DK3491903T3 - Fremgangsmåde til aflejring af en beskyttelsescoating og et substrat med en beskyttelsescoating - Google Patents
Fremgangsmåde til aflejring af en beskyttelsescoating og et substrat med en beskyttelsescoating Download PDFInfo
- Publication number
- DK3491903T3 DK3491903T3 DK17818219.2T DK17818219T DK3491903T3 DK 3491903 T3 DK3491903 T3 DK 3491903T3 DK 17818219 T DK17818219 T DK 17818219T DK 3491903 T3 DK3491903 T3 DK 3491903T3
- Authority
- DK
- Denmark
- Prior art keywords
- protective coating
- depositing
- substrate
- protective
- coating
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/62—Plasma-deposition of organic layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
- B05D7/50—Multilayers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D127/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers
- C09D127/02—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment
- C09D127/12—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
- C09D127/20—Homopolymers or copolymers of hexafluoropropene
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/02—Pretreatment of the material to be coated
- C23C16/0272—Deposition of sub-layers, e.g. to promote the adhesion of the main coating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
- C23C16/401—Oxides containing silicon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/505—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D2252/00—Sheets
- B05D2252/04—Sheets of definite length in a continuous process
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D2451/00—Type of carrier, type of coating (Multilayers)
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D2518/00—Other type of polymers
- B05D2518/10—Silicon-containing polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/04—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases
- B05D3/0486—Operating the coating or treatment in a controlled atmosphere
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2261/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G2261/30—Monomer units or repeat units incorporating structural elements in the main chain
- C08G2261/34—Monomer units or repeat units incorporating structural elements in the main chain incorporating partially-aromatic structural elements in the main chain
- C08G2261/342—Monomer units or repeat units incorporating structural elements in the main chain incorporating partially-aromatic structural elements in the main chain containing only carbon atoms
- C08G2261/3424—Monomer units or repeat units incorporating structural elements in the main chain incorporating partially-aromatic structural elements in the main chain containing only carbon atoms non-conjugated, e.g. paracyclophanes or xylenes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0179—Thin film deposited insulating layer, e.g. inorganic layer for printed capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09872—Insulating conformal coating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/09—Treatments involving charged particles
- H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1322—Encapsulation comprising more than one layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1333—Deposition techniques, e.g. coating
- H05K2203/1338—Chemical vapour deposition
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Metallurgy (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Plasma & Fusion (AREA)
- Physics & Mathematics (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Vapour Deposition (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GBGB1621177.3A GB201621177D0 (en) | 2016-12-13 | 2016-12-13 | Protective coating |
PCT/GB2017/053720 WO2018109459A1 (en) | 2016-12-13 | 2017-12-12 | Protective coating |
Publications (1)
Publication Number | Publication Date |
---|---|
DK3491903T3 true DK3491903T3 (da) | 2020-04-14 |
Family
ID=58222259
