DE19840926B4 - Anordnung zur Materialbearbeitung mittels Laserstrahlen und deren Verwendung - Google Patents

Anordnung zur Materialbearbeitung mittels Laserstrahlen und deren Verwendung Download PDF

Info

Publication number
DE19840926B4
DE19840926B4 DE19840926A DE19840926A DE19840926B4 DE 19840926 B4 DE19840926 B4 DE 19840926B4 DE 19840926 A DE19840926 A DE 19840926A DE 19840926 A DE19840926 A DE 19840926A DE 19840926 B4 DE19840926 B4 DE 19840926B4
Authority
DE
Germany
Prior art keywords
laser
fiber
arrangement
processing
lens
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE19840926A
Other languages
German (de)
English (en)
Other versions
DE19840926A1 (de
Inventor
Heinrich Jürgensen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hell Gravure Systems GmbH and Co KG
Original Assignee
Hell Gravure Systems GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to DE19840926A priority Critical patent/DE19840926B4/de
Application filed by Hell Gravure Systems GmbH and Co KG filed Critical Hell Gravure Systems GmbH and Co KG
Priority to JP2000568629A priority patent/JP4092080B2/ja
Priority to EP99953638A priority patent/EP1112140B1/de
Priority to PCT/DE1999/002721 priority patent/WO2000013839A1/de
Priority to EP06001812A priority patent/EP1666186A1/de
Priority to EP05013205A priority patent/EP1595697A3/de
Priority to EP06001813A priority patent/EP1666187A1/de
Priority to EP05009046A priority patent/EP1579944A3/de
Priority to EP05009146.1A priority patent/EP1623789B1/de
Priority to EP05013204A priority patent/EP1637273A3/de
Priority to EP05016061A priority patent/EP1655098A3/de
Priority to US09/786,742 priority patent/US6888853B1/en
Publication of DE19840926A1 publication Critical patent/DE19840926A1/de
Priority to US10/909,670 priority patent/US20050013328A1/en
Priority to JP2004224831A priority patent/JP4146401B2/ja
Priority to JP2004224830A priority patent/JP2004349721A/ja
Priority to JP2005288455A priority patent/JP2006103324A/ja
Priority to US11/483,361 priority patent/US20060255023A1/en
Priority to US11/483,365 priority patent/US20060249488A1/en
Priority to US11/483,353 priority patent/US20060250658A1/en
Priority to JP2006274199A priority patent/JP2007125616A/ja
Priority to JP2007112127A priority patent/JP2007275993A/ja
Application granted granted Critical
Publication of DE19840926B4 publication Critical patent/DE19840926B4/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
    • B41C1/00—Forme preparation
    • B41C1/02—Engraving; Heads therefor
    • B41C1/04—Engraving; Heads therefor using heads controlled by an electric information signal
    • B41C1/05—Heat-generating engraving heads, e.g. laser beam, electron beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0608—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0613—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams having a common axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0652—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B23K26/0676—Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • B23K26/0861—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane in at least in three axial directions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
    • B23K26/0884—Devices involving movement of the laser head in at least one axial direction in at least two axial directions in at least in three axial directions, e.g. manipulators, robots
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1462—Nozzles; Features related to nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Robotics (AREA)
  • Manufacture Or Reproduction Of Printing Formes (AREA)
  • Laser Beam Processing (AREA)
  • Lasers (AREA)
  • Printing Plates And Materials Therefor (AREA)
  • Lenses (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Semiconductor Lasers (AREA)
DE19840926A 1998-09-08 1998-09-08 Anordnung zur Materialbearbeitung mittels Laserstrahlen und deren Verwendung Expired - Lifetime DE19840926B4 (de)

Priority Applications (21)

Application Number Priority Date Filing Date Title
DE19840926A DE19840926B4 (de) 1998-09-08 1998-09-08 Anordnung zur Materialbearbeitung mittels Laserstrahlen und deren Verwendung
US09/786,742 US6888853B1 (en) 1998-09-08 1999-09-01 Laser radiation source
PCT/DE1999/002721 WO2000013839A1 (de) 1998-09-08 1999-09-01 Laserstrahlungsquelle
EP06001812A EP1666186A1 (de) 1998-09-08 1999-09-01 Verfahren und Vorrichtung zur Herstellung einer Druckform für den Tiefdruck mittels eines Laserstrahls
EP05013205A EP1595697A3 (de) 1998-09-08 1999-09-01 Verfahren zur Erzeugung von Vertiefungen in einer Druckform, eine Laserquelle umfassend
EP06001813A EP1666187A1 (de) 1998-09-08 1999-09-01 Verfahren und Vorrichtung zur Herstellung einer Druckform für den Flexodruck mittels eines Laserstrahls
EP05009046A EP1579944A3 (de) 1998-09-08 1999-09-01 Laserstrahlungsquelle
EP05009146.1A EP1623789B1 (de) 1998-09-08 1999-09-01 Laserstrahlungsquelle
EP05013204A EP1637273A3 (de) 1998-09-08 1999-09-01 Vorrichtung zur Erzeugung von Näpfchen, Vertiefungen und Ausnehmungen auf einer Druckform mittels eines Laserstrahls
EP05016061A EP1655098A3 (de) 1998-09-08 1999-09-01 Verfahren und Vorrichtung zur Herstellung einer Druckform sowie Druckform
JP2000568629A JP4092080B2 (ja) 1998-09-08 1999-09-01 凸版またはフレキソ版用の微細構造を有する刷版の製造方法
EP99953638A EP1112140B1 (de) 1998-09-08 1999-09-01 Laserstrahlungsquelle
JP2004224830A JP2004349721A (ja) 1998-09-08 2004-07-30 レーザ照射源、レーザ照射源による材料加工装置および該材料加工装置の運転法
US10/909,670 US20050013328A1 (en) 1998-09-08 2004-07-30 Laser radiation source
JP2004224831A JP4146401B2 (ja) 1998-09-08 2004-07-30 凹版、凸版又はフレキソ版の刷版に微細構造を有する凹みを彫刻する装置
JP2005288455A JP2006103324A (ja) 1998-09-08 2005-09-30 凹版用刷版を製造する方法
US11/483,361 US20060255023A1 (en) 1998-09-08 2006-07-06 Processing spot defined by a plurality of laser beams
US11/483,365 US20060249488A1 (en) 1998-09-08 2006-07-06 Laser radiation source
US11/483,353 US20060250658A1 (en) 1998-09-08 2006-07-06 Forming a rotogravure cup from small cups
JP2006274199A JP2007125616A (ja) 1998-09-08 2006-10-05 レーザビームを用いて凹版、凸版又はフレキソ版に対する刷版に凹みを作製する方法および装置
JP2007112127A JP2007275993A (ja) 1998-09-08 2007-04-20 凸版またはフレキソ版用の微細構造を有する刷版の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19840926A DE19840926B4 (de) 1998-09-08 1998-09-08 Anordnung zur Materialbearbeitung mittels Laserstrahlen und deren Verwendung

Publications (2)

Publication Number Publication Date
DE19840926A1 DE19840926A1 (de) 2000-05-04
DE19840926B4 true DE19840926B4 (de) 2013-07-11

