TW541677B - Lead frame and copper alloy to be used for lead frame - Google Patents

Abstract

An oxide-film adherence of copper alloy is improved by controlling the uppermost surface layer, which is evaluated by the XRD thin film method. In such layer, the copper-alloy crystals exhibit not more than 0.04 of a peak intensity ratio of {100}, relative to {111}.

Description

541677 A7

V. Explanation of the invention (2) ^ It also has good wettability. When the external leads are held during the trimming step, the hardness must be increased without generating solder chips, and the Sn concentration should be 80 ~ 90wt%. The biggest issue concerning the reliability of these packages is the problem of cracking or peeling of the packages produced by the surface knitwear. The mechanism of package peeling is that after the semiconductor package is constructed, the resin and the wafer pad (the part on which the semiconductor chip is placed on the lead frame) have low adhesion, which is caused by thermal stress during subsequent heat treatment. The occurrence of package cracking is as follows. After the semiconductor package is constituted, the mold (mold) tree is called S and the atmosphere is collected, and then the water is evaporated due to heating during surface mounting. If there is a crack in the package, water vapor will be peeled off by pressure. Surface and constitute an internal pressure effect. The internal pressure swells the package, and the resin cannot withstand the internal pressure, which causes cracks. If the package after surface mounting produces turtles, moisture or impurities will invade and rot | insect chips, resulting in damage to semiconductor functions. In addition, due to the expansion of the package, the appearance is not good and the product value is lost. The problem of cracking or peeling of such packages has become more and more significant in recent years with the progress of thinner packages. Here, the problem of cracking or peeling of the package is caused by the poor adhesion between the resin and the wafer pad, and the one that most affects the adhesion between the resin and the wafer pad is an oxide film formed on the surface of the base material. The oxide film is formed before the resin package because the lead frame base material undergoes several heating procedures such as wafer bonding or wire bonding during the package assembly step, and has a thickness of several tens to several hundreds of nm. Since the surface of the wafer pad is connected by the lead frame base material and the lead frame through the oxide film, the adhesion between the hafnium oxide film and the lead frame base material will be close to the resin and the lead frame base material. Cause significant impact. This paper size applies to Chinese Wii ^ TcNS) A4 specification 541677 A7 V. Description of the invention (In addition, the materials for lead frames use Fe-Ni-based alloys and copper alloys represented by 42% Ni-Fe alloys. Because 42% Ni- The thermal expansion coefficient of Fe alloys is similar to that of ceramics, so it has been used as a ceramic packaging material, and the same% is also used as a highly reliable lead frame material in plastic packaging. However, the Fe-Qin system Compared with alloys, alloys have the disadvantage of low electrical conductivity, which is not conducive to the demand for packages with high heat dissipation or high-speed signal transmission in recent years. In terms of heat dissipation or high-speed signal transmission, copper alloys with high conductivity are more advantageous. It can be designed with a higher performance seal body. 'However, in terms of the adhesion of the aforementioned oxide film, since the copper alloy is inferior to the ―Ni alloy, it is easy to cause peeling between the resin and the wafer pad, and it is easy The problem of package cracking or peeling occurs. Therefore, it is necessary to develop a copper alloy with high oxide film adhesion in order to produce a highly reliable package. In addition to the above, for leads There are other requirements for the properties of the material. First, due to the thinning of the package, the lead frame material must be thin. As a result, the recent thickness of the thin materials such as 0.15 and 0.25 mm has become mainstream. And, Such thinness and narrowness of the lead frame lead to a decrease in the toughness of the frame body or the lead, and cause an internal lead shape during the assembly process or external lead deformation when the device is installed. To prevent this ... trouble, the lead frame used The material must be of higher strength. In addition to: and in addition, the lead frame must have good quality and press workability when forming patterns, and the reliability of the welded part after installation must be high. The purpose of the present invention is to provide—a kind of steel alloy lead frame and a fully modified sheet of paper. The paper size is suitable for financial standards (CNS) Ege (21 () x2974 \ f -6- 541677 5 4. Description