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK17818219.2T DK3491903T3 (da) | 2016-12-13 | 2017-12-12 | Fremgangsmåde til aflejring af en beskyttelsescoating og et substrat med en beskyttelsescoating |
Country Status (13)
Country | Link |
---|---|
US (2) | US11786930B2 (da) |
EP (1) | EP3491903B1 (da) |
JP (1) | JP2020502791A (da) |
KR (1) | KR20190119030A (da) |
CN (1) | CN110268810A (da) |
AU (1) | AU2017374765A1 (da) |
CA (1) | CA3046050A1 (da) |
DK (1) | DK3491903T3 (da) |
ES (1) | ES2777473T3 (da) |
GB (1) | GB201621177D0 (da) |
RU (1) | RU2019117901A (da) |
TW (1) | TW201835370A (da) |
WO (1) | WO2018109459A1 (da) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20170314129A1 (en) | 2016-04-29 | 2017-11-02 | Lam Research Corporation | Variable cycle and time rf activation method for film thickness matching in a multi-station deposition system |
GB201621177D0 (en) * | 2016-12-13 | 2017-01-25 | Semblant Ltd | Protective coating |
EP3680029B1 (en) * | 2019-01-09 | 2023-06-07 | Europlasma nv | A plasma polymerisation method for coating a substrate with a polymer |
WO2021092197A1 (en) * | 2019-11-08 | 2021-05-14 | Lam Research Corporation | Plasma-enhanced atomic layer deposition with radio-frequency power ramping |
Family Cites Families (198)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3770571A (en) | 1969-04-02 | 1973-11-06 | Richardson Co | Fabrication of printed circuit boards |
FR2048044B1 (da) | 1969-06-30 | 1973-01-12 | Fmc Corp | |
US3649475A (en) | 1969-07-22 | 1972-03-14 | Gen Dynamics Corp | Multi-layer printed circuit boards and methods of making same |
US3737339A (en) | 1970-12-18 | 1973-06-05 | Richardson Co | Fabrication of printed circuit boards |
US3745536A (en) | 1971-03-01 | 1973-07-10 | Burroughs Corp | High speed serial scan and read-out of keyboards |
GB1399252A (en) | 1971-05-19 | 1975-07-02 | Post Office | Electrical signal initiating keyboards |
US3931454A (en) | 1972-10-17 | 1976-01-06 | Westinghouse Electric Corporation | Printed circuit board and method of preparing it |
JPS5219875B2 (da) | 1974-02-07 | 1977-05-31 | ||
JPS5168441A (ja) | 1974-12-10 | 1976-06-14 | Dainippon Printing Co Ltd | Mudenkaimetsukinyori kitaihyomenni kinzokuhimakupataano keiseisuru hoho |
US4136225A (en) | 1977-07-08 | 1979-01-23 | Bell Telephone Laboratories, Incorporated | Cover coatings for printed circuits |
JPS5439873A (en) | 1977-09-06 | 1979-03-27 | Nippon Denso Co | Incombustible ypet flexible printed wiring board |
US4268568A (en) | 1979-05-14 | 1981-05-19 | Bell Telephone Laboratories, Incorporated | Lubricated electrical contacts |
US4508756A (en) | 1980-10-08 | 1985-04-02 | Murata Manufacturing Co., Ltd. | Method for inhibiting oxidation of a copper film on ceramic body |
US4369287A (en) | 1981-03-16 | 1983-01-18 | Motorola Inc. | Permanent fluxing agent and solder-through conformal coating |
US4562091A (en) | 1982-12-23 | 1985-12-31 | International Business Machines Corporation | Use of plasma polymerized orgaosilicon films in fabrication of lift-off masks |
US4689110A (en) | 1983-12-22 | 1987-08-25 | Trw Inc. | Method of fabricating multilayer printed circuit board structure |
US4591659A (en) | 1983-12-22 | 1986-05-27 | Trw Inc. | Multilayer printed circuit board structure |
JPS60214941A (ja) | 1984-04-10 | 1985-10-28 | 株式会社 潤工社 | プリント基板 |
JPS60214942A (ja) | 1984-04-10 | 1985-10-28 | 株式会社 潤工社 | 圧縮変形しにくい延伸多孔質四弗化エチレン樹脂体 |
JPS60239840A (ja) | 1984-05-15 | 1985-11-28 | Nec Corp | 擬似障害発生装置 |
JPS60257592A (ja) | 1984-06-04 | 1985-12-19 | 松下電工株式会社 | 多層プリント配線板 |
JPS60258232A (ja) | 1984-06-04 | 1985-12-20 | Matsushita Electric Works Ltd | フツ素系樹脂積層板 |
US4668532A (en) | 1984-09-04 | 1987-05-26 | Kollmorgen Technologies Corporation | System for selective metallization of electronic interconnection boards |
US4710429A (en) | 1985-04-15 | 1987-12-01 | The Dow Chemical Company | Laminates from epoxidized phenol-hydrocarbon adducts |
JPS61243844A (ja) | 1985-04-23 | 1986-10-30 | Hitachi Ltd | 熱硬化性樹脂組成物 |