Family

ID=7880183

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19840926A Expired - Lifetime DE19840926B4 (de) 1998-09-08 1998-09-08 Anordnung zur Materialbearbeitung mittels Laserstrahlen und deren Verwendung

Country Status (5)

Country Link
US (5) US6888853B1 (enExample)
EP (8) EP1666187A1 (enExample)
JP (6) JP4092080B2 (enExample)
DE (1) DE19840926B4 (enExample)
WO (1) WO2000013839A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016121707A1 (de) 2016-11-14 2018-05-17 ECO Holding 1 GmbH Verfahren zur Bearbeitung einer Innenoberfläche einer Ventilbuchse, Ventilbuchse und Vorrichtung zur Bearbeitung einer Innenoberfläche einer Ventilbuchse

Families Citing this family (143)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090281531A1 (en) * 1995-08-31 2009-11-12 Rizoiu Ioana M Interventional and therapeutic electromagnetic energy systems
DE19840927B4 (de) * 1998-09-08 2009-07-02 Hell Gravure Systems Gmbh & Co. Kg Laserstrahlungsquelle hoher Leistungsdichte und hoher Energie zur Materialbearbeitung
DE19840926B4 (de) * 1998-09-08 2013-07-11 Hell Gravure Systems Gmbh & Co. Kg Anordnung zur Materialbearbeitung mittels Laserstrahlen und deren Verwendung
DE19840936B4 (de) * 1998-09-08 2005-03-10 Hell Gravure Systems Gmbh Anordnung zum mehrkanaligen Schneiden und Ritzen von Materialien mittels Laserstrahlen
US20060249491A1 (en) * 1999-09-01 2006-11-09 Hell Gravure Systems Gmbh Laser radiation source
DE10014900A1 (de) 2000-03-24 2001-09-27 Mahle Gmbh Kolben für Verbrennungsmotoren
DE20122783U1 (de) * 2000-06-17 2007-11-15 Leica Microsystems Cms Gmbh Anordnung zum Untersuchen mikroskopischer Präparate mit einem Scanmikroskop und Beleuchtungseinrichtung für ein Scanmikroskop
DE10115509A1 (de) 2000-06-17 2001-12-20 Leica Microsystems Anordnung zum Untersuchen mikroskopischer Präparate mit einem Scanmikroskop und Beleuchtungseinrichtung für ein Scanmikroskop
DE20122782U1 (de) * 2000-06-17 2007-11-15 Leica Microsystems Cms Gmbh Beleuchtungseinrichtung
DE10148759B8 (de) * 2000-10-02 2005-06-30 Laser 2000 Gmbh Verfahren zur Erzeugung einer Lasergravur in eine Oberfläche eines Substrates
US20040029048A1 (en) * 2000-11-15 2004-02-12 Jakob Frauchiger Method for the production of screen cavities in a rotogravure form and base body applicable in said method
DE10058990C2 (de) * 2000-11-28 2003-03-06 Heidelberger Druckmasch Ag Vorrichtung zur Bestrahlung eines Objektes für eine Aufzeichnung eines visuellen Produktes
DE10058999A1 (de) 2000-11-28 2002-05-29 Heidelberger Druckmasch Ag Verfahren und Vorrichtung zur Modulation von unpolarisiertem Licht
DE10105978B4 (de) * 2001-02-09 2011-08-11 HELL Gravure Systems GmbH & Co. KG, 24148 Mehrstrahl-Abtastvorrichtung zur Abtastung eines fotoempfindlichen Materials mit einem Multi-Spot-Array sowie Verfahren zur Korrektur der Position von Bildpunkten des Multi-Spot-Arrays
DE10109041A1 (de) * 2001-02-24 2002-09-05 Heidelberger Druckmasch Ag Verfahren und Mehrstrahl-Abtastvorrichtung zur Ablation von Flexo-Druckplatten durch Lasergravur
DE10123672B4 (de) * 2001-05-16 2006-12-21 Koenig & Bauer Ag Verfahren und System zum Bebildern in Druckmaschinen
DE10125598A1 (de) * 2001-05-25 2002-12-12 Combiflex Coating Gmbh Verfahren und Vorrichtung zum Herstellen einer Siebdruckschablone zum Aufbringen von Klebstoff
US6927359B2 (en) 2001-06-14 2005-08-09 Advanced Cardiovascular Systems, Inc. Pulsed fiber laser cutting system for medical implants
DE10129874B4 (de) * 2001-06-21 2004-11-18 Heidelberger Druckmaschinen Ag Mehrstrahl-Abtastvorrichtung sowie Verfahren zu ihrer Justierung
JP2003039189A (ja) * 2001-07-27 2003-02-12 Hamamatsu Photonics Kk レーザ光照射装置及び表面処理方法
US7044583B2 (en) 2001-10-25 2006-05-16 Heidelberger Druckmaschinen Ag Method and device for exposing a printing form, printing unit and printing press having the device
EP1500484B1 (en) * 2002-03-12 2011-07-13 Mitsuboshi Diamond Industrial Co., Ltd. Method and system for machining fragile material
EP1369230A1 (en) * 2002-06-05 2003-12-10 Kba-Giori S.A. Method of manufacturing an engraved plate
DE50212323D1 (de) * 2002-08-01 2008-07-10 Trumpf Werkzeugmaschinen Gmbh Laserbearbeitungsmaschine
DE10304474A1 (de) * 2003-02-04 2004-08-12 Linde Ag Verfahren zum Laserstrahlschweißen
US7763179B2 (en) * 2003-03-21 2010-07-27 Digimarc Corporation Color laser engraving and digital watermarking
DE20308097U1 (de) * 2003-05-23 2004-09-23 Kuka Schweissanlagen Gmbh Lasereinrichtung
US8233800B2 (en) * 2003-06-26 2012-07-31 Fujitsu Limited Method and system for upgrading a fiber optics network
DE10336097B3 (de) * 2003-08-06 2005-03-10 Testo Ag Visiereinrichtung für ein Radiometer sowie Verfahren
JP3753326B2 (ja) 2003-12-15 2006-03-08 セイコーエプソン株式会社 直進光制御部付きレンズ基板の製造方法、直進光制御部付きレンズ基板、透過型スクリーンおよびリア型プロジェクタ
DE202004013136U1 (de) * 2004-03-11 2005-07-21 Kuka Schweissanlagen Gmbh Modulare Lichtwellenoptik
JP2005303166A (ja) * 2004-04-15 2005-10-27 Fujikura Ltd 光ファイバ端面構造、光ファイバレーザ及びレーザ加工装置
EP1593493A1 (de) * 2004-05-05 2005-11-09 Hell Gravure Systems GmbH Vorrichtung zur Gravur von Näpfchen in Druckzylindern mittels Laserlichts
KR101290665B1 (ko) * 2004-06-07 2013-07-30 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 레이저 시스템 성능 향상을 위한 ａｏｍ 변조 기술
US20060279793A1 (en) * 2004-07-30 2006-12-14 Hell Gravure Systems Gmbh Printing form processing with a plurality of engraving tool tracks forming lines
JP4660746B2 (ja) * 2004-08-03 2011-03-30 ソニー株式会社 レーザー照射装置
DE502005009577D1 (de) 2004-08-18 2010-06-24 Arctos Showlasertechnik E K Laservorrichtung zur Erzeugung eines Laserstrahls
DE202004012992U1 (de) * 2004-08-19 2005-12-29 Storz Endoskop Produktions Gmbh Endoskopisches Video-Meßsystem
WO2006037370A1 (de) * 2004-10-06 2006-04-13 Hentze-Lissotschenko Patentverwaltungs Gmbh & Co. Kg Laseranordnung
DE502005007859D1 (de) 2004-10-06 2009-09-17 Limo Patentverwaltung Gmbh Laseranordnung
US20060186098A1 (en) * 2005-02-23 2006-08-24 Caristan Charles L Method and apparatus for laser processing
KR100672830B1 (ko) * 2005-03-21 2007-01-22 삼성전자주식회사 라벨 마킹 방법 및 이를 이용한 라벨 마킹 장치
EP1883381A4 (en) * 2005-05-25 2010-03-17 Biolase Tech Inc ELECTROMAGNETIC ENERGY DISPLACEMENT DEVICE WITH INCREASED POINT SIZE
EP1910874A4 (en) * 2005-08-03 2009-08-05 Corning Inc FAR-UV UV TELECENTRY IMAGING SYSTEM WITH AXISYMETRIC BIREFRINGENT ELEMENT AND POLAR ORTHOGONAL POLARIZATION
JP2007190560A (ja) 2006-01-17 2007-08-02 Miyachi Technos Corp レーザ加工装置
US8066940B2 (en) 2006-06-30 2011-11-29 Zuvo Water, Llc Apparatus and method for removing arsenic and inorganic compositions from water
US8066941B2 (en) 2006-06-30 2011-11-29 Zuvo Water, Llc Apparatus and method for purifying water in a storage tank
JP2008055456A (ja) * 2006-08-30 2008-03-13 Sumitomo Electric Ind Ltd 半田付け方法および半田付け用レーザ装置
KR20090103861A (ko) * 2006-10-05 2009-10-01 델라웨어 스테이트 유니버시티 파운데이션 인코포레이티드 광섬유 사운드 검출기
US8604381B1 (en) * 2006-10-12 2013-12-10 Purdue Research Foundation Integrated laser material processing cell
US7827912B2 (en) * 2006-12-22 2010-11-09 Eastman Kodak Company Hybrid optical head for direct engraving of flexographic printing plates
US7843633B2 (en) * 2007-01-15 2010-11-30 Sumitomo Electric Industries, Ltd. Laser processing apparatus
DE102007006330A1 (de) 2007-02-08 2008-08-14 Robert Bosch Gmbh Verfahren und Vorrichtung zum Laserschweißen
JP2008258323A (ja) * 2007-04-03 2008-10-23 Furukawa Electric Co Ltd:The パルスレーザ装置
US7717040B2 (en) * 2007-06-05 2010-05-18 Eastman Kodak Company Plate cutting and imaging with same device
CN100465681C (zh) * 2007-06-21 2009-03-04 武汉凌云光电科技有限责任公司 激光加热装置
DE102007032903A1 (de) * 2007-07-14 2009-01-15 Schepers Gmbh + Co. Kg Verfahren zum Betreiben einer Lasergravureinrichtung
DE102007051294B4 (de) * 2007-07-20 2012-03-22 Lasos Lasertechnik Gmbh Optische Steckverbindung für Lichtwellenleiter
US20090029292A1 (en) 2007-07-23 2009-01-29 Haim Chayet Engraving with amplifier having multiple exit ports
JP5176853B2 (ja) * 2007-10-09 2013-04-03 住友電気工業株式会社 光学モジュール及びそれを含む光源装置
DE102007050339B4 (de) 2007-10-18 2009-10-08 Hell Gravure Systems Gmbh & Co. Kg Vorrichtung zur Bereitstellung von bebilderten oder von bebilderten und unbebilderten Flexodruckzylindern und / oder Flexodruckhülsen
JP5192213B2 (ja) * 2007-11-02 2013-05-08 株式会社ディスコ レーザー加工装置
JP5105062B2 (ja) * 2007-12-21 2012-12-19 Ｎｅｃディスプレイソリューションズ株式会社 光学装置及び投射型表示装置
JP2009195976A (ja) * 2008-02-25 2009-09-03 Sumitomo Electric Ind Ltd 戻り光測定方法、戻り光測定装置及びレーザ加工方法
CN101959637A (zh) * 2008-03-27 2011-01-26 松下电器产业株式会社 印字装置及使用印字装置的印字方法
US8126028B2 (en) * 2008-03-31 2012-02-28 Novasolar Holdings Limited Quickly replaceable processing-laser modules and subassemblies
US8423879B2 (en) 2008-05-14 2013-04-16 Honeywell International Inc. Method and apparatus for test generation from hybrid diagrams with combined data flow and statechart notation
JP5153483B2 (ja) * 2008-06-30 2013-02-27 三菱電機株式会社 レーザ光源装置
