CN1107009C - 输入/输出装载口的输送机构 - Google Patents

输入/输出装载口的输送机构 Download PDF

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Publication number
CN1107009C
CN1107009C CN99815721A CN99815721A CN1107009C CN 1107009 C CN1107009 C CN 1107009C CN 99815721 A CN99815721 A CN 99815721A CN 99815721 A CN99815721 A CN 99815721A CN 1107009 C CN1107009 C CN 1107009C
Authority
CN
China
Prior art keywords
container
load port
conveyor
conveyer
transport
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN99815721A
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English (en)
Chinese (zh)
Other versions
CN1333732A (zh
Inventor
安东尼·C·布诺拉
理查德·H·古尔德
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Machinery Ltd
Original Assignee
Asyst Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asyst Technologies Inc filed Critical Asyst Technologies Inc
Publication of CN1333732A publication Critical patent/CN1333732A/zh
Application granted granted Critical
Publication of CN1107009C publication Critical patent/CN1107009C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G37/00—Combinations of mechanical conveyors of the same kind, or of different kinds, of interest apart from their application in particular machines or use in particular manufacturing processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3408—Docking arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3202—Mechanical details, e.g. rollers or belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3216—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations using a general scheme of a conveying path within a factory
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3218—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3221—Overhead conveying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3222—Loading to or unloading from a conveyor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3404—Storage means

Landscapes

  • Mechanical Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Warehouses Or Storage Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Intermediate Stations On Conveyors (AREA)
  • Specific Conveyance Elements (AREA)
  • Refuse Collection And Transfer (AREA)
  • Branching, Merging, And Special Transfer Between Conveyors (AREA)
  • Discharge Of Articles From Conveyors (AREA)
  • Medicines Containing Material From Animals Or Micro-Organisms (AREA)
  • Control Of Conveyors (AREA)
  • Knitting Machines (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Supplying Of Containers To The Packaging Station (AREA)
  • Spinning Or Twisting Of Yarns (AREA)
  • Mechanical Control Devices (AREA)
CN99815721A 1998-12-18 1999-12-13 输入/输出装载口的输送机构 Expired - Fee Related CN1107009C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11294798P 1998-12-18 1998-12-18
US60/112,947 1998-12-18

Publications (2)

Publication Number Publication Date
CN1333732A CN1333732A (zh) 2002-01-30
CN1107009C true CN1107009C (zh) 2003-04-30

Family

ID=22346715

Family Applications (3)

Application Number Title Priority Date Filing Date
CN99815721A Expired - Fee Related CN1107009C (zh) 1998-12-18 1999-12-13 输入/输出装载口的输送机构
CN99815720A Expired - Fee Related CN1123519C (zh) 1998-12-18 1999-12-13 整体式装载口－输送机输送装置
CN99815727A Expired - Lifetime CN1118428C (zh) 1998-12-18 1999-12-15 一体式的隔舱内部输送、存放及运送装置

Family Applications After (2)

Application Number Title Priority Date Filing Date
CN99815720A Expired - Fee Related CN1123519C (zh) 1998-12-18 1999-12-13 整体式装载口－输送机输送装置
CN99815727A Expired - Lifetime CN1118428C (zh) 1998-12-18 1999-12-15 一体式的隔舱内部输送、存放及运送装置

Country Status (12)

Country Link
US (3) US6435330B1 (https=)
EP (3) EP1159214B1 (https=)
JP (3) JP2002532915A (https=)
KR (3) KR20010082369A (https=)
CN (3) CN1107009C (https=)
AT (1) ATE490203T1 (https=)
AU (3) AU2176100A (https=)
CA (3) CA2355183A1 (https=)
DE (1) DE69943004D1 (https=)
HK (1) HK1038544A1 (https=)
TW (2) TW446674B (https=)
WO (3) WO2000037340A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102820747A (zh) * 2012-08-30 2012-12-12 永济新时速电机电器有限责任公司 用于定子线圈绝缘的流程化生产系统

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* Cited by examiner, † Cited by third party
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