of the invention (4) In this kind of lead frame, a copper alloy with a novel polar surface structure, the copper alloy lead frame can not only improve the adhesion of the oxide film to solve the cracking or peeling of the package. Please read the precautions before filling in this page.] This problem can improve the heat dissipation and operating speed of the package. For this reason, the inventors of this case have made in-depth research on the removal of oxide films without polishing. The relationship between the oxide film adhesion of the treated copper alloy and the crystal orientation of the base material electrode surface was surprisingly found that the crystal orientation of the surface layer of the copper alloy electrode can be controlled to improve the adhesion of the oxide film. The specific method is described below. The copper alloy lead frame of the present invention uses the XRD film method to evaluate the crystallographic orientation of the polar surface, and improves the adhesion of the oxide film with a ratio of {100 丨 peak intensity to {m} peak intensity of 0.04 or less. The lead frame It can be applied to all lead frames packaged with resin, especially those coated with precious metal or nickel on the surface of the semiconductor wafer before resin packaging. All copper alloys used for lead frames can be printed on copper alloys printed by employees' cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs, and the crystal orientation of the features of the present invention is particularly easy to achieve with copper alloys of various composition systems such as particle dispersion type and Shen hardening type. . The particularly desirable copper alloy contains the following types, that is, in terms of mass ratio, it contains Cr: 0 04 ~ 04% Y Zr: 0.03 ~ 0 · 25〇 /. , And Zη: 0 · 06 ~ 2 · 0%, and the remaining part is cu and unavoidable impurities (the remaining parts are the same below); in terms of mass ratio, it contains Cr ·· 0.04 ~ 0.4%, Zr : 〇03 ～ 〇25%, and & · 〇% ～ 2.0%, and further contains the total amount of 001 ~ 10% by see,% ,,, Mn, P, Mg and Si One or two or more selected from the constituent group; in terms of mass ratio, it contains Cr: 0.04 to 0.4%, ZΓ: 0.03 to 0.025%, and Zη..〇〇6 Amount ratio to 2.0%, Fe: 〇.1 to 1.8% & Τ: 〇 ″ to 〇8%; and the national standard (CNS) Α4 specification (21 () > < 297 Meal-541677 V. Description of the Invention (: In terms of 'Cr: 0.04 ~ 0.4%, Zr: 0.03 ~ 0.25%, Zn: 0.06 ~ 2.0%, Fe: 0.1 ~ 1.8%, Ti 〇 ″ ～ 〇 · 8%, and further contains one or two or more selected from the group consisting of Ni, Sii, In, Mn, P, Mg, and Si in a total amount of 0.01 to 1.0%. In addition, the so-called crystal orientation of the surface layer of the lead frame obtained by X-ray diffraction (X-ray diffraction) evaluation is, for example, related to science On the X-ray diffraction device RINT2000 made by Electric Co., Ltd., using a C0 bulb, the 2Θ scanning surface is perpendicular to the sample, and the rolling direction (RD) is included, so that the incidence angle (α) of the χ line is relative to the sample. The surface is projected at an angle of 5. (Figure 丨), and then the area intensity of the uu area detected by the 2Θ scan and the peak integrated intensity of the ray peak around the surface of {2〇〇 丨 are calculated, and the ratio is calculated and added. Evaluator. The general X-ray diffraction measurement method is shown in Figure 2. The relationship between the incident angle of the X-ray and the reflection angle of the sample is maintained in phase # with respect to the sample surface. It is to fix the bulb of the χ-ray source. When the sample surface phase 2 is at an angle of Θ to the incident ray, the rotation of the counter and the sample surface will make the counter sample at an angle of 2Θ to the incident ray. At this time, in general, In terms of the method, the measurement target surface is often parallel to the sample surface. The thin film method, because the incident angle is fixed, is expressed as α in order to distinguish it from 0, and 2 porphyries refer to the position of the counter relative to the incident ray. The general method is the same It is not bluffing. However, at this time, if it is different from the general method, as shown in Figure 3, the measurement target surface is a surface with the incident angle and the reflection angle at the same angle χ, so it changes at the same time as 2Θ, which is not the same as the sample. The surface is parallel to the surface. Because the polar surface is strongly rubbed by the calendar, the crystal orientation "inside mouth P is different. Therefore, in order to evaluate the crystal surface of the polar surface, the orientation must be more than the following: paper scale applies -8- 541677 A7 B7 V. DESCRIPTION OF THE INVENTION The thin film method described in (6) performs X-ray diffraction analysis. Regarding the crystal orientation of rolling of copper alloys, (i 10) 12] is the main rolling orientation, (Progress in Metal Physics, 1By Bruce