WO2010002003A1 (ja) * 2008-07-03 2010-01-07 株式会社フジクラ パルス光発生器及びパルスファイバレーザ
US8563892B2 (en) * 2008-09-24 2013-10-22 Standex International Corporation Method and apparatus for laser engraving
EP2182596A1 (de) 2008-10-31 2010-05-05 LFK-Lenkflugkörpersysteme GmbH Taktischer Strahler für gerichtete Energie
KR100982308B1 (ko) * 2008-12-12 2010-09-15 삼성모바일디스플레이주식회사 레이저 시스템
US8462391B2 (en) * 2009-03-13 2013-06-11 Heidelberger Druckmaschinen Ag Method for producing a pseudo-stochastic master surface, master surface, method for producing a cylinder cover, cylinder cover, machine processing printing material, method for producing printed products and method for microstamping printing products
JP5280919B2 (ja) * 2009-03-31 2013-09-04 富士フイルム株式会社 露光装置および製版装置
KR101250093B1 (ko) * 2009-05-15 2013-04-02 도요타지도샤가부시키가이샤 레이저 용접 방법 및 그것을 포함하는 전지의 제조 방법
EP2428307B1 (de) * 2010-09-10 2016-03-16 ACSYS Lasertechnik GmbH Verfahren zur Erzeugung von rauen Oberflächenstrukturen
KR101204562B1 (ko) * 2010-11-24 2012-11-23 삼성전기주식회사 적층 세라믹 전자 부품 제조 방법
US8984488B2 (en) 2011-01-14 2015-03-17 Honeywell International Inc. Type and range propagation through data-flow models
DE102011013423A1 (de) * 2011-03-07 2012-09-13 abc packmedia GmbH & Co.KG Verfahren und Einrichtung zur Modellbildung von zu prägenden Objekten und Herstellung eines Prägewerkzeugs
EP2683553B1 (de) 2011-03-09 2016-04-06 HELL Gravure Systems GmbH & Co. KG Verfahren und vorrichtung zur bearbeitung eines zylinders, insbesondere eines druck- oder prägezylinders
ES2444504T3 (es) 2011-09-05 2014-02-25 ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung Dispositivo láser con una unidad láser, y un recipiente de fluido para medios de refrigeración de dicha unidad láser
ES2530070T3 (es) * 2011-09-05 2015-02-26 ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung Aparato de marcado con una pluralidad de láseres y conjuntos ajustables individualmente de medios de desviación
EP2564976B1 (en) 2011-09-05 2015-06-10 ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung Marking apparatus with at least one gas laser and heat dissipator
ES2452529T3 (es) 2011-09-05 2014-04-01 ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung Dispositivo láser y procedimiento para marcar un objeto
DK2564973T3 (en) * 2011-09-05 2015-01-12 Alltec Angewandte Laserlicht Technologie Ges Mit Beschränkter Haftung Marking apparatus having a plurality of lasers and a kombineringsafbøjningsindretning
EP2565673B1 (en) 2011-09-05 2013-11-13 ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung Device and method for marking of an object by means of a laser beam
EP2564974B1 (en) * 2011-09-05 2015-06-17 ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung Marking apparatus with a plurality of gas lasers with resonator tubes and individually adjustable deflection means
EP2564972B1 (en) * 2011-09-05 2015-08-26 ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung Marking apparatus with a plurality of lasers, deflection means and telescopic means for each laser beam
JP5496162B2 (ja) * 2011-09-26 2014-05-21 富士フイルム株式会社 凸版印刷版の製造方法、凸版印刷版作成装置、並びにプログラム
JP6072046B2 (ja) * 2011-10-05 2017-02-01 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ レーザ処理システム内の粒子制御
KR20130039955A (ko) 2011-10-13 2013-04-23 현대자동차주식회사 용접용 레이저 장치
JP6006926B2 (ja) * 2011-10-17 2016-10-12 富士インパルス株式会社 シーリング方法、ヒートシール装置、被シール物、弾性体
JP5915071B2 (ja) * 2011-10-18 2016-05-11 株式会社村田製作所 グラビア印刷装置
DE102011085929C5 (de) * 2011-11-08 2014-06-12 Trumpf Laser Gmbh + Co. Kg Strahlweiche und Laserbearbeitungsanlage damit
CN103212862B (zh) * 2012-01-19 2015-09-30 昆山思拓机器有限公司 一种兼容干切和湿切的薄壁管材激光加工设备及方法
US8970455B2 (en) 2012-06-28 2015-03-03 Google Technology Holdings LLC Systems and methods for processing content displayed on a flexible display
JP6068859B2 (ja) * 2012-07-31 2017-01-25 株式会社ディスコ レーザー加工装置
JP6091832B2 (ja) * 2012-10-03 2017-03-08 株式会社東芝 吸光光度分析装置および方法
DE102012219249A1 (de) * 2012-10-22 2014-02-13 Bundesdruckerei Gmbh Vorrichtung zur Laserpersonalisierung von Sicherheitselementen
US9346122B1 (en) * 2013-01-08 2016-05-24 Universal Laser Systems, Inc. Multi-wavelength laser processing systems and associated methods of use and manufacture
PL222897B1 (pl) * 2013-01-27 2016-09-30 Inst Optyki Stosowanej Układ do detekcji sygnałów RF
KR20140118554A (ko) * 2013-03-29 2014-10-08 삼성디스플레이 주식회사 광학계 및 기판 밀봉 방법
US10307864B2 (en) * 2013-12-13 2019-06-04 Avonisys Ag Methods and systems to keep a work piece surface free from liquid accumulation while performing liquid-jet guided laser based material processing
CN103766317B (zh) * 2014-02-08 2015-11-18 江苏大学 一种基于热伤除草的全覆盖激光点阵结构和方法
US10074954B1 (en) * 2014-07-03 2018-09-11 Nlight, Inc. High efficiency, low cost, laser power supply
JP5941113B2 (ja) * 2014-09-30 2016-06-29 ファナック株式会社 集光径を拡大できるレーザ加工装置
US10912719B2 (en) 2014-10-20 2021-02-09 The Procter And Gamble Company Personal care composition and method of making
KR102309213B1 (ko) * 2015-03-06 2021-10-05 인텔 코포레이션 레이저 빔 조향용 음향 광학 편향기 및 거울
JP6495059B2 (ja) * 2015-03-18 2019-04-03 三菱重工業株式会社 レーザアレイデバイス
CN106735927A (zh) * 2015-11-24 2017-05-31 衡阳市维达胜电气自动化设备有限公司 一种激光自动数控切割机
US10945935B2 (en) 2016-06-27 2021-03-16 The Procter And Gamble Company Shampoo composition containing a gel network
WO2018071353A1 (en) 2016-10-10 2018-04-19 The Procter & Gamble Company Personal care compositions substantially free of sulfated surfactants and containing a gel network
US10401704B2 (en) * 2016-11-11 2019-09-03 Asml Netherlands B.V. Compensating for a physical effect in an optical system
JP6496340B2 (ja) * 2017-03-17 2019-04-03 ファナック株式会社 スキャナ制御装置、ロボット制御装置及びリモートレーザ溶接ロボットシステム
US10471542B1 (en) * 2017-06-27 2019-11-12 United States Of America As Represented By The Administrator Of Nasa Cladding and freeform deposition for coolant channel closeout
JP6923158B2 (ja) * 2017-07-27 2021-08-18 三菱重工業株式会社 レーザービーム照射装置及びレーザービーム照射システム
US10665504B2 (en) 2017-07-28 2020-05-26 Veeco Instruments Inc. Laser-based systems and methods for melt-processing of metal layers in semiconductor manufacturing
US10005290B1 (en) 2017-11-17 2018-06-26 Capital One Services, Llc Laser assembly for a laser printer
JP6822385B2 (ja) * 2017-11-30 2021-01-27 ブラザー工業株式会社 レーザ加工装置
KR102269052B1 (ko) * 2018-01-23 2021-06-24 (주)엔피에스 레이저 절단 시스템
CN111837063B (zh) * 2018-03-12 2024-07-02 古河电气工业株式会社 具备光束重叠机构的光纤束
EP3744468B1 (en) * 2018-03-23 2024-03-06 Primetals Technologies Japan, Ltd. Laser processing device, and method for adjusting a laser processing head
MX2020013252A (es) 2018-06-05 2021-02-22 Procter & Gamble Composicion de limpieza clara.
CN109551124B (zh) * 2018-12-06 2021-03-02 南京三乐集团有限公司 一种钛泵泵芯组件的激光焊工装及其焊接方法
EP3894015A1 (en) 2018-12-14 2021-10-20 The Procter & Gamble Company Shampoo composition comprising sheet-like microcapsules
KR102131951B1 (ko) * 2019-04-19 2020-07-09 (주)인터체크 일체형 레이저 홀더를 구비한 레이저 어셈블리
US11896689B2 (en) 2019-06-28 2024-02-13 The Procter & Gamble Company Method of making a clear personal care comprising microcapsules
EP3943230B1 (en) * 2019-07-31 2025-06-25 Mitsubishi Heavy Industries, Ltd. Laser processing device
RU2721244C1 (ru) * 2019-11-11 2020-05-18 федеральное государственное бюджетное образовательное учреждение высшего образования "Пермский национальный исследовательский политехнический университет" Способ контроля процесса лазерной обработки металла
TWI744794B (zh) * 2020-02-12 2021-11-01 財團法人工業技術研究院 掃描式光源模組
JP7453395B2 (ja) 2020-02-14 2024-03-19 ザ プロクター アンド ギャンブル カンパニー 中に懸濁された審美的設計を有する液体組成物の保管に適合されたボトル
CN111455377B (zh) * 2020-05-19 2024-03-26 宝宇(武汉)激光技术有限公司 一种激光熔覆装置及方法
EP4164834A4 (en) * 2020-06-10 2024-07-10 Vulcanforms Inc. ANGULAR SCANNING OF LASER ARRAYS IN ADDITIVE MANUFACTURING
CN116133777A (zh) * 2020-07-21 2023-05-16 通快激光与系统工程有限公司 用于将连续的能量束跳跃式地移位的方法及制造装置
US12053130B2 (en) 2021-02-12 2024-08-06 The Procter & Gamble Company Container containing a shampoo composition with an aesthetic design formed by bubbles
CN113573488B (zh) * 2021-07-01 2024-08-02 德中（天津）技术发展股份有限公司 激光和化学结合选择性活化绝缘材料制造导电图案的系统
US12168263B2 (en) * 2021-07-20 2024-12-17 Ii-Vi Delaware, Inc. Dynamic beam deflection and shaping for high-power laser machining process
DE102022101347A1 (de) * 2022-01-21 2023-07-27 Trumpf Laser- Und Systemtechnik Gmbh Verfahren zur Laserbearbeitung eines Werkstücks
EP4504442A1 (en) * 2022-04-01 2025-02-12 Nikon SLM Solutions AG Method of operating an irradiation system, irradiation system and apparatus for producing a three-dimensional work piece
DE102022116486A1 (de) * 2022-07-01 2024-01-04 Precitec Gmbh & Co. Kg Laserbearbeitungskopf mit einem zweiphasigen geschlossenen wärmetauscher
GB2640466A (en) * 2024-04-19 2025-10-22 The Manufacturing Tech Centre Limited A laser device
CN119065119B (zh) * 2024-10-23 2025-06-06 北京神网创新科技有限公司 一种用于激光扫描装置的激光枪
CN119315374B (zh) * 2024-12-17 2025-03-21 北京杏林睿光科技有限公司 偏振方向可调的激光器

