAD-FREE AUTOMATIC COPPER ALLOY
IL145465A0 (en) Coated hard alloy
EP1154027A4 (en) HEAT-RESISTANT ALLOY WIRE
IL128067A0 (en) Iron-cobalt alloy
EP1165849A4 (en) ALLOY MATERIALS
AU4247100A (en) Soldering alloy
PL353734A1 (en) Copper alloy
SG111021A1 (en) Pb-free soldering alloy
HK1040066A1 (en) Cobalt-chromium-palladium-base brazing alloys
EP1205972A4 (en) COPPER CONDUCTOR
AU2000277195A1 (en) Copper electrowinning
HK1045718A1 (en) Iron-nickel alloy
GB2367834B (en) Solder alloy
GB9926675D0 (en) Aluminium alloy
GB9923965D0 (en) Metal casting
GB0017057D0 (en) High-temperature alloy
PL333444A1 (en) Novel copper alloy
GB2351503B (en) Alloy plating
GB9826627D0 (en) Alloy
GB9924161D0 (en) Copper tubing
HUP0003083A3 (en) Metal rack