BR0007604A - Liga à base de cobre e processo para formar uma liga à base de cobre - Google Patents
Liga à base de cobre e processo para formar uma liga à base de cobreInfo
- Publication number
- BR0007604A BR0007604A BR0007604-0A BR0007604A BR0007604A BR 0007604 A BR0007604 A BR 0007604A BR 0007604 A BR0007604 A BR 0007604A BR 0007604 A BR0007604 A BR 0007604A
- Authority
- BR
- Brazil
- Prior art keywords
- copper
- weight
- amount
- magnesium
- phosphorus
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Conductive Materials (AREA)
- Contacts (AREA)
- Powder Metallurgy (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
Abstract
"LIGA à BASE DE COBRE, E, PROCESSO PARA FORMAR UMA LIGA à BASE DE COBRE". A presente invenção diz respeito a ligas de cobre-magnésio-fósforo. Em uma primeira modalidade, as ligas de cobre-magnésio-fósforo de acordo com a presente invenção contêm magnésio em uma quantidade de cerca de 0,01 a cerca de 0,25% em peso, fósforo em uma quantidade de cerca de 0,01 a cerca de 0,2% em peso, prata em uma quantidade de cerca de 0,001 a cerca de 0, 1 % em peso, ferro em uma quantidade de cerca de 0,0 1 % a cerca de 0,25% em peso, e o cobre de equilibrio e impurezas inevitáveis. Preferivelmente, a relação de magnésio para fósforo é maior do que 1,0. Em uma segunda modalidade, as ligas de cobre-magnésio-fósforo de acordo com a presente invenção contêm magnésio em uma quantidade de cerca de O 01 a cerca de 0,25 % em peso, fósforo em uma quantidade de cerca 0,01. a cerca de 0,2% em peso, opcionalmente prata em uma quantidade de cerca de 0,001 a cerca de 0,1% em peso, pelo menos um elemento selecionado do grupo consistindo de niquel, cobalto, e misturas destes, em uma quantidade de cerca de 0,05 a cerca de 0,2% em peso, e o cobre de equilíbrio e impurezas inevitáveis.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/325,036 US6241831B1 (en) | 1999-06-07 | 1999-06-07 | Copper alloy |
| PCT/US2000/014028 WO2000075392A1 (en) | 1999-06-07 | 2000-05-19 | Copper alloy |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BR0007604A true BR0007604A (pt) | 2002-01-08 |
Family
ID=23266159
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BR0007604-0A BR0007604A (pt) | 1999-06-07 | 2000-05-19 | Liga à base de cobre e processo para formar uma liga à base de cobre |
Country Status (13)
| Country | Link |
|---|---|
| US (2) | US6241831B1 (pt) |
| EP (1) | EP1063309A3 (pt) |
| JP (1) | JP2003501554A (pt) |
| KR (1) | KR20010093083A (pt) |
| CN (1) | CN1182271C (pt) |
| AU (1) | AU4858800A (pt) |
| BR (1) | BR0007604A (pt) |
| CA (1) | CA2346635A1 (pt) |
| HK (1) | HK1044570A1 (pt) |
| HU (1) | HUP0104203A3 (pt) |
| MX (1) | MXPA01005075A (pt) |
| PL (1) | PL193301B1 (pt) |
| WO (1) | WO2000075392A1 (pt) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6749699B2 (en) | 2000-08-09 | 2004-06-15 | Olin Corporation | Silver containing copper alloy |