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1927323A1 (de) * 1968-05-29 1969-12-04 Crosfield Electronics Ltd Verfahren und Vorrichtung zum Gravieren von Druckformen mit Laserstrahlen
GB2154364A (en) * 1984-02-15 1985-09-04 Hughes Technology Pty Ltd Laser assemblies
DE4000166A1 (de) * 1990-01-05 1991-07-11 Hell Rudolf Dr Ing Gmbh Verfahren und einrichtung zur korrektur von positionsfehlern eines abgelenkten lichtstrahls
US5337325A (en) * 1992-05-04 1994-08-09 Photon Imaging Corp Semiconductor, light-emitting devices
US5416298A (en) * 1990-11-23 1995-05-16 Zed Instruments Limited Laser engraving apparatus
WO1995016294A1 (en) * 1993-12-09 1995-06-15 United Technologies Corporation Coupled multiple output fiber laser
US5430816A (en) * 1992-10-27 1995-07-04 Matsushita Electric Industrial Co., Ltd. Multiple split-beam laser processing apparatus generating an array of focused beams
EP0473973B1 (de) * 1990-09-04 1995-11-29 MDC Max Dätwyler Bleienbach AG Verfahren zum Bearbeiten von Tiefdruckformen
DE19603704A1 (de) * 1995-02-15 1996-08-22 Zeiss Carl Fa Optisch gepumpter Laser
DE19511393A1 (de) * 1995-03-28 1996-10-02 Baasel Carl Lasertech Gerät zur Substratbehandlung, insbesondere zum Perforieren von Papier
DE19603111A1 (de) * 1996-01-29 1997-08-07 Deutsche Forsch Luft Raumfahrt Lasersystem
DE29816110U1 (de) * 1998-09-08 1998-11-26 Hell Gravure Systems GmbH, 24107 Kiel Anordnung zum mehrkanaligen Schneiden und Ritzen von Materialien mittels Laserstrahlen
DE19840936A1 (de) * 1998-09-08 2000-03-09 Heidelberger Druckmasch Ag Anordnung zum mehrkanaligen Schneiden und Ritzen von Materialien mittels Laserstrahlen

