DE502005007859D1 - Laseranordnung - Google Patents

Laseranordnung

Info

Publication number
DE502005007859D1
DE502005007859D1 DE502005007859T DE502005007859T DE502005007859D1 DE 502005007859 D1 DE502005007859 D1 DE 502005007859D1 DE 502005007859 T DE502005007859 T DE 502005007859T DE 502005007859 T DE502005007859 T DE 502005007859T DE 502005007859 D1 DE502005007859 D1 DE 502005007859D1
Authority
DE
Germany
Prior art keywords
laser
laser arrangement
light sources
laser light
machining
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE502005007859T
Other languages
English (en)
Inventor
Vitalij Lissotschenko
Aleksei Mikhailov
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Focuslight Germany GmbH
Original Assignee
Limo Patentverwaltung GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from PCT/EP2004/013494 external-priority patent/WO2006037370A1/de
Application filed by Limo Patentverwaltung GmbH and Co KG filed Critical Limo Patentverwaltung GmbH and Co KG
Publication of DE502005007859D1 publication Critical patent/DE502005007859D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4012—Beam combining, e.g. by the use of fibres, gratings, polarisers, prisms
DE502005007859T 2004-10-06 2005-09-30 Laseranordnung Active DE502005007859D1 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE102004048917 2004-10-06
PCT/EP2004/013494 WO2006037370A1 (de) 2004-10-06 2004-11-27 Laseranordnung
DE102005005453 2005-02-04
PCT/EP2005/010588 WO2006037566A1 (de) 2004-10-06 2005-09-30 Laseranordnung

Publications (1)

Publication Number Publication Date
DE502005007859D1 true DE502005007859D1 (de) 2009-09-17

Family

ID=38516696

Family Applications (1)

Application Number Title Priority Date Filing Date
DE502005007859T Active DE502005007859D1 (de) 2004-10-06 2005-09-30 Laseranordnung

Country Status (5)

Country Link
US (1) US7810938B2 (de)
JP (1) JP5420172B2 (de)
AT (1) ATE438478T1 (de)
DE (1) DE502005007859D1 (de)
WO (1) WO2006037566A1 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011012511A1 (de) * 2011-02-25 2012-08-30 Limo Patentverwaltung Gmbh & Co. Kg Vorrichtung zur Überlagerung von Laserstrahlen einer Mehrzahl von Laserlichtquellen in einer Arbeitsebene
DE112021003639T5 (de) * 2020-07-07 2023-06-15 Panasonic Intellectual Property Management Co., Ltd. Stufen-kern-faserstrukturen und verfahren zur veränderung von strahlform und intensität

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IL40544A (en) 1972-10-11 1975-12-31 Laser Ind Ltd Laser device particularly useful as surgical instrument
US3972599A (en) 1974-09-16 1976-08-03 Caterpillar Tractor Co. Method and apparatus for focussing laser beams
JPS6045247B2 (ja) 1978-07-07 1985-10-08 住友金属工業株式会社 高エネルギ−ビ−ムによる鋼製品表面の熱処理方法
CA1123920A (en) 1978-08-24 1982-05-18 Kevin R. Daly Laser soldering apparatus
US4652722A (en) 1984-04-05 1987-03-24 Videojet Systems International, Inc. Laser marking apparatus
JPS61200524A (ja) * 1985-03-01 1986-09-05 Fuji Photo Film Co Ltd 光走査装置
JPS6449368U (de) * 1987-09-14 1989-03-27
US4826269A (en) * 1987-10-16 1989-05-02 Spectra Diode Laboratories, Inc. Diode laser arrangement forming bright image
JP3305147B2 (ja) 1994-07-06 2002-07-22 三菱重工業株式会社 光ファイバの結合方法及びその結合系
JP3417248B2 (ja) 1997-03-05 2003-06-16 スズキ株式会社 レーザ加工装置
DE19840926B4 (de) * 1998-09-08 2013-07-11 Hell Gravure Systems Gmbh & Co. Kg Anordnung zur Materialbearbeitung mittels Laserstrahlen und deren Verwendung
DE19949198B4 (de) * 1999-10-13 2005-04-14 Myos My Optical Systems Gmbh Vorrichtung mit mindestens einer mehrere Einzel-Lichtquellen umfassenden Lichtquelle
US6504650B1 (en) * 1999-10-19 2003-01-07 Anthony J. Alfrey Optical transformer and system using same
DE10062453B4 (de) * 2000-12-14 2007-07-19 My Optical Systems Gmbh Verfahren und Vorrichtung zur Überlagerung von Strahlenbündeln
JP2003025084A (ja) * 2001-07-12 2003-01-28 Sony Corp レーザー加工装置及び加工方法
JP3934536B2 (ja) * 2001-11-30 2007-06-20 株式会社半導体エネルギー研究所 レーザ照射装置およびレーザ照射方法、並びに半導体装置の作製方法
FI116010B (fi) 2002-05-22 2005-08-31 Cavitar Oy Menetelmä ja laserlaite suuren optisen tehotiheyden tuottamiseksi
JP2004174519A (ja) * 2002-11-25 2004-06-24 Nippon Sharyo Seizo Kaisha Ltd レーザ切断加工機における極薄金属板の保持装置
JP2004202537A (ja) * 2002-12-25 2004-07-22 Sumitomo Heavy Ind Ltd レーザ加工ヘッドの保護方法及び装置
JP2004209540A (ja) * 2003-01-08 2004-07-29 Sumitomo Heavy Ind Ltd レーザ加工装置
JP3775410B2 (ja) * 2003-02-03 2006-05-17 セイコーエプソン株式会社 レーザー加工方法、レーザー溶接方法並びにレーザー加工装置
JP2004249305A (ja) * 2003-02-19 2004-09-09 Enshu Ltd レーザ溶接方法とそのレーザ溶接システム
JP2004255435A (ja) * 2003-02-27 2004-09-16 Suzuki Motor Corp レーザ溶接装置及び方法

Also Published As

Publication number Publication date
ATE438478T1 (de) 2009-08-15
WO2006037566A1 (de) 2006-04-13
JP5420172B2 (ja) 2014-02-19
US7810938B2 (en) 2010-10-12
US20070215583A1 (en) 2007-09-20
JP2008515639A (ja) 2008-05-15

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Legal Events

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