| SE522583C2 (sv) * | 2000-11-22 | 2004-02-24 | Emerson Energy Systems Ab | Förbindelseelement av metall för förbindelse mellan elkraftsfördelningsmoduler |
| JP2002319550A (ja) * | 2001-04-23 | 2002-10-31 | Sony Corp | 金属膜の形成方法および半導体装置の製造方法 |
| US20030188615A1 (en) * | 2002-04-03 | 2003-10-09 | 3M Innovative Properties Company | Angled product transfer conveyor |
| JP2004353011A (ja) * | 2003-05-27 | 2004-12-16 | Ykk Corp | 電極材料及びその製造方法 |
| JP4441467B2 (ja) * | 2004-12-24 | 2010-03-31 | 株式会社神戸製鋼所 | 曲げ加工性及び耐応力緩和特性を備えた銅合金 |
| KR101125525B1 (ko) * | 2008-10-20 | 2012-03-23 | 한국생산기술연구원 | 크롬을 함유하지 않는 고전기전도도 및 고강도 동합금 및 그 제조방법 |
| US20110123643A1 (en) * | 2009-11-24 | 2011-05-26 | Biersteker Robert A | Copper alloy enclosures |
| ES2697748T3 (es) * | 2013-03-15 | 2019-01-28 | Materion Corp | Procedimiento para producir un tamaño de grano uniforme en una aleación espinodal trabajada en caliente |
| CN103773989B (zh) * | 2014-03-04 | 2015-11-04 | 南京信息工程大学 | 一种铁磁元素钆改性的导电铜材料及制备方法 |
| CN104232984B (zh) * | 2014-09-25 | 2016-06-22 | 江苏鑫成铜业有限公司 | 一种制备高耐蚀铜合金的方法 |
| CN104711449A (zh) * | 2015-04-03 | 2015-06-17 | 北京金鹏振兴铜业有限公司 | 微合金化铜镁合金 |
| CN105463236A (zh) * | 2015-12-02 | 2016-04-06 | 芜湖楚江合金铜材有限公司 | 一种高效能复合铜合金线材及其加工工艺 |
| CN105543533B (zh) * | 2015-12-14 | 2017-06-20 | 中南大学 | 一种高强度高导电率铜镁系合金及其制备方法 |
| CN105382797A (zh) * | 2015-12-23 | 2016-03-09 | 常熟市三荣装饰材料有限公司 | 五金工具箱 |
| RU2677902C1 (ru) * | 2017-12-27 | 2019-01-22 | Федеральное государственное автономное образовательное учреждение высшего образования "Белгородский государственный национальный исследовательский университет" (НИУ "БелГУ") | Высокопрочный медный сплав |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2171697A (en) | 1939-03-09 | 1939-09-05 | Mallory & Co Inc P R | Alloy |
| US3677745A (en) | 1969-02-24 | 1972-07-18 | Cooper Range Co | Copper base composition |
| JPS5832220B2 (ja) | 1976-08-09 | 1983-07-12 | 古河電気工業株式会社 | 耐軟化性銅合金 |
| GB1562870A (en) | 1977-03-09 | 1980-03-19 | Louyot Comptoir Lyon Alemand | Copper alloys |
| JPS5547337A (en) | 1978-10-02 | 1980-04-03 | Hitachi Cable Ltd | Heat resisting highly conductive copper alloy |
| JPS58199835A (ja) * | 1982-05-19 | 1983-11-21 | Sumitomo Electric Ind Ltd | 電気又は電子機器用銅合金 |
| JPS59232244A (ja) * | 1983-06-16 | 1984-12-27 | Mitsui Mining & Smelting Co Ltd | 耐軟化高伝導性銅合金 |
| US4605532A (en) | 1984-08-31 | 1986-08-12 | Olin Corporation | Copper alloys having an improved combination of strength and conductivity |
| JPS6160846A (ja) | 1984-08-31 | 1986-03-28 | Tamagawa Kikai Kinzoku Kk | 半導体装置用銅合金リ−ド材 |
| IT1196620B (it) | 1986-09-11 | 1988-11-16 | Metalli Ind Spa | Lega metallica a base di rame di tipo perfezionato,particolarmente per la costruzione di componenti elettronici |
| US4908275A (en) | 1987-03-04 | 1990-03-13 | Nippon Mining Co., Ltd. | Film carrier and method of manufacturing same |
| JPH01263238A (ja) * | 1988-04-12 | 1989-10-19 | Sumitomo Metal Mining Co Ltd | 高強度高導電性銅合金 |
