KR101841753B1 - 용량이 축소된 캐리어, 이송, 로드 포트, 버퍼 시스템 - Google Patents
용량이 축소된 캐리어, 이송, 로드 포트, 버퍼 시스템 Download PDFInfo
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- KR101841753B1 KR101841753B1 KR1020177003883A KR20177003883A KR101841753B1 KR 101841753 B1 KR101841753 B1 KR 101841753B1 KR 1020177003883 A KR1020177003883 A KR 1020177003883A KR 20177003883 A KR20177003883 A KR 20177003883A KR 101841753 B1 KR101841753 B1 KR 101841753B1
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Abstract
Description
도 1은 실시예의 특성을 갖추고 캐리어에 가공품 또는 기판(S)이 있는 가공품 캐리어의 입면도이다. 도1A-1B는 각각 다른 실시예에 따른 캐리어 가공품 지지대의 부분 평면도 및 입면도이다;
도 2A는 도 1의 캐리어의 횡단 입면도 및 다른 실시예에 따른 툴 포트 인터페이스이다;
도 2B는 다른 실시예에 따른 툴 포트 인터페이스 및 캐리어의 횡단 입면도이다;
도 3A-3C는 각각 다른 실시예에 따라 세 가지 위치에서 툴 포트 인터페이스와 캐리어를 나타낸 횡단 입면도이다;
도 4는 또 다른 실시예에 따른 캐리어와 툴 인터페이스의 입면도이고 도 4A-4C는 각각 다른 실시예에 따라 인터페이스 구성을 나타낸, 캐리어-툴 인터페이스 일부를 나타낸 확대된 횡단면도이다;
도 5A-5C는 또 다른 실시예에 따른 캐리어-툴 인터페이스의 부분 입면도로 세 위치에서 캐리어-툴 인터페이스를 보여준다.
도 6A-6B는 각각 다른 실시예에 따른 가공품 캐리어의 입면도이다;
도 7A-7B는 다른 실시예에 따른 가공품 캐리어의 입면도로 각각 다른 위치에서 캐리어를 보여준다;
도 8은 다른 실시예에 따른 툴 인터페이스 및 캐리어의 다른 입면도이다;
도 9는 다른 실시예에 따른 툴 인터페이스 및 캐리어의 다른 입면도이다;
도 10은 다른 실시예에 따른 툴 인터페이스 및 캐리어의 입면도이고 도 10A는 다른 실시예에 따른 프로세싱 툴 및 인터페이스할 캐리어의 부분 입면도이다;
도 11은 다른 실시예에 따른 프로세싱 툴 섹션 및 인터페이스할 캐리어의 입면도이다;
도 12A-12B는 도 11의 캐리어(가공품 전송)의 캐리어 개구부 및 캐리어 도어의 정면도다;
도 13A-13B는 도 11의 툴 섹션의 인터페이스 및 툴-캐리어 도어 인터페이스의 상단 평면도이다;
도 14는 다른 실시예에 따른 프로세싱 툴 및 인터페이스할 캐리어의 입면도이다;
도 15는 또 다른 실시예에 따른 툴 인터페이스 및 캐리어의 입면도이다;
도 16A-16B는 다른 실시예에 따라 두 가지 다른 위치에서 표시한 툴 인터페이스 및 캐리어의 입면도이다;
도 17은 캐리어의 측면도이고 도 17A-17C는 다른 실시예에 따른 캐리어 및 툴 인터페이스의 입면도와 툴 인터페이스의 평면도이다;
도 18-19는 다른 실시예에 따른 툴 인터페이스 및 캐리어의 입면도이다;
도 20은 다른 실시예에 따른 이송 시스템의 평면도이다;
