HK1041106A1 - Lead frame and copper alloy to be used for lead frame. - Google Patents

Lead frame and copper alloy to be used for lead frame.

Info

Publication number
HK1041106A1
HK1041106A1 HK02102708A HK02102708A HK1041106A1 HK 1041106 A1 HK1041106 A1 HK 1041106A1 HK 02102708 A HK02102708 A HK 02102708A HK 02102708 A HK02102708 A HK 02102708A HK 1041106 A1 HK1041106 A1 HK 1041106A1
Authority
HK
Hong Kong
Prior art keywords
lead frame
copper alloy
lead
frame
alloy
Prior art date
Application number
HK02102708A
Other versions
HK1041106B (en
Inventor
Yasuo Tomioka
Original Assignee
Nippon Mining And Metals Co Lt
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mining And Metals Co Lt filed Critical Nippon Mining And Metals Co Lt
Publication of HK1041106A1 publication Critical patent/HK1041106A1/en
Publication of HK1041106B publication Critical patent/HK1041106B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Conductive Materials (AREA)
HK02102708.7A 2000-02-29 2002-04-10 Lead frame and copper alloy to be used for lead frame HK1041106B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000053968A JP3318309B2 (en) 2000-02-29 2000-02-29 Lead frame and copper alloy for lead frame

Publications (2)

Publication Number Publication Date
HK1041106A1 true HK1041106A1 (en) 2002-06-28
HK1041106B HK1041106B (en) 2005-12-09

Family

ID=18575285

Family Applications (1)

Application Number Title Priority Date Filing Date
HK02102708.7A HK1041106B (en) 2000-02-29 2002-04-10 Lead frame and copper alloy to be used for lead frame

Country Status (5)

Country Link
JP (1) JP3318309B2 (en)
KR (1) KR100380214B1 (en)
CN (1) CN1199262C (en)
HK (1) HK1041106B (en)
TW (1) TW541677B (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4524471B2 (en) * 2004-08-30 2010-08-18 Ｄｏｗａメタルテック株式会社 Copper alloy foil and manufacturing method thereof
WO2007148712A1 (en) * 2006-06-23 2007-12-27 Ngk Insulators, Ltd. Copper-based rolled alloy and method for producing the same
EP2339038B8 (en) 2006-07-21 2017-01-11 Kabushiki Kaisha Kobe Seiko Sho Copper alloy sheet for electric and electronic part
WO2008041584A1 (en) 2006-10-02 2008-04-10 Kabushiki Kaisha Kobe Seiko Sho Copper alloy plate for electrical and electronic components
JP2010222618A (en) * 2009-03-23 2010-10-07 Nippon Mining & Metals Co Ltd Cu-Ni-Si BASED COPPER ALLOY ROLLED SHEET AND ELECTRIC PART USING THE SAME
JP5339995B2 (en) * 2009-04-01 2013-11-13 Ｊｘ日鉱日石金属株式会社 Cu-Zn-Sn alloy plate and Cu-Zn-Sn alloy Sn plating strip
KR101260911B1 (en) 2010-02-08 2013-05-06 주식회사 풍산 Copper alloy having high strength, high conductivity and method of manufacture for the same
JP5427971B1 (en) * 2013-03-25 2014-02-26 Ｊｘ日鉱日石金属株式会社 Copper alloy sheet with excellent conductivity and bending deflection coefficient
JP6842270B2 (en) * 2016-10-05 2021-03-17 ローム株式会社 Semiconductor device

Also Published As

Publication number Publication date
TW541677B (en) 2003-07-11
KR100380214B1 (en) 2003-04-18
JP3318309B2 (en) 2002-08-26
CN1317828A (en) 2001-10-17
CN1199262C (en) 2005-04-27
KR20010085422A (en) 2001-09-07
HK1041106B (en) 2005-12-09
JP2001244400A (en) 2001-09-07

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20150228