Chalmers, 1949, p. 297). In recent years, under more precise measurement, the display mode of (123) [U ^] + (146) [21i] can be seen (η Huand s. Goodman:, (627)). These measurement results are obtained by X-rays penetrating to tens of μm below the surface. Although the general average properties are known here, there are studies on the surface crystalline orientation of the polar surface around μη1, and the orientation and oxide film. The research on the relationship of closeness and the crystal orientation of the surface layer have not been found so far. In addition, in order to obtain the above-mentioned crystal orientation, it is generally known that the rolling conditions for the final cold pressing performed in the 20 to 80% processing procedure may be controlled. In other words, "when the rolling oil introduced between the roll and the material has a thicker oil film thickness", the {100} peak intensity becomes low. Therefore, if the rolling conditions are such that the roll diameter of the final cold rolling pass is above 100 legs and the rolling speed is above 2000 m / min, the rolling oil viscosity is above 5 cst (that is, above 0.05 cm2 / s), Then the ratio of the {100} peak intensity to the {111} peak intensity will be below 0.004. The above "is mainly used to explain the use of the lead frame of a semiconductor package", but the alloy of the present invention can also be used for other applications in which a surface protective film is directly omitted in the process of omitting the base material polishing and the like. The ideal copper alloy composition of the present invention is described below. In the description, percentage means mass%.

Cr series can precipitate the base material after aging treatment after the solution treatment of the alloy (please read the precautions on the back before filling this page) -pack ·

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541677 5. In the description of the invention (7), a material with enhanced strength, but if its content is less than 0.004%, this effect will not achieve the desired effect. On the contrary, if the content exceeds 0.4%, the product will be manufactured. After that, coarse Cr will remain in the base material, and as a result, the etching properties will be deteriorated. For the above reasons, the ideal Q content is from 0.4 to 0.4%.

The Zr system can be strengthened by precipitating the copper-forming compound into the base material after the effect treatment. If the content is less than 0.003%, the desired effect of the aforementioned effect cannot be achieved. On the other hand, if the Zr content exceeds 0.25%, after solution treatment, coarse & unsolved & will remain in the base material, resulting in a decrease in etching properties. Therefore, the ideal Zr content is from 0.03 to 0.25%.

Zn is a component added in order to improve the heat-resistant peeling resistance of the solder and the adhesion of the oxide film. If the content is less than 0.006%, the desired effect of the aforementioned action cannot be achieved. Conversely, if the addition of Zn exceeds 2 〇% will reduce the conductivity. Therefore, the ideal 211 content is from 006 to 20%. Ti and Fe can form intermetallic compounds in the base metal when the alloy is aging treated, and further increase the strength of the alloy, if necessary, can be added to play this role, but if the content of Below 0.001%, the desired intensity of the above-mentioned effect cannot be achieved. Conversely, if the Ti content exceeds 08% and is printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs and the Fe content exceeds 1.80%, coarse inclusions with Ding and Bu as the main components will remain, which will seriously hinder etching. Sex. Therefore, the ideal Ti content is 0.1 to 0.8%, and the ideal Fe content is 0.01 to 1.