| JPH0673474A (ja) | 1992-08-27 | 1994-03-15 | Kobe Steel Ltd | 強度、導電率及び耐マイグレーション性が優れた銅合金 |
| JP3796784B2 (ja) | 1995-12-01 | 2006-07-12 | 三菱伸銅株式会社 | コネクタ製造用銅合金薄板およびその薄板で製造したコネクタ |
| US5820701A (en) * | 1996-11-07 | 1998-10-13 | Waterbury Rolling Mills, Inc. | Copper alloy and process for obtaining same |
| JP3418301B2 (ja) * | 1997-01-09 | 2003-06-23 | 古河電気工業株式会社 | 打抜加工性に優れた電気電子機器用銅合金 |
| US5868877A (en) * | 1997-07-22 | 1999-02-09 | Olin Corporation | Copper alloy having improved stress relaxation |
| JPH1180863A (ja) * | 1997-09-10 | 1999-03-26 | Kobe Steel Ltd | 耐応力緩和特性及びばね性が優れた銅合金 |
| US5893953A (en) * | 1997-09-16 | 1999-04-13 | Waterbury Rolling Mills, Inc. | Copper alloy and process for obtaining same |
| US6632300B2 (en) | 2000-06-26 | 2003-10-14 | Olin Corporation | Copper alloy having improved stress relaxation resistance |
-
1999
- 1999-06-07 US US09/325,036 patent/US6241831B1/en not_active Expired - Lifetime
-
2000
- 2000-05-19 CN CNB008027811A patent/CN1182271C/zh not_active Expired - Fee Related
- 2000-05-19 AU AU48588/00A patent/AU4858800A/en not_active Abandoned
- 2000-05-19 CA CA002346635A patent/CA2346635A1/en not_active Abandoned
- 2000-05-19 MX MXPA01005075A patent/MXPA01005075A/es unknown
- 2000-05-19 BR BR0007604-0A patent/BR0007604A/pt not_active IP Right Cessation
- 2000-05-19 WO PCT/US2000/014028 patent/WO2000075392A1/en active IP Right Grant
- 2000-05-19 PL PL353734A patent/PL193301B1/pl unknown
- 2000-05-19 KR KR1020017006209A patent/KR20010093083A/ko active IP Right Grant
- 2000-05-19 HU HU0104203A patent/HUP0104203A3/hu unknown
- 2000-05-19 JP JP2001501669A patent/JP2003501554A/ja active Pending
- 2000-05-30 EP EP00401529A patent/EP1063309A3/en not_active Withdrawn
-
2001
- 2001-03-07 US US09/800,989 patent/US6689232B2/en not_active Expired - Fee Related
-
2002
- 2002-08-28 HK HK02106354.5A patent/HK1044570A1/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| CA2346635A1 (en) | 2000-12-14 |
| MXPA01005075A (es) | 2002-04-24 |
| CN1182271C (zh) | 2004-12-29 |
| HUP0104203A3 (en) | 2003-05-28 |
| PL353734A1 (en) | 2003-12-01 |
| WO2000075392A1 (en) | 2000-12-14 |
| PL193301B1 (pl) | 2007-01-31 |
| US20010009168A1 (en) | 2001-07-26 |
| US6241831B1 (en) | 2001-06-05 |
| EP1063309A2 (en) | 2000-12-27 |
| CN1353774A (zh) | 2002-06-12 |
| AU4858800A (en) | 2000-12-28 |
| US6689232B2 (en) | 2004-02-10 |
| EP1063309A3 (en) | 2002-09-18 |
| KR20010093083A (ko) | 2001-10-27 |
| HUP0104203A2 (hu) | 2002-04-29 |
| HK1044570A1 (zh) | 2002-10-25 |
| JP2003501554A (ja) | 2003-01-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| B08F | Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette] |
Free format text: REFERENTE A 3A, 4A, 5A, 6A E 7A ANUIDADES. |
|
| B08K | Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette] |
Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 1925 DE 27/11/2007. |