JP6409018B2 - 低減容量キャリア、搬送機、積載ポート及び緩衝装置システム - Google Patents
低減容量キャリア、搬送機、積載ポート及び緩衝装置システム Download PDFInfo
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- JP6409018B2 JP6409018B2 JP2016087657A JP2016087657A JP6409018B2 JP 6409018 B2 JP6409018 B2 JP 6409018B2 JP 2016087657 A JP2016087657 A JP 2016087657A JP 2016087657 A JP2016087657 A JP 2016087657A JP 6409018 B2 JP6409018 B2 JP 6409018B2
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- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
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Description
・ ベローズを有する主ネジ−このメカニズムは、積載ポートのポートプレートに取り付けられた電気モータによって駆動される主ネジを採用する。清浄エリアに入る主ネジの一部分は、ベローズに封入される。ベローズは、動作中に概して清浄であり、疲労なく可撓性を維持することができる限り、金属、プラスチック、または繊維等のいかなる材料であってもよい。ベローズは、汚染物質生成メカニズムとウェハが置かれる清浄エリアとの間に障壁を提供する。ベローズの可撓性性質は、作動装置のストローク全体にわたり、本隔離を提供する。メカニズムのフィードバックは、モータまたは主ネジ上のロータリーエンコーダによるものであってもよく、運動の通路に沿ったリニアエンコーダからのものであってもよい。(図14参照)
・ ベローズを有する空気圧シリンダ−駆動メカニズムが、空気圧シリンダによるものであることを除き、前述実施形態類(1)と類似する。例えば2つの位置間を移動するために使用されてもよい;例えば閉締され、下げられたポッド。(図9参照)
・ 空気圧シリンダ遠隔駆動部の主ネジ−駆動メカニズムがウェハ容量の外側の離れた位置に置かれることを除き、前述実施形態と類似する(図10参照)。積載ポートのポートプレートは、支持構造体で駆動部に取り付けられる。駆動部は、清浄エリアに露出されてもよいが、汚染物質は、空気流通路またはラビリンス封止によって制御される。空気流の使用は、生成され得る汚染物質をウェハの下にし、下方に押しやり、ウェハから離れるように、駆動部をウェハの下流に置く必要がある。ラビリンスまたはその他の「非摩擦」封止は、駆動部と清浄エリアとの間に固体障壁を提供することによって、粒子の導入をさらに制限することができる。第2に、駆動部は、処理ツール環境全体の外側に離れて置くことができる。これは、あまり清浄ではないFAB環境内の汚れている可能性のあるメカニズム内に置くが、あまり清浄ではないFABからプロセスツール環境を保護するために、ラビリンス封止を使用する。
・ ポートプレートに磁気で連結される駆動メカニズム−本実施形態は、ポートプレートと駆動メカニズムとの間に磁気連結具を採用する(例えば図8を参照、ただし反転されている)。磁気連結具は、駆動部を清浄エリアの外側に隔離できるようにする、空気ギャップにわたる非鉄鋼壁を介して動作してもよい。駆動方法は、主ネジ、空気圧シリンダ、またはリニアモータ等の前述されたいずれの種類であってもよい。後者は、運動の方向を抑制するために、空気ベアリングガイドと併用して清浄に動作できるため、清浄エリアの内側に存在してもよい。
・ イントラベイのコンベヤは、ベイの長手に沿うフィーダロボットの固定X位置で一瞬停止する。
・ フィーダロボットは、以前のY位置からイントラベイのコンベヤ上のキャリアの直上まで進行する。
・ フィーダロボットがキャリアを掴む。
・ フィーダロボットは、特定のシャトルレーンまでY方向(ベイの横軸)に進行する。
・ フィーダロボットは、キャリアをシャトル上に置き、次の移動に進む。
・ シャトル/分類機メカニズムがキャリアをX方向に推進する。
・ ガントリーツールローダロボットは、ストレージ位置に移動し、次いでキャリアを掴み、適切なツールに置く。
Claims (16)
- 半導体ワークピース処理システムであって、