Family Cites Families (114)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2149487A (en) * 1934-05-15 1939-03-07 Myron C Zilberman Half-tone engraving and apparatus for and method of making the same
US3471215A (en) * 1965-07-16 1969-10-07 American Optical Corp Fiber laser device provided with long flexible energy-directing probe-like structure
US3588439A (en) * 1967-05-12 1971-06-28 Rca Corp High resolution laser engraving apparatus
US3549733A (en) * 1968-12-04 1970-12-22 Du Pont Method of producing polymeric printing plates
GB1284809A (en) * 1970-06-11 1972-08-09 Mitsubishi Electric Corp A laser processing apparatus
DE2113351C3 (de) * 1971-03-19 1973-09-13 Mamiliano 8000 Muenchen Dini Verfahren zur Messung der Tiefe von in einer Flache ausgebildeten zel lenartigen Vertiefungen
DE2241850C3 (de) * 1972-08-25 1978-06-29 European Rotogravure Association, 8000 Muenchen Verfahren zur Herstellung von Druckformen mittels eines Energiestrahles
DE2413034C3 (de) * 1974-03-19 1983-11-17 Dr.-Ing. Rudolf Hell Gmbh, 2300 Kiel Verfahren und Anordnung zur Vermeidung von Fehlern bei der Reproduktion von Bildvorlagen
US3982201A (en) * 1975-01-24 1976-09-21 The Perkin-Elmer Corporation CW solid state laser
SE430968B (sv) * 1975-03-11 1983-12-27 Hell Rudolf Dr Ing Gmbh Forfarande och anordning for gravyr av rastertryckformar for djuptryck
US4128752A (en) * 1976-12-15 1978-12-05 Her Majesty The Queen In Right Of Canada, As Represented By The Minister Of National Defence Laser micromachining apparatus
DE2738167A1 (de) * 1977-08-24 1979-03-08 Siemens Ag Objektivschutzvorrichtung fuer bearbeitungslaser
US4427872A (en) * 1978-09-22 1984-01-24 Coherent, Inc. Precision machining apparatus and method utilizing a laser
JPS5581095A (en) * 1978-12-12 1980-06-18 Ricoh Co Ltd Ultra-fine hole processing method
DE3008176C2 (de) * 1979-03-07 1986-02-20 Crosfield Electronics Ltd., London Gravieren von Druckzylindern
EP0096090B1 (de) * 1982-06-04 1986-01-08 DR.-ING. RUDOLF HELL GmbH Verfahren und Einrichtung zur Herstellung farbiger Proofs beim Mehrfarbendruck
CH660533A5 (de) * 1982-08-23 1987-04-30 Gravure Res Inst Verfahren und vorrichtung zum bilden von rasterpunkten in einem tiefdruckzylinder.
DE3240653A1 (de) * 1982-11-04 1984-05-10 Dr.-Ing. Rudolf Hell Gmbh, 2300 Kiel Verfahren zur kontrolle von mittels elektronenstrahlgravierten druckformoberflaechen
US4689467A (en) * 1982-12-17 1987-08-25 Inoue-Japax Research Incorporated Laser machining apparatus
FR2585480B1 (fr) * 1985-07-24 1994-01-07 Ateq Corp Generateur de modeles a laser
US4710604A (en) * 1985-12-20 1987-12-01 Nippon Kogaku K. K. Machining apparatus with laser beam
ATE54524T1 (de) * 1986-04-30 1990-07-15 Hell Rudolf Dr Ing Gmbh Verfahren zur aufzeichnung von druckformen.
DE3617714A1 (de) * 1986-05-27 1987-12-03 Hell Rudolf Dr Ing Gmbh Volumen-messverfahren fuer oberflaechenvertiefungen
US4759285A (en) * 1987-07-14 1988-07-26 Hurletron, Inc. Rotogravure cylinder proofing method
FR2626511B1 (fr) * 1988-02-03 1990-05-18 Air Liquide Buse de decoupe laser, tete de decoupe comportant une telle buse et procede de decoupe les mettant en oeuvre
EP0378598A4 (en) * 1988-05-03 1991-04-03 Phased Array Lasers Pty. Ltd. Looped, phased array laser oscillator
US5096855A (en) * 1988-05-23 1992-03-17 U.S. Philips Corporation Method of dicing semiconductor wafers which produces shards less than 10 microns in size
EP0393163A4 (en) * 1988-07-04 1991-04-17 Phased Array Lasers Pty. Ltd. Face pumped, looped fibre bundle, phased-array laser oscillator
JPH0240631A (ja) * 1988-07-29 1990-02-09 Nec Corp 音響光学スイッチ
US4915981A (en) * 1988-08-12 1990-04-10 Rogers Corporation Method of laser drilling fluoropolymer materials
JP2663560B2 (ja) * 1988-10-12 1997-10-15 日本電気株式会社 レーザ加工装置
WO1990013158A1 (en) * 1989-04-18 1990-11-01 Phased Array Lasers Pty Ltd Close packed, end face, diode pumped, fibre laser bundle, phased-array laser oscillator
US5080463A (en) * 1989-06-21 1992-01-14 Minnesota Mining And Manufacturing Company Retroreflective security laminates with protective cover sheets
DE3923829A1 (de) * 1989-07-19 1991-01-31 Fraunhofer Ges Forschung Absauganlage
AT393979B (de) * 1989-11-07 1992-01-10 Kufstein Schablonentech Gmbh Vorrichtung zum bearbeiten von hohlzylindern mittels eines lasers
US5168288A (en) * 1989-12-18 1992-12-01 Eastman Kodak Company Thermal a scan laser printer
US5656229A (en) * 1990-02-20 1997-08-12 Nikon Corporation Method for removing a thin film layer
US5020880A (en) * 1990-03-13 1991-06-04 United Technologies Corporation Low distortion window for use with high energy lasers
JPH0485978A (ja) * 1990-07-30 1992-03-18 Sony Corp 端面励起型固体レーザー発振器
EP0513359B1 (en) * 1990-07-31 1994-07-20 Materials And Intelligent Devices Research Co., Ltd. Yag laser working machine for precision working of thin film
US5639391A (en) * 1990-09-24 1997-06-17 Dale Electronics, Inc. Laser formed electrical component and method for making the same
DE4040201C2 (de) * 1990-12-15 1994-11-24 Hell Ag Linotype Verfahren zum wartungsarmen Betrieb einer Vorrichtung zur Herstellung einer Oberflächenstruktur und Vorrichtung zur Durchführung des Verfahrens
JP2685359B2 (ja) * 1991-01-22 1997-12-03 富士写真フイルム株式会社 光ビーム走査装置及び光ビーム走査方法
JPH04255280A (ja) * 1991-02-07 1992-09-10 Nippon Steel Corp 半導体レーザ励起固体レーザ装置
US5173441A (en) * 1991-02-08 1992-12-22 Micron Technology, Inc. Laser ablation deposition process for semiconductor manufacture
US6136375A (en) * 1991-04-26 2000-10-24 W. R. Chesnut Engineering Method of manufacturing a rotogravure printing medium
US5169707A (en) * 1991-05-08 1992-12-08 Minnesota Mining And Manufacturing Company Retroreflective security laminates with dual level verification
US5798202A (en) * 1992-05-11 1998-08-25 E. I. Dupont De Nemours And Company Laser engravable single-layer flexographic printing element
US5309178A (en) * 1992-05-12 1994-05-03 Optrotech Ltd. Laser marking apparatus including an acoustic modulator
US5373526A (en) * 1992-05-12 1994-12-13 Hughes Aircraft Company Apparatus and method for optical energy amplification using two-beam coupling
JPH05327104A (ja) * 1992-05-21 1993-12-10 Sumitomo Electric Ind Ltd 光ファイバ増幅器
AU674518B2 (en) * 1992-07-20 1997-01-02 Presstek, Inc. Lithographic printing plates for use with laser-discharge imaging apparatus
US5379698A (en) * 1992-07-20 1995-01-10 Presstek, Inc. Lithographic printing members for use with laser-discharge imaging
US5351617A (en) * 1992-07-20 1994-10-04 Presstek, Inc. Method for laser-discharge imaging a printing plate
US5719009A (en) * 1992-08-07 1998-02-17 E. I. Du Pont De Nemours And Company Laser ablatable photosensitive elements utilized to make flexographic printing plates
GB9217705D0 (en) * 1992-08-20 1992-09-30 Ici Plc Data-recordal using laser beams