The effects of Ni, Sn, In, Mn, P, Mg, and Si are as follows. These ingredients all have the effect of improving strength by solid solution strengthening without reducing the conductivity of the alloy too much. Therefore, one or two or more kinds can be added as needed, if the total content is less than 0.01% It is impossible to achieve the hope of the aforementioned action -10- 541677 A7 B7 V. Effect of the invention (Conversely, if the total amount exceeds 1.0%, the electrical conductivity of the alloy will be significantly reduced. Therefore, if it is added alone or in combination of two or more kinds, The ideal total content of Ni, §n, In, Mn, P, Mg, and Si is 0.01 to 8%. Second, the effect of the present invention will be specifically described with examples in the ideal composition range. First, electrolysis Copper (Cu) or oxygen-free copper (Cu) is the main raw material, and the copper-chromium master alloy, copper copper master alloy, zinc, titanium, mild steel, nickel, tin, steel, magnesium, magnesium, silicon, and copper-phosphorus master alloy are used as auxiliary materials. In the high-frequency melting furnace, the copper alloys with various components shown in Tables 1 and 3 are dissolved in vacuum or argon to cast into 30-thick ingots. Next, each ingot is sequentially hot-processed and solidified. Solution treatment, cold pressing once, aging treatment, Tables 1 and 3 The final cold pressing (processing degree 50%) and stress-relieving annealing under the conditions shown below are used to make the electrode plate with a thickness of 0 · 15. The evaluation method is described below. First, each X-ray diffraction device is used to produce each electrode. The crystal orientation of the plates was evaluated by the method described above. Secondly, the adhesion of the oxide film was evaluated by the adhesive sheet peel test. In addition, a 20 × 50 leg test piece was cut from each plate and heated at a predetermined temperature in the atmosphere. After 5 minutes, a commercially available adhesive sheet (trade name: 3M # 851) was attached to the surface of the test piece that produced the oxide film and peeled off. At this time, the heating temperature was changed by 2 (TC scale, and the oxide film was peeled off. The lowest temperature at this time is regarded as the peeling temperature of the oxide film. In addition, the tensile strength is measured by a tensile test, and the conductivity is determined by determining the conductivity. Tables 3 and 4 show the evaluations. Results. As shown in the table, this example obtained good adhesion of the oxide film, otherwise, each comparative example was inappropriate (please read the precautions on the back before filling out this page)-Install,-Order the Ministry of Economic Affairs Printed by the Intellectual Property Bureau Staff Consumer Cooperative

541677 A7 B7 V. Description of the invention (9) The rolling direction of the electrode surface leaves the {100} orientation out of the correct range, resulting in poor adhesion of the oxide film. (Please read the note on the back first, then fill in-Pack-: Write this page)