도 20A-20B는 도 10의 이송 시스템 트랙 부분에 대한 부분 평면도이고, 도 20C-20D는 다른 실시예에 따른 이송 시스템의 다른 페이로드의 정면도이다;
도 21은 다른 실시예에 따른 이송 시스템의 일부분에 대한 부분 평면도이다;
도 22-24는 다른 실시예에 따른 이송 시스템 일부분에 대한 부분 평면도이다;
도 25A-25B는 각각 다른 실시예에 따른 이송 시스템 및 프로세싱 툴의 입면도이다;
도 26A-26B는 각각 다른 실시예에 따른, 이송 시스템과 툴 사이의 캐리어 전송을 위한 전송 인터페이스 시스템의 입면도이다;
도 27은 다른 실시예에 따른 이송 시스템의 부분 입면도이고 도 27A-27B는 다른 위치에서 본 이송 시스템의 부분 입면도이다;
도 28은 다른 실시예에 따른 이송 시스템의 입면도이다;
도 29A-29B는 다른 실시예에 따른 이송 시스템의 평면도이다;
도 29C는 다른 실시예에 따른 이송 시스템 및 프로세싱 툴의 평면도이다;
도 30은 도 29C의 이송 시스템 및 프로세싱 툴의 부분 입면도이다;
도 31은 이송 시스템의 또 다른 부분 입면도이다;
도 32는 다른 실시예에 따른 이송 시스템의 부분 입면도이다;
도 33-34는 각각 다른 실시예에 따른 이송 시스템의 평면도 및 입면도이다;
도 35는 다른 실시예에 따른 이송 시스템의 또 다른 평면도이다;
도 36A-36C는 각각 다른 실시예에 따른 이송 소자의 하단 투시도, 입면도 및 정면도이다;
도 36D는 다른 실시예에 따른 이송 소자의 또 다른 정면도다;
도 36E는 규격 동적 커플링의 일부분에 대한 횡단면도이다;
도 37A-37D는 각각 실시예에 따른 툴 로딩 스테이션의 투시도, 단면 및 측면 입면도 및 상단 평면도이다;
도 37E는 다른 실시예에 따른 다른 툴 로드 스테이션의 평면도이다;
도 37F는 또 다른 실시예에 따른 다른 툴 로드 스테이션의 평면도이다;
도 37G 역시 다른 실시예에 따른 다른 툴 로드 스테이션의 평면도이다;
도 38A-38C는 각각 다른 실시예에 따라 다른 프로세스를 그래픽으로 나타낸 흐름도이다;
도 39는 다른 실시예에 따른 툴 로드 스테이션의 횡단면도이다;
도 40A-40D는 각각 다른 실시예에 따른 기판 지지대의 횡단면도이다;
도 41, 41A-41B는 각각 또 다른 실시예에 따른 프로세스 시스템의 투시도, 단 입면도 및 상단 평면도이다;
도 42는 도 41의 시스템 섹션에 대한 분해투시도이다;
도 42A-42B는 각각 도 41의 이송 시스템의 다른 섹션 및 다른 위치에서 본 캐리어의 부분 투시도이고 도 42C-42D는 각각 도 41의 이송 시스템의 캐리어 그리퍼 섹션의 투시도 및 상단 평면도이다;
도 43-47은 각각 다른 실시예에 따른 선택 가능한 시스템 배열을 나타내는 구조도이다;
도 48은 또 다른 실시예에 따른 시스템의 입면도이다;
도 49는 또 다른 실시예에 따른 시스템의 부분 투시도이다;
도 50은 다른 실시예에 따른 처리 시스템의 다른 평면도이다;
도 51은 다른 실시예에 따른 이송 시스템의 평면도이다;
도 51A는 로트 크기와 이송 속도의 관계를 나타내는 그래프이다.
도 52-52A는 각각 다른 실시예에 따른 이송 시스템 일부분을 보여주는 부분 평면도이다;
도 52B는 다른 실시예에 따른 이송 시스템의 부분 평면도이다;
도 53은 도 51의 이송 시스템의 이송용 운반기(vehicle)의 평면도이고,
도 54는 또 다른 실시예에 따른 이송 시스템의 단 입면도이다.
도 55 역시 다른 실시예에 따른 이송 시스템의 단 입면도이다.