JPS6232098A (ja) | 1985-08-05 | 1987-02-12 | ダイハツ工業株式会社 | ワンポイント状マ−クの形成方法 |
JPS62252016A (ja) | 1986-04-24 | 1987-11-02 | 富士ポリマテック株式会社 | 接点ゴム導通部の形成法 |
CA1312040C (en) | 1985-12-19 | 1992-12-29 | Joseph Victor Koleske | Conformal coatings cured with actinic radiation |
US4681774A (en) | 1986-01-17 | 1987-07-21 | Halliwell Michael J | Laser induced selective electroless plating |
US4732649A (en) | 1986-06-18 | 1988-03-22 | Macdermid, Incorporated | Method for manufacture of printed circuit boards |
US4784901A (en) | 1987-04-13 | 1988-11-15 | Japan Gore-Tex, Inc. | Flexible printed circuit board base material |
US4772509A (en) | 1987-04-13 | 1988-09-20 | Japan Gore-Tex, Inc. | Printed circuit board base material |
US4755911A (en) | 1987-04-28 | 1988-07-05 | Junkosha Co., Ltd. | Multilayer printed circuit board |
US4797178A (en) | 1987-05-13 | 1989-01-10 | International Business Machines Corporation | Plasma etch enhancement with large mass inert gas |
JPH0832958B2 (ja) | 1987-08-24 | 1996-03-29 | ゼネラル・エレクトリック・カンパニイ | 耐摩耗性プラスチック物品の製造法 |
JPH01131270A (ja) | 1987-11-17 | 1989-05-24 | Asahi Glass Co Ltd | 熱硬化性樹脂組成物及びその組成物を使用した積層板 |
JPH0180974U (da) | 1987-11-20 | 1989-05-30 | ||
US6238774B1 (en) | 1988-02-04 | 2001-05-29 | Fujitsu Limited | Protection of oxide superconductor |
JPH01225539A (ja) | 1988-03-04 | 1989-09-08 | Junkosha Co Ltd | 積層板 |
US4975319A (en) | 1988-07-14 | 1990-12-04 | General Electric Company | Printed circuit board from fibers impregnated with epoxy resin mixture, halogenated bisphenol and polyphenylene ether |
EP0355955A3 (en) | 1988-07-25 | 1991-12-27 | Hitachi, Ltd. | Connection for semiconductor devices or integrated circuits by coated wires and method of manufacturing the same |
JPH0286675A (ja) | 1988-09-22 | 1990-03-27 | Nitto Denko Corp | プリント基板固着材 |
JPH0826116B2 (ja) | 1988-09-30 | 1996-03-13 | 株式会社日立製作所 | 熱硬化性樹脂組成物およびこれを用いたプリント回路板 |
JPH02120351A (ja) | 1988-10-29 | 1990-05-08 | Japan Synthetic Rubber Co Ltd | 難燃性樹脂組成物 |
JPH03129796A (ja) | 1989-03-23 | 1991-06-03 | Matsushita Electric Works Ltd | プリント配線板の製造法 |
JPH0624211B2 (ja) | 1989-04-26 | 1994-03-30 | 新日本製鐵株式会社 | 絶縁被覆ボンディングワイヤ |
DE3912580C2 (de) | 1989-04-17 | 1997-08-21 | F&K Delvotec Bondtechnik Gmbh | Bondstempel |
JPH03242992A (ja) | 1990-02-21 | 1991-10-29 | Mitsubishi Plastics Ind Ltd | 曲面形状を有するプリント配線板の製法 |
US5141702A (en) | 1990-03-13 | 1992-08-25 | Olin Corporation | Method of making coated electrical connectors |
JPH03278494A (ja) | 1990-03-28 | 1991-12-10 | Toshiba Chem Corp | プリント回路用基板 |
JPH07120858B2 (ja) | 1990-03-30 | 1995-12-20 | 株式会社日立製作所 | 多層プリント回路板およびその製造方法 |
JPH0465184A (ja) | 1990-07-05 | 1992-03-02 | Kansai Paint Co Ltd | 電着前処理方法 |
JPH04208597A (ja) | 1990-12-01 | 1992-07-30 | Fujitsu Ltd | 多層プリント配線板および多層プリント配線板の製造方法 |
ATE125666T1 (de) | 1991-02-07 | 1995-08-15 | Siemens Ag | Mikromehrlagenverdrahtung. |
US5274913A (en) | 1991-10-25 | 1994-01-04 | International Business Machines Corporation | Method of fabricating a reworkable module |
JP3129796B2 (ja) | 1991-11-21 | 2001-01-31 | ニチモウ株式会社 | 切断方法 |
JPH05275487A (ja) | 1991-11-22 | 1993-10-22 | Sumitomo 3M Ltd | 電子部品表面保護材、その表面保護材を備えた電子部品、およびその表面保護材を使用した電子部品の電気的接続方法 |
JP3242992B2 (ja) | 1992-06-17 | 2001-12-25 | パイオニア株式会社 | 有機エレクトロルミネッセンス素子 |
JP3348454B2 (ja) | 1993-02-05 | 2002-11-20 | ソニー株式会社 | 酸化防止方法 |
JP3278494B2 (ja) | 1993-06-04 | 2002-04-30 | アクトロニクス株式会社 | 静止誘導機器巻線の加温方法 |
IL111497A (en) | 1993-12-08 | 2001-01-28 | Rohco Inc Mcgean | Seelan preparations are useful as adhesives |
JPH07201502A (ja) | 1993-12-28 | 1995-08-04 | Japan Gore Tex Inc | 基板実装型電子部品 |
CA2118544A1 (en) | 1993-12-30 | 1995-07-01 | Henry W. Krautter | Reliability elastomeric keypads and method for making same |
US5639989A (en) | 1994-04-19 | 1997-06-17 | Motorola Inc. | Shielded electronic component assembly and method for making the same |
JP2614190B2 (ja) | 1994-06-01 | 1997-05-28 | 日本ピラー工業株式会社 | 多層板用プリプレグ、積層板、多層プリント回路基板およびその製造方法 |