CA2090795A1 (en) * 1992-11-19 1994-05-20 Donald Joseph Sanders Method and apparatus for sealing absorbent materials in an absorbent product
US5268978A (en) * 1992-12-18 1993-12-07 Polaroid Corporation Optical fiber laser and geometric coupler
US5691818A (en) * 1993-02-25 1997-11-25 Ohio Electronic Engravers, Inc. System and method for enhancing edges and the like for engraving
US5359176A (en) * 1993-04-02 1994-10-25 International Business Machines Corporation Optics and environmental protection device for laser processing applications
JP3293136B2 (ja) * 1993-06-04 2002-06-17 セイコーエプソン株式会社 レーザ加工装置及びレーザ加工方法
US5363233A (en) * 1993-09-03 1994-11-08 Pernick Benjamin J Optical correlator using fiber optics lasers
US5374973A (en) * 1993-09-21 1994-12-20 Alcatel Network Systems, Inc. Optical amplifier
JPH0796382A (ja) * 1993-09-28 1995-04-11 Mitsui Petrochem Ind Ltd レーザ加工装置
DE4338337C1 (de) * 1993-11-10 1995-05-24 Bernd Dr Bolzmann Vorrichtung und Verfahren zum Gravieren von Tiefdruckformen
DE4400609A1 (de) * 1994-01-12 1995-07-13 Haindl Papier Gmbh Dünndruckpapier und Verfahren zu dessen Herstellung
DE4402000C2 (de) * 1994-01-25 1996-04-11 Fraunhofer Ges Forschung Düsenanordnung für das Laserstrahlschneiden
US5611946A (en) * 1994-02-18 1997-03-18 New Wave Research Multi-wavelength laser system, probe station and laser cutter system using the same
US5400350A (en) * 1994-03-31 1995-03-21 Imra America, Inc. Method and apparatus for generating high energy ultrashort pulses
CN1059156C (zh) * 1994-04-19 2000-12-06 大世吕化学工业株式会社 印版材料及其制法
DE4414270C2 (de) * 1994-04-23 1998-12-03 Manfred Neuberger Verfahren zur Herstellung von Transferdruckpapieren
JPH07299576A (ja) * 1994-05-10 1995-11-14 Mitsubishi Electric Corp 光加工装置
JP3305499B2 (ja) * 1994-06-06 2002-07-22 株式会社アマダ レーザ加工機
DE4424492C2 (de) * 1994-07-12 1996-07-11 Diehl Gmbh & Co Anordnung zur Werkstückbearbeitung mittels eines auf einen Brennfleck fokussierbaren Lasers
ES2102106T3 (es) * 1994-07-14 1997-07-16 Schablonentechnik Kufstein Ag Dispositivo para la fabricacion de una plantilla de serigrafia.
US5533163A (en) * 1994-07-29 1996-07-02 Polaroid Corporation Optical fiber structure for efficient use of pump power
JP3203294B2 (ja) * 1994-09-30 2001-08-27 三菱電機株式会社 レーザ加工装置用レンズカバー
EP0708550A3 (en) * 1994-10-18 1998-01-14 Minnesota Mining And Manufacturing Company Ablation-transfer-imaging using zero order laser beams in a flat-field scanner
JPH08118056A (ja) * 1994-10-20 1996-05-14 Aida Eng Ltd レーザ加工装置
US5566196A (en) * 1994-10-27 1996-10-15 Sdl, Inc. Multiple core fiber laser and optical amplifier
DE19502054A1 (de) * 1995-01-13 1996-07-18 Ges Zur Foerderung Angewandter Optik Optoelektronik Quantenelektronik & Spektroskopie Ev Phasengekoppelter Laser mit mehrfach selbstabbildender Resonatorstruktur
US5675420A (en) * 1995-01-23 1997-10-07 Ohio Electronic Engravers, Inc. Intaglio engraving method and apparatus
GB9501412D0 (en) * 1995-01-25 1995-03-15 Lumonics Ltd Laser apparatus
JP3618008B2 (ja) * 1995-03-17 2005-02-09 富士通株式会社 光増幅器
US5654125A (en) 1995-05-01 1997-08-05 E. I. Du Pont De Nemours And Company Laser apparatus and process of use
CH689917A5 (de) * 1995-05-03 2000-01-31 Daetwyler Ag Verfahren und Vorrichtung zur Herstellung von Rasternäpfchen in der Oberfläche eines Tiefdruckzylinders.
US5530710A (en) * 1995-05-15 1996-06-25 At&T Corp. High-power pumping of three-level optical fiber laser amplifier
US5694408A (en) 1995-06-07 1997-12-02 Mcdonnell Douglas Corporation Fiber optic laser system and associated lasing method
US5767480A (en) * 1995-07-28 1998-06-16 National Semiconductor Corporation Hole generation and lead forming for integrated circuit lead frames using laser machining
US5744780A (en) * 1995-09-05 1998-04-28 The United States Of America As Represented By The United States Department Of Energy Apparatus for precision micromachining with lasers
JPH0985927A (ja) * 1995-09-25 1997-03-31 Dainippon Screen Mfg Co Ltd グラビア印刷版製造装置およびグラビア印刷版製造方法
US5641416A (en) * 1995-10-25 1997-06-24 Micron Display Technology, Inc. Method for particulate-free energy beam cutting of a wafer of die assemblies
JPH09118002A (ja) * 1995-10-25 1997-05-06 Sony Corp レーザ製版装置
US5867305A (en) * 1996-01-19 1999-02-02 Sdl, Inc. Optical amplifier with high energy levels systems providing high peak powers
DE19707003C2 (de) * 1996-02-24 1999-10-14 Foba Gmbh Elektronik & Lasersy Beschriftungslasersystem und Verfahren zur Beschriftung
US6106627A (en) * 1996-04-04 2000-08-22 Sigma Laboratories Of Arizona, Inc. Apparatus for producing metal coated polymers
GB9611942D0 (en) * 1996-06-07 1996-08-07 Lumonics Ltd Focus control of lasers in material processing operations
DE19624131A1 (de) * 1996-06-17 1997-12-18 Giesecke & Devrient Gmbh Verfahren zur Herstellung von Prägeplatten
EP0912308B1 (en) * 1996-06-19 2003-03-19 British Nuclear Fuels PLC Grout or mortar removal by laser
US5761234A (en) * 1996-07-09 1998-06-02 Sdl, Inc. High power, reliable optical fiber pumping system with high redundancy for use in lightwave communication systems
US5790575A (en) * 1996-07-15 1998-08-04 Trw Inc. Diode laser pumped solid state laser gain module
DE19635831A1 (de) * 1996-09-04 1998-03-05 Hell Ag Linotype Verfahren und Einrichtung zur Steuerung eines Gravierorgans
US5795202A (en) * 1996-09-04 1998-08-18 Williams; Carl F. Outboard motor support device
US6212310B1 (en) * 1996-10-22 2001-04-03 Sdl, Inc. High power fiber gain media system achieved through power scaling via multiplexing
JPH10157199A (ja) * 1996-11-27 1998-06-16 Dainippon Screen Mfg Co Ltd 画像記録装置
US5953036A (en) * 1997-04-25 1999-09-14 Eastman Kodak Company Image processing equipment having wear resistant elements for translation of the printhead
US5829881A (en) * 1997-04-25 1998-11-03 Eastman Kodak Company Wear resistant apparatus and method for translating a printing element relative to a frame
JPH10305551A (ja) * 1997-05-07 1998-11-17 Think Lab Kk 製版装置
JPH10307403A (ja) * 1997-05-07 1998-11-17 Think Lab Kk 製版装置
US6272155B1 (en) * 1997-06-30 2001-08-07 Hoya Corporation Fiber bundle and laser apparatus using the fiber bundle of manufacturing the same
US6283022B1 (en) * 1997-10-17 2001-09-04 Deco Patents, Inc. Apparatus and method for direct rotary screen printing radiation curable compositions onto cylindrical articles
US5949466A (en) * 1998-05-01 1999-09-07 Eastman Kodak Company Exposing imagesetter recording film to a dye collection sheet on a transfer apparatus
DE19840926B4 (de) * 1998-09-08 2013-07-11 Hell Gravure Systems Gmbh & Co. Kg Anordnung zur Materialbearbeitung mittels Laserstrahlen und deren Verwendung
DE502004004634D1 (de) * 2004-02-27 2007-09-27 Hell Gravure Systems Gmbh & Co Verfahren zur direkten Gravur von Näpfchen zur Aufnahme von Druckfarbe für den Tiefdruck