도 55A-55D는 각각 이송 시스템의 부분 측면 투시도, 다른 위치에서 본, 이송 시스템이 전송할 캐리어를 나타낸 이송 시스템의 부분 평면도 및 이송 시스템의 인터페이스 부분의 측면 입면도이다.
도 56-56A는 각각 또 다른 실시예에 따른 이송 시스템의 평면도 및 단 입면도이다.
도 57은 또 다른 실시예에 따른 캐리어의 입면도이고 도 57A는 캐리어 도어 인터페이스 일부를 나타낸 부분 구조도이다.
도 58은 다른 실시예에 따른 캐리어의 또 다른 입면도이다;
도 59A-59D는 각각 다른 실시예에 따른 캐리어/로드 포트 인터페이스의 횡단면도이다;
도 60-62는 캐리어와 로드 포트를 세 가지 다른 위치에서 본 캐리어 및 로드 포트의 부분 횡단면도이다;
도 63은 또 다른 실시예에 따른 다른 캐리어/로드 포트 인터페이스의 부분 횡단면도이다;
도 64A-E는 각각 다른 실시예에 따른 캐리어/로드 포트 인터페이스의 횡단면도이다.
Claims (17)
- 반도체 가공품 프로세싱 시스템으로서,
상기 반도체 가공품 프로세싱 시스템은, 기판 홀딩 컨테이너와 인터페이스하는 부분들을 가지며, 상기 기판 홀딩 컨테이너를 지지하고 그리고 이송하는 이송 섹션을 포함하며,
상기 이송 섹션은, 베이간(interbay) 이송 섹션과 베이내(intrabay) 이송 섹션 중의 적어도 하나 및 적어도 하나의 기판 프로세싱 툴과 인터페이스하도록 구성되며,
상기 이송 섹션은, 상기 베이간 이송 섹션과 상기 베이내 이송 색션 중의 적어도 하나와 상기 이송 섹션 사이에서의 기판 홀딩 컨테이너의 이동이 상기 적어도 하나의 기판 프로세싱 툴 위에서 이루어지도록, 상기 베이간 이송 섹션과 상기 베이내 이송 색션 중의 적어도 하나와 함께 상기 적어도 하나의 기판 프로세싱 툴 위에(overhead)에 있으며,
상기 이송 섹션은 상기 베이간 이송 섹션과 상기 베이내 이송 섹션 중의 적어도 하나와 상기 적어도 하나의 기판 프로세싱 툴 사이에서 상기 기판 홀딩 컨테이너를 이송하도록 구성되며,
상기 이송 섹션은 상기 적어도 하나의 기판 프로세싱 툴 위에 배치된 적어도 하나의 오버헤드 갠트리(overhead gantry)를 포함하며, 상기 오버헤드 갠트리는 수평면 운동에서 2 자유도 운동을 갖는 상기 기판 홀딩 컨테이너의 이송을 유효하게 하기 위하여 독립적으로 교차하고 수평적으로 동일 평면에 있는 적어도 2개의 이송 축을 정의하는 것을 특징으로 하는 반도체 가공품 프로세싱 시스템. - 청구항 1에 있어서,
상기 적어도 하나의 오버헤드 갠트리는 적어도 3 자유도를 갖는 적어도 하나의 오버헤드 캐리어를 포함하는 것을 특징으로 하는 반도체 가공품 프로세싱 시스템. - 청구항 2에 있어서,
상기 기판 홀딩 컨테이너는 액세스 측을 가지며, 상기 적어도 하나의 오버헤드 캐리어는 상기 액세스 측이 대면하는 방향을 변경하기 위해 상기 적어도 하나의 오버헤드 캐리어에 의해 운반된 상기 기판 홀딩 컨테이너를 회전시키도록 구성된 회전 구동을 포함하는 것을 특징으로 하는 반도체 가공품 프로세싱 시스템. - 청구항 1에 있어서,
상기 적어도 하나의 기판 프로세싱 툴 위에 배치된 적어도 하나의 오버헤드 스토리지 스테이션을 더 포함하며, 상기 이송 섹션은 상기 적어도 하나의 오버헤드 스토리지 스테이션을 향하여 그리고 상기 적어도 하나의 오버헤드 스토리지 스테이션으로부터 기판 홀딩 컨테이너들을 이송하도록 구성된 것을 특징으로 하는 반도체 가공품 프로세싱 시스템. - 청구항 1에 있어서,