JPH0827453A (ja) | 1994-07-14 | 1996-01-30 | Nitto Denko Corp | 難燃性接着剤 |
JP2533747B2 (ja) | 1994-07-25 | 1996-09-11 | 株式会社日立製作所 | 積層板及びその製造方法 |
US5734008A (en) | 1994-10-28 | 1998-03-31 | Sumitomo Chemical Company, Limited | Polyimide film |
JPH08143846A (ja) | 1994-11-24 | 1996-06-04 | Nitto Denko Corp | 難燃性接着剤 |
JPH08288331A (ja) | 1995-04-17 | 1996-11-01 | Tanaka Denshi Kogyo Kk | 半導体装置用ボンディングワイヤ及びその製造方法 |
US6396078B1 (en) | 1995-06-20 | 2002-05-28 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device with a tapered hole formed using multiple layers with different etching rates |
JP3565993B2 (ja) | 1995-06-20 | 2004-09-15 | 株式会社半導体エネルギー研究所 | 半導体装置の製造方法 |
DE19535068C2 (de) | 1995-09-21 | 1997-08-21 | Lpkf Cad Cam Systeme Gmbh | Beschichtung zur strukturierten Erzeugung von Leiterbahnen auf der Oberfläche von elektrisch isolierenden Substraten, Verfahren zum Herstellen der Beschichtung und von strukturierten Leiterbahnen |
GB9608952D0 (en) | 1995-09-22 | 1996-07-03 | Bnfl Fluorchem Ltd | Coating compositions |
US7112265B1 (en) | 1996-02-14 | 2006-09-26 | Lifescan Scotland Limited | Disposable test strips with integrated reagent/blood separation layer |
WO1997039610A1 (en) | 1996-04-18 | 1997-10-23 | International Business Machines Corporation | Organic-metallic composite coating for copper surface protection |
US5895228A (en) | 1996-11-14 | 1999-04-20 | International Business Machines Corporation | Encapsulation of organic light emitting devices using Siloxane or Siloxane derivatives |
WO1998058117A1 (en) | 1997-06-14 | 1998-12-23 | The Secretary Of State For Defence | Surface coatings |
JPH1112716A (ja) | 1997-06-19 | 1999-01-19 | Seiko Epson Corp | ロウ接用材料およびその製造方法 |
JPH1140907A (ja) | 1997-07-17 | 1999-02-12 | Fuji Photo Film Co Ltd | プリント配線板及び部品取り付け方法 |
US5858074A (en) | 1997-07-29 | 1999-01-12 | National Research Council Of Canada | Organic solderability preservative compositions |
US5970383A (en) | 1997-12-17 | 1999-10-19 | Advanced Micro Devices | Method of manufacturing a semiconductor device with improved control of deposition layer thickness |
JP3551007B2 (ja) | 1998-03-02 | 2004-08-04 | セイコーエプソン株式会社 | ワイヤボンディング方法および装置ならびにワイヤバンプの形成方法 |
JP3974256B2 (ja) | 1998-04-22 | 2007-09-12 | 新日鐵化学株式会社 | アルカリ現像型感光性樹脂組成物 |
JPH11319635A (ja) | 1998-05-15 | 1999-11-24 | Omron Corp | 接点用有機物塗布装置及び接点用有機物塗布方法 |
GB9821267D0 (en) | 1998-10-01 | 1998-11-25 | Secr Defence | Surface coatings |
US6284308B2 (en) | 1998-12-25 | 2001-09-04 | Victor Company Of Japan, Ltd. | Manufacturing method of printed circuit board |
JP2000211057A (ja) | 1999-01-26 | 2000-08-02 | Hitachi Chem Co Ltd | 積層用中間板 |
US6709715B1 (en) | 1999-06-17 | 2004-03-23 | Applied Materials Inc. | Plasma enhanced chemical vapor deposition of copolymer of parylene N and comonomers with various double bonds |
SG93210A1 (en) | 1999-06-29 | 2002-12-17 | Univ Singapore | Method for lamination of fluoropolymer to metal and printed circuit board (pcb) substrate |
US6054188A (en) | 1999-08-02 | 2000-04-25 | Becton Dickinson And Company | Non-ideal barrier coating architecture and process for applying the same to plastic substrates |
JP3640337B2 (ja) | 1999-10-04 | 2005-04-20 | 信越化学工業株式会社 | 圧力センサー装置 |
IL132898A (en) | 1999-11-11 | 2009-09-01 | Nds Ltd | System for bitstream generation |
EP1172393B1 (en) | 1999-12-17 | 2007-10-31 | DAICEL CHEMICAL INDUSTRIES, Ltd. | Curable resin composition, process for producing the same, and coated object made with the same |
US6335224B1 (en) | 2000-05-16 | 2002-01-01 | Sandia Corporation | Protection of microelectronic devices during packaging |
DE10026714A1 (de) | 2000-05-30 | 2001-12-13 | Hueck Folien Gmbh | Verbundfolie, Verfahren zu ihrer Herstellung und ihre Verwendung |
US7465478B2 (en) | 2000-08-11 | 2008-12-16 | Applied Materials, Inc. | Plasma immersion ion implantation process |
DE10051053A1 (de) | 2000-10-14 | 2002-05-02 | Bosch Gmbh Robert | Verfahren zum Schutz elektronischer oder mikromechanischer Bauteile |