、 1T Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs -12- This paper size applies to China National Standard (CNS) A4 (210X 297 mm) 541677 A7 B7

V. Description of the invention (printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs ^ * 4 Λ.) «** ·« 4 5: 埏 〇 也 [0,026 ff 0.0411 1 0,023 I! 0.049 1 [〇.〇π 1 L α_ I ί. 0.023! 0.044! 1 Viscosity (cm%) of oil in the final cold-hardened condition Γ 0.12 1 I ojs | «2 5 1 0.20! I CU8 | L——digm” d 3 d: (m / min } o ia SM 8 «〇0« 5 Ο one g C0 ο ο & 〇g Γ ,: χ · ^^ ί, (mm) § 〇ο < £ > 0 φ P-4 Ο 2 s ^- 4 i Chemical composition (d J Cu * Impurities steal rs®, continued. H): Ψ: \ «* t *, * greed ♦» s * *-* * * * 0 ^ 4 § Ο 〇〇 • * * ♦ ♦ s: • *; 〇0Ϊ: *** «; ο: * * * m * * 0.66 l〇, 63j I 0.85 1 o ^ j * * Z * ¢ 0 00 < NI« 5 mi οι g > 5 0 «« 0 聿 4 m * '♦ * ¢ 0 < N 〇cn ο iS PM yn m * * * p * * n 0'24 0 * 25 ♦ 0M ύΜ 0,19 2 d N * * * * * * * ♦ 〇 • ♦ • * 0J3 z Example of this item i It is comparative example 1 Stupid example 2 1 Comparison example 2 j 1 This example is 3 j tmm 3 This figure 014 1 Comparative example 4 1 U) _ «| ;; >« $, ¥ lifting槪 菌 ^^ S | VUdKOc) 1 CO ω m — CO CO < 〇mmm CO — < 0 CO Bu! Co: co Φ CO 05 in | Conductivity (% IACS)! Φ < D mo υύ 00 ¢ 0 to CO < 0 CO | Tensile strength (MP aj | | 5 30 1 o 1 £ 5 O | 7 3 0 | o to | 8 50 1 1 5 7 0 | 5 8 0 1 m II ujm i < M CO CO Support rt I m! This example m 1 (please read the notes on the back 1 > then fill in and install-: write this page), 1T This paper size applies Chinese National Standard (CNS) Α4 Specifications (210X297 mm) -13- 541677 A7 B7 V. Description of the invention (11) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 1 # * ί > 1 〇o: 1 O 1 0 1 ml Bu ο ο 1: : O η ο z c > os Q oi QO: ίΜ; 5 d «ο τ d 1 o W, / ® 8 ο so 1 n O a 〇n O: 2:: S: 8 21 o S« J 5 2 d 丨 to do s 2 ososo 5 ”| 1 i 1 1% 1 1 1 i 1 ii 1 meaning% m ^ k. 1;; 1 L ^ :: S-i 8 2 usa 3 s 5 S an pm% i: ㈣ 8 '· 〇c * \, 〆 \ Φ -W r / < kv, · jJ.: 4 yy No e:' r silicon '< 3 毖 1 I! 1! Ii I 2 OI 1 1 1 2 : d II i Μ 1 I 1 I 1 i SO * i I 1 ί 1 ί 1 i til a * I! 1 f 1 § < s 1 I i I i S c > ii 1 I f I 1 IS < »1 1! 翁 1 S d 1 ί 1 8 o ί < ύ I 1 1 answer oi 1 1 1 IS ii! 1! ί 2 1 1 2 df I Ϊ ί i ί II 1 i 1 1 ί ml §1 O i I! i 1 1 window \ ! f \ 1 \ 1 I ii \ I fl 1: ο dsdi S d!!? ci I ii 1 ί 1 II i flood ci < M! S d | f I sd 2 d § oa O m " *. mo Ά O nd% d ▼ d 1 ο c * 〇dsdn O sds? ≪ 5: FREE m4 .. dn O 〇2 2 c > 8 O o 3 5 2 o 1 〇 · 2 S 3 so 2 0 i 1 i Ά ond 2, d SI < s crossbow O iad 1 2 d about o < s 2 oa O < 〇 卜 < 〇m 丨 2 — 2 2 s 2 S vs < 0 (Please read the note on the back 1) _ items and then fill in. Pack —: write this page) Order _ This paper size applies to Chinese National Standard (CNS) A4 specification (210X 297 mm) -14- 541677 A7 B7 V. Description of the invention (12) Evaluation results of the adhesion and characteristics of the oxide film printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs (2) No · Tensile strength (Mpa) Electrical conductivity (% IACS) (K) Example 5 580 80 673 6 620 76 673 7 610 77 673 8 590 W 693 9 580 81 673 10 580 77 693 11 590 80 693 1 12 590 79 693 13 680 71 673 14 700 68 693 15 720 69 673 16 680 65 693 17 690 66 673 Comparative Example 6 580 81 633 6 590 77 653 t 690 68 653 (Please read the precautions on the back before filling this page)