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1927323A1 (de) * 1968-05-29 1969-12-04 Crosfield Electronics Ltd Verfahren und Vorrichtung zum Gravieren von Druckformen mit Laserstrahlen
GB2154364A (en) * 1984-02-15 1985-09-04 Hughes Technology Pty Ltd Laser assemblies
DE4000166A1 (de) * 1990-01-05 1991-07-11 Hell Rudolf Dr Ing Gmbh Verfahren und einrichtung zur korrektur von positionsfehlern eines abgelenkten lichtstrahls
EP0473973B1 (de) * 1990-09-04 1995-11-29 MDC Max Dätwyler Bleienbach AG Verfahren zum Bearbeiten von Tiefdruckformen
US5416298A (en) * 1990-11-23 1995-05-16 Zed Instruments Limited Laser engraving apparatus
US5337325A (en) * 1992-05-04 1994-08-09 Photon Imaging Corp Semiconductor, light-emitting devices
US5430816A (en) * 1992-10-27 1995-07-04 Matsushita Electric Industrial Co., Ltd. Multiple split-beam laser processing apparatus generating an array of focused beams
WO1995016294A1 (en) * 1993-12-09 1995-06-15 United Technologies Corporation Coupled multiple output fiber laser
DE19603704A1 (de) * 1995-02-15 1996-08-22 Zeiss Carl Fa Optisch gepumpter Laser
DE19511393A1 (de) * 1995-03-28 1996-10-02 Baasel Carl Lasertech Gerät zur Substratbehandlung, insbesondere zum Perforieren von Papier
DE19603111A1 (de) * 1996-01-29 1997-08-07 Deutsche Forsch Luft Raumfahrt Lasersystem
DE29816110U1 (de) * 1998-09-08 1998-11-26 Hell Gravure Systems GmbH, 24107 Kiel Anordnung zum mehrkanaligen Schneiden und Ritzen von Materialien mittels Laserstrahlen
DE19840936A1 (de) * 1998-09-08 2000-03-09 Heidelberger Druckmasch Ag Anordnung zum mehrkanaligen Schneiden und Ritzen von Materialien mittels Laserstrahlen