US20020134588A1 (en) | 2000-12-18 | 2002-09-26 | Dollarhite James Michael | Hardsurfacing/hardfacing pertaining primarly to the horizontal directional drilling (HDD) industry utilizing technogenia |
DE10114897A1 (de) | 2001-03-26 | 2002-10-24 | Infineon Technologies Ag | Elektronisches Bauteil |
US6969472B2 (en) | 2001-04-19 | 2005-11-29 | Lsi Logic Corporation | Method of fabricating sub-micron hemispherical and hemicylidrical structures from non-spherically shaped templates |
JP2002329741A (ja) | 2001-05-07 | 2002-11-15 | Sumiden Magnet Wire Kk | 銅ボンディングワイヤー |
EP1260863A1 (en) | 2001-05-23 | 2002-11-27 | Scandinavian Micro Biodevices | Micropatterning of plasma polymerized coatings |
US6589639B2 (en) | 2001-05-23 | 2003-07-08 | International Business Machines Corporation | Hole fill composition and method for filling holes in a substrate |
US6803092B2 (en) | 2001-06-26 | 2004-10-12 | 3M Innovative Properties Company | Selective deposition of circuit-protective polymers |
EP1402321A1 (en) | 2001-07-04 | 2004-03-31 | Showa Denko K.K. | Resist curable resin composition and cured article thereof |
DE10133739A1 (de) | 2001-07-11 | 2003-01-30 | Mewa Textil Service Ag & Co Man Ohg | Transportbehälter |
EP1419286A1 (en) | 2001-08-20 | 2004-05-19 | Nova-Plasma Inc. | Coatings with low permeation of gases and vapors |
SG117395A1 (en) | 2001-08-29 | 2005-12-29 | Micron Technology Inc | Wire bonded microelectronic device assemblies and methods of manufacturing same |
US6500529B1 (en) | 2001-09-14 | 2002-12-31 | Tonoga, Ltd. | Low signal loss bonding ply for multilayer circuit boards |
JP4409134B2 (ja) | 2001-10-09 | 2010-02-03 | パナソニック株式会社 | 実装システム |
TW545092B (en) | 2001-10-25 | 2003-08-01 | Matsushita Electric Ind Co Ltd | Prepreg and circuit board and method for manufacturing the same |
JP4075379B2 (ja) | 2002-01-08 | 2008-04-16 | 株式会社デンソー | フッ素樹脂の表面処理方法およびフッ素樹脂を用いたプリント配線基板の製造方法 |
GB2384493A (en) | 2002-01-23 | 2003-07-30 | Oxley Dev Co Ltd | Selective electroless plating of ceramic substrates for use in capacitors |
US20030215588A1 (en) | 2002-04-09 | 2003-11-20 | Yeager Gary William | Thermoset composition, method, and article |
JP4499344B2 (ja) | 2002-05-28 | 2010-07-07 | 株式会社日立製作所 | 樹脂組成物とそれを用いたプリプレグ,積層板および多層プリント回路板 |
US20040229051A1 (en) * | 2003-05-15 | 2004-11-18 | General Electric Company | Multilayer coating package on flexible substrates for electro-optical devices |
US6776827B2 (en) | 2002-09-23 | 2004-08-17 | Syed M. Hasan | Method and solution for treating fluorocarbon surfaces |
JP2004184340A (ja) | 2002-12-05 | 2004-07-02 | Tanaka Kikinzoku Kogyo Kk | Dnaプローブ固定電極の製造方法 |
JP4208597B2 (ja) | 2003-02-17 | 2009-01-14 | シャープ株式会社 | 表示装置、およびこれを用いた携帯電話端末、モバイルゲーム端末、テレビ受像機、立体表示システム |
JP2005112981A (ja) | 2003-10-07 | 2005-04-28 | Hitachi Chem Co Ltd | 低誘電率樹脂組成物およびそれを用いたプリプレグ、金属張積層板、印刷配線板 |
US20050121226A1 (en) | 2003-10-21 | 2005-06-09 | Park Electrochemical Corporation | Laminates having a low dielectric constant, low disapation factor bond core and method of making same |
JP4896367B2 (ja) | 2003-10-23 | 2012-03-14 | パナソニック株式会社 | 電子部品の処理方法及び装置 |
US6923221B2 (en) | 2003-12-04 | 2005-08-02 | Gilbarco Inc. | Vapor recovery system with ORVR compensation |
JP4195365B2 (ja) | 2003-12-05 | 2008-12-10 | アルプス電気株式会社 | 難燃性及び耐湿性を有する回路基板 |
JP4551654B2 (ja) | 2003-12-09 | 2010-09-29 | 株式会社神戸製鋼所 | プリント配線基板の穴あけ加工に使用する樹脂被覆金属板 |
JP4694251B2 (ja) | 2004-06-10 | 2011-06-08 | 四国化成工業株式会社 | 無鉛半田付け用の銅または銅合金の表面処理剤及びその利用 |
US8183386B2 (en) | 2004-06-10 | 2012-05-22 | Shikoku Chemicals Corporation | Phenylnaphthylimidazole compound and usage of the same |
DE102004030388A1 (de) | 2004-06-23 | 2006-01-26 | Ormecon Gmbh | Artikel mit einer Beschichtung von elektrisch leitfähigem Polymer und Verfahren zu deren Herstellung |
US7673970B2 (en) | 2004-06-30 | 2010-03-09 | Lexmark International, Inc. | Flexible circuit corrosion protection |