、 1T This paper size is applicable to China National Standard (CNS) A4 specification (210 × 297 mm) -15- 541677

3. Description of the invention (13 As explained above, compared with 42 alloy, the copper alloy of the present invention can greatly improve the heat dissipation and high-speed operation of the semiconductor package, and it can be improved by the improvement of the adhesion of the oxide film. Suppress the decline of package reliability. The following is a brief description of the diagram. Figure 1 is an explanatory diagram of the evaluation method of the polar surface layer. Figure 2 is an explanatory diagram of the χ-ray diffraction method of the general method. Figure 3 is of the thin film method X-ray diffraction method illustration. -------- install ------ order: (Please read the precautions on the back and save this page)

Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs This paper is sized to the Chinese National Standard (CNS) M specification (210x297 mm) -16 »

Claims (1)

541677 This A BCD 92. 3. 〇 Patent Application No. 090104583 Patent Application Amendment of Patent Scope Amendment Date: March 1992 1 · A copper alloy lead frame is made of copper alloy lead frame Encapsulated and the copper alloy leadframe base material was evaluated by XRD thin film method to obtain the following values, that is, its {1 00} peak intensity is relative to the {111 } The peak intensity ratio is below 0.004. 2 · If the copper alloy lead frame of item 1 of the patent application scope includes a resin encapsulation portion and a lead portion other than metal plating, and the resin encapsulation portion is the base material, the surface layer has the peak intensity ratio of 0.04 or less By. 3. The copper alloy lead frame according to item 1 or 2 of the scope of patent application, wherein the steel alloy is contained in terms of mass ratio, Cr: 0.04 to 0.4%, Zr: 0.03 to 0.25%, and Zn ... 0.06 ~ 2.0%, and the rest is Cu and unavoidable impurities. 4. For the copper alloy lead frame of item 1 or 2 of the patent application scope, wherein the copper alloy is contained in terms of mass ratio, Cr: 0.04 ~ 0.4%, Zr: 〇.〇3〜 〇.25%, and Zn : 0.06 to 2.0%, and further containing one or two or more selected from the group consisting of Ni, Sn, In, Mn, P, Mg, and Si in a total amount of 0.01 to 1 ()%, and The remainder is Cu and unavoidable impurities. 5. For the copper alloy lead frame of item 丨 or 2 of the scope of patent application, wherein the copper alloy is contained in terms of mass ratio, Cr: 〇〇4〜〇4%, Zr: 〇〇 ～ 0.25%, Zn ·· 〇.〇6 ～ 2.0%, Fe: 0.1 ~ ι · 8%, and Ding: 〇 ″ ～ 〇 · 8%, and the rest are (:: 11 and unavoidable impurities. Staple * 17- The copper alloy lead frame of the Shishen W patent scope item 丨 or 2, wherein the copper alloy i is contained in terms of mass ratio, Cr: 0.04 to 0.4%, Zr: 0.03 to 0.25%, Zn: 〇.〇6 ～ 2.0%, Fe: 〇 ～ ι ～ 1.8%, and Ti: 〇 ″ 0-8% ', and further contains 1%, 311, 111, One or two or more selected from the group consisting of Mn, P, Mg, and si, and the remaining portion is Cu and unavoidable impurities. • A copper alloy, which is contained in terms of mass ratio, Cr: 0.04 to 0.4%, Zr: 〇.〇3 to 〇.25%, and Zll: 〇.〇6 to 2.0%, and the remainder ° 卩 points are Cu and unavoidable impurities, and evaluated by XRD film method to obtain the following value, that is, its {100% of the peak intensity relative to the {111} peak of the copper alloy crystals constituting the pole surface of the rolled surface The intensity ratio is below 0.004. 8 · —a copper alloy, which is contained in a mass ratio, Cr: 〇〇04 ~ 0.4%, Zr: 〇03 ~ 0.25%, and Zn: 0.06 ~ 2.0%, and further contains a total amount 0.01 to 1.0% of one or two or more selected from the group consisting of Ni, Sn, In, Mn, P, Mg, and Si, and the remaining portion is Cu and unavoidable impurities, and, Evaluation by the XRD thin-film method yields the following value, that is, the {100 丨 peak intensity ratio of the {111} peak intensity ratio of the copper alloy crystals constituting the rolled electrode surface layer is below 0 04. 9. A copper alloy containing by mass ratio, Cr: 〇〇04 ~ 0.4%, Zr ·· 0.03 ~ 0.25%, Zn: 0.06 ~ 2.0%, Fe: 〇! ~ 1.8%, and Ti: 0_1 ~ 0.8%, and the remaining part is Cu and unavoidable impurities, and the following value is obtained by XRD film method evaluation, that is, its peak intensity of {1〇〇 丨 is relative to the copper constituting the extreme surface layer of the rolled surface The standard of this paper is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) -18- 541677 A8 B8 C8 ------ D8 VI. Application for patents ® ^ " '—— Gold Crystal of {111} The peak intensity ratio is below 0.004. ι〇 · A copper alloy, which is contained in a mass ratio, cr: 〇〇04 ~ 0.4%, Zr: 0.03 ~ 〇 · 25%, Zn: 〇〇〇〜2 〇%, &: 〇 ”~ 1.8%, and Ti: (M ~ 0.8%, and further selected from the group consisting of Ni, Sn, In, Mn, p, Mg, and Si in a total amount of 0.00 to 1.0% One or two or more of them ', and the remainder is Cu and unavoidable impurities, and the following values were obtained by XRD film method, that is,' its U00} peak strength relative to the copper alloy crystals constituting the pole surface of the rolled surface The peak intensity ratio of {111} is less than 0 04. U · If the copper alloy according to any one of items 7 to 10 of the patent application scope, the copper alloy is used in the lead frame. 12 · If the patent application scope is The copper alloy according to any one of items 7 to 10, which is formed by final cold pressing, and the conditions for cold pressing are that the rolls in the final rolling path are controlled above 100mm and the rolling speed is above 200rn / min, and Rolling oil dryness is above 0.05cm2 / s. 13 · If the copper alloy of item u in the scope of application for patent is made by final cold pressing, the cold pressing conditions are the most The roll diameter of the rolling path is more than 100 legs, the rolling speed is more than 2000 m / min, and the viscosity of the rolling oil is more than 0.05 cm2 / s. This paper size is applicable to China National Standard (CNS) A4 specification (21 〇χ297mm) (Please read the precautions on the back before filling in this page) Order | -19-