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
HÜLSBUSCH, W.: Der Laser in der Druckindustrie. Verlag W. Hülsbusch, Konstanz, 1990, ISBN: 3980264300. *
ZELLMER, H.: Leistungsskalierung von Faserlasern. Universität Hannover, Fachbereich Physik, 20.6.1996. *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016121707A1 (de) 2016-11-14 2018-05-17 ECO Holding 1 GmbH Verfahren zur Bearbeitung einer Innenoberfläche einer Ventilbuchse, Ventilbuchse und Vorrichtung zur Bearbeitung einer Innenoberfläche einer Ventilbuchse

Also Published As

Publication number Publication date
EP1595697A3 (de) 2006-06-07
EP1637273A3 (de) 2006-06-07
EP1623789B1 (de) 2015-06-24
EP1579944A2 (de) 2005-09-28
DE19840926A1 (de) 2000-05-04
EP1579944A3 (de) 2006-06-07
JP4146401B2 (ja) 2008-09-10
JP2006103324A (ja) 2006-04-20
US20060255023A1 (en) 2006-11-16
US20060249488A1 (en) 2006-11-09
EP1637273A2 (de) 2006-03-22
JP4092080B2 (ja) 2008-05-28
WO2000013839A1 (de) 2000-03-16
JP2005025212A (ja) 2005-01-27
US20050013328A1 (en) 2005-01-20
JP2007125616A (ja) 2007-05-24
JP2007275993A (ja) 2007-10-25
EP1666187A1 (de) 2006-06-07
US20060250658A1 (en) 2006-11-09
EP1655098A2 (de) 2006-05-10
EP1623789A3 (de) 2006-07-12
JP2002524263A (ja) 2002-08-06
EP1595697A2 (de) 2005-11-16
US6888853B1 (en) 2005-05-03
EP1112140B1 (de) 2012-12-12
JP2004349721A (ja) 2004-12-09
EP1112140A1 (de) 2001-07-04
EP1666186A1 (de) 2006-06-07
EP1655098A3 (de) 2006-06-07
EP1623789A2 (de) 2006-02-08

Similar Documents

Publication Publication Date Title
DE19840926B4 (de) Anordnung zur Materialbearbeitung mittels Laserstrahlen und deren Verwendung
EP1220734B1 (de) Vorrichtung mit mindestens einer mehrere einzel-lichtquellen umfassenden lichtquelle
DE19503675C2 (de) Optisches Übertragungssystem
DE102004045912B4 (de) Verfahren und Vorrichtung zur Überlagerung von Strahlenbündeln
EP0835715A1 (de) Vorrichtung und Verfahren zur Laser-Behandlung eines Werkstückes mittels eines Diodenlasers
DE4009089A1 (de) Mehrfasernhalter fuer ausgangskuppler und verfahren zu dessen anwendung
DE19823934A1 (de) Vorrichtung zum Koppeln einer Lichtquelle mit einer Lichtleitfaser
DE19933825B4 (de) Laserbearbeitungsvorrichtung
DE69724331T2 (de) Verfahren zur Herstellung eines Düsenkörpers und Arbeitsgerät
EP0986847A1 (de) Festkörperlaser mit einer oder mehreren pumplichtquellen
DE112021002560T5 (de) Modulare Ablenkeinheiten in spiegelsymmetrischer Anordnung
DE102004053298B4 (de) Scankopf als Teil einer Laser Bohr- und Schneideinrichtung
WO2020193255A1 (de) Vorrichtung zur erzeugung einer räumlich modulierbaren leistungsdichteverteilung aus laserstrahlung
EP3801973A1 (de) Vorrichtung zur laserbearbeitung schwer zugänglicher werkstücke
DE19840927B4 (de) Laserstrahlungsquelle hoher Leistungsdichte und hoher Energie zur Materialbearbeitung
DE29816107U1 (de) Laserstrahlungsquelle hoher Leistungsdichte und hoher Energie zur Materialbearbeitung
WO2000014582A2 (de) Abschlussstück für lichtleitfasern
WO2000013837A1 (de) Anordnung zum mehrkanaligen schneiden und ritzen von materialien mittels laserstrahlen
DE10062453A1 (de) Verfahren und Vorrichtung zur Überlagerung von Strahlenbündeln
DE29816108U1 (de) Abschlußstück für Lichtleitfasern
DE29816110U1 (de) Anordnung zum mehrkanaligen Schneiden und Ritzen von Materialien mittels Laserstrahlen
DE102004045914A1 (de) Verfahren und Vorrichtung zur Überlagerung von Strahlenbündeln
DE102004045911B4 (de) Vorrichtung zur Überlagerung von Strahlenbündeln
DE19609276A1 (de) Anordnung zur Strahlkombination von Laserstrahlen

Legal Events

Date Code Title Description
OM8 Search report available as to paragraph 43 lit. 1 sentence 1 patent law
8127 New person/name/address of the applicant

Owner name: HELL GRAVURE SYSTEMS GMBH, 24148 KIEL, DE

8110 Request for examination paragraph 44
8172 Supplementary division/partition in:

Ref document number: 19861418

Country of ref document: DE

Kind code of ref document: P

Q171 Divided out to:

Ref document number: 19861418

Country of ref document: DE

Kind code of ref document: P

8127 New person/name/address of the applicant

Owner name: HELL GRAVURE SYSTEMS GMBH & CO. KG, 24148 KIEL, DE

R018 Grant decision by examination section/examining division
R020 Patent grant now final

Effective date: 20131012

R082 Change of representative

Representative=s name: THOMAS, GOETZ, DIPL.-ING., DE

R071 Expiry of right