JP5010112B2 (ja) | 2004-07-26 | 2012-08-29 | 新神戸電機株式会社 | プリプレグの製造法、積層板およびプリント配線板の製造法 |
US7749881B2 (en) | 2005-05-18 | 2010-07-06 | Intermolecular, Inc. | Formation of a masking layer on a dielectric region to facilitate formation of a capping layer on electrically conductive regions separated by the dielectric region |
WO2006036461A1 (en) | 2004-09-27 | 2006-04-06 | Dow Global Technologies Inc. | Multilayer coatings by plasma enhanced chemical vapor deposition |
US7399668B2 (en) | 2004-09-30 | 2008-07-15 | 3M Innovative Properties Company | Method for making electronic devices having a dielectric layer surface treatment |
JP4843214B2 (ja) | 2004-11-16 | 2011-12-21 | 株式会社東芝 | モジュール基板およびディスク装置 |
US7985677B2 (en) | 2004-11-30 | 2011-07-26 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing semiconductor device |
US7579134B2 (en) | 2005-03-15 | 2009-08-25 | E. I. Dupont De Nemours And Company | Polyimide composite coverlays and methods and compositions relating thereto |
KR100645641B1 (ko) | 2005-05-17 | 2006-11-14 | 삼성전기주식회사 | Ptfe를 이용한 인쇄회로기판용 임프린트 몰드 및 그제조방법 |
JP4262699B2 (ja) | 2005-06-22 | 2009-05-13 | 日本航空電子工業株式会社 | 配線基板 |
JP2007010794A (ja) | 2005-06-28 | 2007-01-18 | Hitachi Chem Co Ltd | 感光性樹脂組成物及び感光性エレメント |
JP2007084764A (ja) | 2005-09-26 | 2007-04-05 | Jsr Corp | コーティング材およびその製造方法 |
JP4722669B2 (ja) | 2005-10-26 | 2011-07-13 | 株式会社日立ハイテクインスツルメンツ | プラズマ洗浄装置 |
JP4438735B2 (ja) | 2005-10-31 | 2010-03-24 | 日本ピラー工業株式会社 | フッ素樹脂プリント基板 |
JP2007129039A (ja) | 2005-11-02 | 2007-05-24 | Nippon Pillar Packing Co Ltd | フッ素樹脂プリント基板及びその製造方法 |
US20070108161A1 (en) | 2005-11-17 | 2007-05-17 | Applied Materials, Inc. | Chamber components with polymer coatings and methods of manufacture |
US20070258722A1 (en) | 2006-05-08 | 2007-11-08 | Jin Yu | Optical receiver |
JP2007326956A (ja) | 2006-06-07 | 2007-12-20 | Kaneka Corp | プリプレグ、積層板、およびこれらからなるプリント配線板 |
US7527915B2 (en) | 2006-07-19 | 2009-05-05 | E. I. Du Pont De Nemours And Company | Flame retardant multi-layer photoimagable coverlay compositions and methods relating thereto |
US8004860B2 (en) | 2006-08-29 | 2011-08-23 | Texas Instruments Incorporated | Radiofrequency and electromagnetic interference shielding |
CN101145451B (zh) | 2006-08-29 | 2010-04-14 | 松下电器产业株式会社 | 触点开关 |
US20080102206A1 (en) | 2006-11-01 | 2008-05-01 | Sigurd Wagner | Multilayered coatings for use on electronic devices or other articles |
ITMI20062482A1 (it) | 2006-12-22 | 2007-03-23 | Ce S I Centro Studi Industriali Di Taddei Ing | Rivestimento ibrido idrorepellente e impermeabile all'umidita' per materiali compositi polimerici rinforzati deposto mediante pecvd |
US20090008796A1 (en) | 2006-12-29 | 2009-01-08 | United Test And Assembly Center Ltd. | Copper on organic solderability preservative (osp) interconnect |
US20080176096A1 (en) | 2007-01-22 | 2008-07-24 | Yen-Hang Cheng | Solderable layer and a method for manufacturing the same |
GB0703172D0 (en) | 2007-02-19 | 2007-03-28 | Pa Knowledge Ltd | Printed circuit boards |
US20140255288A1 (en) | 2007-02-21 | 2014-09-11 | Konica Minolta, Inc. | Gas barrier laminate and production method of the same |
US20080216704A1 (en) | 2007-03-09 | 2008-09-11 | Fisher Controls International Llc | Conformal Coating |
KR100882023B1 (ko) | 2007-05-25 | 2009-02-05 | 한국생산기술연구원 | 표면에너지 제어를 이용한 패터닝 방법 |
JP2009051876A (ja) | 2007-08-23 | 2009-03-12 | Three M Innovative Properties Co | コーティング組成物及びそれを使用した物品 |
US8962097B1 (en) | 2007-09-07 | 2015-02-24 | Edward Maxwell Yokley | Surface properties of polymeric materials with nanoscale functional coating |
US7923059B2 (en) | 2007-09-26 | 2011-04-12 | Intel Corporation | Method of enabling selective area plating on a substrate |
US8071160B2 (en) | 2007-10-29 | 2011-12-06 | Integrated Surface Technologies | Surface coating process |
US7651959B2 (en) | 2007-12-03 | 2010-01-26 | Asm Japan K.K. | Method for forming silazane-based dielectric film |
CN101302636A (zh) | 2008-01-18 | 2008-11-12 | 深圳市深南电路有限公司 | 金属件电镀方法 |