상기 적어도 하나의 갠트리는 상기 적어도 하나의 기판 프로세싱 툴의 마주 보며 배열된 로드 포트들을 위해 서비스하도록 구성된 것을 특징으로 하는 반도체 가공품 프로세싱 시스템. - 청구항 5에 있어서,
상기 적어도 하나의 오버헤드 갠트리는 적어도 하나의 캐리어를 포함하며,
상기 적어도 하나의 캐리어는, 상기 기판 홀딩 컨테이너의 방향이 상기 마주보며 배열된 로드 포트들의 각각의 방향에 대응하도록, 상기 적어도 하나의 캐리어에 의해 운반된 기판 홀딩 컨테이너를 회전시키도록 구성된 것을 특징으로 하는 반도체 가공품 프로세싱 시스템. - 청구항 6에 있어서,
상기 적어도 하나의 캐리어는 상기 기판 홀딩 컨테이너를 실시간(on the fly) 회전시킬 수 있도록 구성된 것을 특징으로 하는 반도체 가공품 프로세싱 시스템. - 청구항 1에 있어서,
상기 오버헤드 갠트리는 이동(translation) 플랫폼 및 상기 이동 플랫폼 상에 이동가능하게 지지된 적어도 하나의 오버헤드 캐리어를 포함하며, 상기 이동 플랫폼은 공통 면(common plane)을 따라 2 자유도로 상기 적어도 하나의 오버헤드 캐리어를 이동시키도록 구성된 것을 특징으로 하는 반도체 가공품 프로세싱 시스템. - 반도체 가공품 프로세싱 시스템으로서,
상기 반도체 가공품 프로세싱 시스템은, 베이간 이송 섹션과 베이내 이송 섹션 중의 적어도 하나와 적어도 하나의 고정된 기판 홀딩 컨테이너 스토리지 사이에서 기판 홀딩 컨테이너들을 이송하기 위하여 베이간 이송 섹션과 베이내 이송 섹션 중의 적어도 하나의 이동 방향과 인터페이스하고 그리고 가로지르는 오버헤드 갠트리 피더 셔틀(feeder shuttle)로서, 상기 적어도 하나의 고정된 기판 홀딩 컨테이너 스토리지는 적어도 하나의 기판 프로세싱 툴 위에 배치되는, 상기 오버헤드 갠트리 피더 셔틀과,
기판 홀딩 컨테이너들을 상기 적어도 하나의 기판 프로세싱 툴 위로 이송하도록 구성된 이송 섹션을 포함하며,
상기 이송 섹션은, 상기 베이간 이송 섹션과 상기 베이내 이송 색션 중의 적어도 하나와 상기 이송 섹션 사이에서의 기판 홀딩 컨테이너의 이동이 상기 적어도 하나의 기판 프로세싱 툴 위에서 이루어지도록, 상기 베이간 이송 섹션과 상기 베이내 이송 색션 중의 적어도 하나와 상기 적어도 하나의 기판 프로세싱 툴 위에(overhead)에서 인터페이스하도록 구성되고,
상기 이송 섹션은 상기 적어도 하나의 기판 홀딩 컨테이너 스토리지와 상기 적어도 하나의 기판 프로세싱 툴 사이에서 기판 홀딩 컨테이너들을 이송하도록 구성되며,
상기 이송 섹션은 상기 적어도 하나의 기판 프로세싱 툴 위에 배치된 적어도 하나의 오버헤드 갠트리(overhead gantry)를 포함하며, 상기 오버헤드 갠트리는 수평면 운동에서 2 자유도 운동을 갖는 상기 기판 홀딩 컨테이너의 이송을 유효하게 하기 위하여 독립적으로 교차하고 수평적으로 동일 평면에 있는 적어도 2개의 이송 축을 정의하는 것을 특징으로 하는 반도체 가공품 프로세싱 시스템. - 청구항 9에 있어서,
상기 이송 섹션은, 기판 홀딩 컨테이너를 운반하는 상기 이송 섹션이 상기 오버헤드 갠트리 피더 셔틀 위로 통과할 수 있도록 상기 오버헤드 갠트리 피더 셔틀 위에 배치되는 것을 특징으로 하는 반도체 가공품 프로세싱 시스템. - 청구항 9에 있어서,