US8551560B2 (en) | 2008-05-23 | 2013-10-08 | Intermolecular, Inc. | Methods for improving selectivity of electroless deposition processes |
GB2462824A (en) | 2008-08-18 | 2010-02-24 | Crombie 123 Ltd | Printed circuit board encapsulation |
US8618420B2 (en) | 2008-08-18 | 2013-12-31 | Semblant Global Limited | Apparatus with a wire bond and method of forming the same |
WO2010020753A2 (en) | 2008-08-18 | 2010-02-25 | Semblant Limited | Halo-hydrocarbon polymer coating |
US7891091B2 (en) | 2008-11-25 | 2011-02-22 | Yonggang Li | Method of enabling selective area plating on a substrate |
KR20120042748A (ko) * | 2009-05-13 | 2012-05-03 | 씨브이 홀딩스 엘엘씨 | 코팅된 표면 검사를 위한 가스제거 방법 |
EP2438109A2 (en) | 2009-06-01 | 2012-04-11 | Board of Regents, The University of Texas System | Non-fouling receptor labeled multi-functional surfaces |
JP2011005837A (ja) | 2009-06-29 | 2011-01-13 | Dainippon Printing Co Ltd | ガスバリア性帯電防止粘着フィルム |
GB201003067D0 (en) | 2010-02-23 | 2010-04-07 | Semblant Ltd | Plasma-polymerized polymer coating |
GB201203927D0 (en) | 2012-03-06 | 2012-04-18 | Semblant Ltd | Coated electrical assembly |
US8995146B2 (en) | 2010-02-23 | 2015-03-31 | Semblant Limited | Electrical assembly and method |
US8824162B2 (en) | 2010-08-30 | 2014-09-02 | Apple Inc. | Electronic devices with moisture guiding structures |
US8766240B2 (en) | 2010-09-21 | 2014-07-01 | Universal Display Corporation | Permeation barrier for encapsulation of devices and substrates |
GB2485419B (en) | 2010-11-15 | 2015-02-25 | Semblant Ltd | Method for reducing creep corrosion |
KR101844557B1 (ko) | 2011-02-08 | 2018-04-02 | 어플라이드 머티어리얼스, 인코포레이티드 | 유기 발광 다이오드의 하이브리드 캡슐화를 위한 방법 |
DE102011017403A1 (de) | 2011-04-18 | 2012-10-18 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zum Abscheiden eines transparenten Barriereschichtsystems |
US9884341B2 (en) | 2011-08-12 | 2018-02-06 | Massachusetts Institute Of Technology | Methods of coating surfaces using initiated plasma-enhanced chemical vapor deposition |
CN107262347A (zh) * | 2012-03-06 | 2017-10-20 | 赛姆布兰特有限公司 | 涂覆的电气组件 |
US9312511B2 (en) * | 2012-03-16 | 2016-04-12 | Universal Display Corporation | Edge barrier film for electronic devices |
US9299956B2 (en) | 2012-06-13 | 2016-03-29 | Aixtron, Inc. | Method for deposition of high-performance coatings and encapsulated electronic devices |
US9449809B2 (en) | 2012-07-20 | 2016-09-20 | Applied Materials, Inc. | Interface adhesion improvement method |
US20150314588A1 (en) | 2012-10-26 | 2015-11-05 | Taiyo Chemical Industry Co., Ltd. | Mesh structure and method for manufacturing the same |
KR101992899B1 (ko) | 2012-12-17 | 2019-06-25 | 엘지디스플레이 주식회사 | 터치 패널 내장형 유기 발광 다이오드 표시 장치 및 이의 제조 방법 |
US9348228B2 (en) | 2013-01-03 | 2016-05-24 | Globalfoundries Inc. | Acid-strippable silicon-containing antireflective coating |
US9352493B2 (en) * | 2013-02-08 | 2016-05-31 | Johnson & Johnson Vision Care, Inc. | Casting cup assembly for forming an ophthalmic device |
CA2904611C (en) | 2013-03-11 | 2021-11-23 | Sio2 Medical Products, Inc. | Coated packaging |
GB201305500D0 (en) | 2013-03-26 | 2013-05-08 | Semblant Ltd | Coated electrical assembly |
GB2539231B (en) | 2015-06-10 | 2017-08-23 | Semblant Ltd | Coated electrical assembly |
GB201514501D0 (en) | 2015-08-14 | 2015-09-30 | Semblant Ltd | Electroless plating method |
CN113955108A (zh) | 2016-08-26 | 2022-01-21 | 索尼公司 | 信息处理装置、其控制方法、移动单元及记录介质 |
GB201621177D0 (en) * | 2016-12-13 | 2017-01-25 | Semblant Ltd | Protective coating |
KR20200133377A (ko) | 2018-03-26 | 2020-11-27 | 호야 가부시키가이샤 | 마스크 블랭크, 위상 시프트 마스크 및 반도체 디바이스의 제조 방법 |
TWI732673B (zh) | 2020-09-09 | 2021-07-01 | 華碩電腦股份有限公司 | 電子裝置 |
GB2613160A (en) | 2021-11-24 | 2023-05-31 | Eaton Intelligent Power Ltd | Push button |
-
2016
- 2016-12-13 GB GBGB1621177.3A patent/GB201621177D0/en not_active Ceased
-
2017
- 2017-12-12 JP JP2019531224A patent/JP2020502791A/ja active Pending
- 2017-12-12 RU RU2019117901A patent/RU2019117901A/ru unknown
- 2017-12-12 EP EP17818219.2A patent/EP3491903B1/en active Active
- 2017-12-12 CA CA3046050A patent/CA3046050A1/en not_active Abandoned
- 2017-12-12 US US16/466,743 patent/US11786930B2/en active Active
- 2017-12-12 ES ES17818219T patent/ES2777473T3/es active Active
- 2017-12-12 DK DK17818219.2T patent/DK3491903T3/da active
- 2017-12-12 WO PCT/GB2017/053720 patent/WO2018109459A1/en active Application Filing
- 2017-12-12 CN CN201780077033.8A patent/CN110268810A/zh active Pending
- 2017-12-12 AU AU2017374765A patent/AU2017374765A1/en not_active Abandoned
- 2017-12-12 KR KR1020197019437A patent/KR20190119030A/ko unknown
- 2017-12-13 TW TW106143698A patent/TW201835370A/zh unknown
-
2023
- 2023-10-16 US US18/487,203 patent/US20240050982A1/en active Pending
Also Published As
Publication number | Publication date |
---|---|
JP2020502791A (ja) | 2020-01-23 |
WO2018109459A1 (en) | 2018-06-21 |
US20190344307A1 (en) | 2019-11-14 |
EP3491903A1 (en) | 2019-06-05 |
RU2019117901A (ru) | 2021-01-15 |
CA3046050A1 (en) | 2018-06-21 |
AU2017374765A1 (en) | 2019-06-06 |
TW201835370A (zh) | 2018-10-01 |
EP3491903B1 (en) | 2020-01-29 |
CN110268810A (zh) | 2019-09-20 |
ES2777473T3 (es) | 2020-08-05 |
GB201621177D0 (en) | 2017-01-25 |
US11786930B2 (en) | 2023-10-17 |
KR20190119030A (ko) | 2019-10-21 |
US20240050982A1 (en) | 2024-02-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DK3194508T3 (da) | Fremgangsmåde til tilvejebringelse af et substrat med en antimikrobiel coating og coatede substrater, der kan opnås dermed | |
DK3030530T4 (da) | Substrat med en funktionel belægning og et midlertidigt beskyttelseslag | |
DK3632274T3 (da) | Beholder og fremgangsmåde til dannelse af en beholder | |
DK3442702T3 (da) | Fremgangsmåde til belægning af et substrat med et partikelstabiliseret skum | |
DK3606760T3 (da) | Indretning og fremgangsmåde til belægning af overflader | |
DK3443426T3 (da) | Transportfartøj og en fremgangsmåde til styring af et transportfartøj | |
DK3491903T3 (da) | Fremgangsmåde til aflejring af en beskyttelsescoating og et substrat med en beskyttelsescoating | |
MA50019A (fr) | Substrat métallique revêtu | |
DK3256907T3 (da) | Fremgangsmåde til teksturering af diskrete substrater | |
PL3445732T3 (pl) | Powlekane powierzchnie szkła i sposób powlekania powierzchni szkła | |
SG11201710300SA (en) | Substrate holding device, film deposition device, and substrate holding method | |
DK3410858T3 (da) | System til opbevaring og dosering af ingredienser og fremgangsmåde for dosering og afsætning af ingredienser på et substrat | |
DK3464487T3 (da) | To-komponent-spartelmasse, fremgangsmåde til belægning af et underlag med en sådan spartelmasse, underlag belagt med en sådan spartelmasse og anvendelse af en sådan spartelmasse til forbedring af erosionsbestanddighed | |
DK3447051T3 (da) | Fremgangsmåde til fremstilling af tyrosinkinaseinhibitor og derivat deraf | |
DK3354118T3 (da) | Polymerbelægninger og fremgangsmåder til aflejring af polymerbelægninger | |
DK3350597T3 (da) | Anvendelse af substrat til fluorescensforstærkning | |
GB201610731D0 (en) | Method of coating or repairing substrates | |
DK3526042T3 (da) | Indretning til laminering af et substrat med et termoplastisk belægningsmateriale | |
DK3589474T3 (da) | Fremgangsmåde til påføring og vedhæftning af hot-melt-inklusionspolymerer til substrater | |
DK3491172T3 (da) | Fremgangsmåde og anlæg til fremstilling af methan | |
DK3095890T3 (da) | Fremgangsmåde til påføring af tynde lag på substrater samt anordning til fremstilling heraf | |
DK3313657T3 (da) | Belægningssystem til belægning af en overflade af et substrat | |
DK3380647T3 (da) | Fremgangsmåde til overfladebehandling af en film i bevægelse og anlæg til udførelse af denne fremgangsmåde | |
FI20165543A (fi) | Menetelmä ja laitteisto substraatin pinnoittamiseksi | |
GB2541756B (en) | Coated substrate and method of fabrication thereof |