상기 적어도 하나의 오버헤드 갠트리는 적어도 3 자유도를 갖는 적어도 하나의 오버헤드 캐리어를 포함하는 것을 특징으로 하는 반도체 가공품 프로세싱 시스템. - 청구항 11에 있어서,
상기 기판 홀딩 컨테이너는 액세스 측을 가지며, 상기 적어도 하나의 오버헤드 캐리어는 상기 액세스 측이 대면하는 방향을 변경하기 위해 상기 적어도 하나의 오버헤드 캐리어에 의해 운반된 상기 기판 홀딩 컨테이너를 회전시키도록 구성된 회전 구동을 포함하는 것을 특징으로 하는 반도체 가공품 프로세싱 시스템. - 청구항 9에 있어서,
상기 오버헤드 갠트리 피더 셔틀은 상기 피더 셔틀에 의해 운반된 기판 홀딩 컨테이너를 회전시키도록 구성된 회전 구동을 포함하는 것을 특징으로 하는 반도체 가공품 프로세싱 시스템. - 청구항 9에 있어서,
상기 적어도 하나의 갠트리는 상기 적어도 하나의 기판 프로세싱 툴의 마주 보며 배열된 로드 포트들을 위해 서비스하도록 구성된 것을 특징으로 하는 반도체 가공품 프로세싱 시스템. - 청구항 14에 있어서,
상기 적어도 하나의 오버헤드 갠트리는 적어도 하나의 캐리어를 포함하며,
상기 적어도 하나의 캐리어는, 상기 기판 홀딩 컨테이너의 방향이 상기 마주보며 배열된 로드 포트들의 각각의 방향에 대응하도록, 상기 적어도 하나의 캐리어에 의해 운반된 기판 홀딩 컨테이너를 회전시키도록 구성된 것을 특징으로 하는 반도체 가공품 프로세싱 시스템. - 청구항 15에 있어서,
상기 적어도 하나의 캐리어는 상기 기판 홀딩 컨테이너를 실시간(on the fly) 회전시킬 수 있도록 구성된 것을 특징으로 하는 반도체 가공품 프로세싱 시스템. - 청구항 9에 있어서,
상기 오버헤드 갠트리 피더 셔틀은 두 개의 독립적인 자유도를 갖는 것을 특징으로 하는 반도체 가공품 프로세싱 시스템.
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CN101578700B (zh) | 2012-11-14 |
US20080063496A1 (en) | 2008-03-13 |
CN101578700A (zh) | 2009-11-11 |
JP2013145898A (ja) | 2013-07-25 |
US20160111308A1 (en) | 2016-04-21 |
US8272827B2 (en) | 2012-09-25 |
WO2008024225A2 (en) | 2008-02-28 |
KR20150126065A (ko) | 2015-11-10 |
US20130089396A1 (en) | 2013-04-11 |
WO2008024225A3 (en) | 2008-10-16 |
US9224628B2 (en) | 2015-12-29 |
KR101707925B1 (ko) | 2017-02-17 |
KR20170018984A (ko) | 2017-02-20 |
JP6409018B2 (ja) | 2018-10-17 |
JP2016174167A (ja) | 2016-09-29 |
US10679882B2 (en) | 2020-06-09 |
JP5930985B2 (ja) | 2016-06-08 |
KR20140069354A (ko) | 2014-06-09 |
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