半導体基板を処理する少なくとも1つの基板処理ツールと、
所定長を有して進行方向を画定する第1搬送セクションと、
前記第1搬送セクションとは別個の第2搬送セクションと、を具備し、
前記第1搬送セクションは基板保持コンテナに接するパーツを有し、
前記第1搬送セクションは前記基板保持コンテナを支持し且つ当該基板保持コンテナを当該進行方向に移動させ、
前記第2搬送セクションは前記第1搬送セクションと接し、前記第1搬送セクションと前記少なくとも1つの基板処理ツールとの間で前記基板保持コンテナを搬送することができ、
前記第2搬送セクションは前記少なくとも1つの基板処理ツールの上方に設けられた少なくとも1つのオーバーヘッドガントリーを有し、
前記少なくとも1つのオーバーヘッドガントリーが前記少なくとも1つの基板処理ツールと少なくとも1つのオーバーヘッドストレージステーションとの間で前記基板保持コンテナを搬送するのと同時に、前記少なくとも1つのオーバーヘッドガントリーと異なる位置にあるフィーダロボットが前記基板保持コンテナを前記第1搬送セクションと前記少なくとも1つのオーバーヘッドストレージステーションとの間で搬送することを特徴とする半導体ワークピース処理システム。 - 前記少なくとも1つのオーバーヘッドガントリーは、少なくとも3つの自由度を有する少なくとも1つのオーバーヘッドキャリアを含み、当該自由度の少なくとも1つが基板キャリアハンドオフインタフェース面において前記基板保持コンテナを通って伸張している回転軸周りの回転であることを特徴とする請求項1記載の半導体ワークピース処理システム。
- 前記基板保持コンテナはアクセスサイドを有し、前記少なくとも1つのオーバーヘッドキャリアは回動装置を有し、当該回動装置は、前記少なくとも1つのオーバーヘッドキャリアによって保持されている前記基板保持コンテナを回転させることにより、前記アクセスサイドの方向に向かせる請求項2記載の半導体ワークピース処理システム。
- 前記少なくとも1つのオーバーヘッドストレージステーションは、前記少なくとも1つの基板処理ツールの上方に設けられていることを特徴とする請求項1記載の半導体ワークピース処理システム。
- 前記少なくとも1つのオーバーヘッドガントリーは、前記少なくとも1つの基板処理ツールの対向配置された積載ポートに用いられる請求項1記載の半導体ワークピース処理システム。
- 前記少なくとも1つのオーバーヘッドガントリーは少なくとも1つのキャリアを有し、当該少なくとも1つのキャリアは、当該キャリアによって保持されている基板保持コンテナを回転させることができ、当該回転により、前記基板保持コンテナの向きが前記対向配置された積載ポートのそれぞれの向きに一致する請求項5記載の半導体ワークピース処理システム。
- 前記少なくとも1つのキャリアは前記基板保持コンテナのオンザフライ回転のために設けられたものである請求項6記載の半導体ワークピース処理システム。
- 半導体ワークピース処理システムであって、
半導体基板を処理する少なくとも1つの基板処理ツールと、
進行方向を画定すると共に基板保持コンテナを搬送する第1搬送セクションと、
前記少なくとも1つの基板処理ツールの上方に設けられた少なくとも1つの基板保持コンテナストレージと、
前記基板保持コンテナを前記第1搬送セクションと前記少なくとも1つの基板保持コンテナストレージとの間で搬送するために、前記第1搬送セクションに接して前記進行方向と交差するフィーダロボットと、
第1搬送セクションとは別個の第2搬送セクションと、を具備し、
前記第2搬送セクションは少なくとも前記少なくとも1つの基板保持コンテナストレージと接し、前記第2搬送セクションは前記少なくとも1つの基板保持コンテナストレージと前記少なくとも1つの基板処理ツールとの間で基板保持コンテナを搬送することができ、
前記第2搬送セクションは前記少なくとも1つの基板処理ツールの上方に設けられた少なくとも1つのオーバーヘッドガントリーを有し、
前記フィーダロボットが前記第1搬送セクションと前記少なくとも1つの基板保持コンテナストレージとの間で前記基板保持コンテナを搬送するのと同時に、前記フィーダロボットと異なる位置に配されている前記少なくとも1つのオーバーヘッドガントリーによる前記少なくとも1つの基板処理ツールと前記少なくとも1つの基板保持コンテナストレージとの間の前記基板保持コンテナの搬送がなされることを特徴とする半導体ワークピース処理システム。 - 前記第2搬送セクションは前記フィーダロボットの上方に設けられ、基板保持コンテナを保持する前記第2搬送セクションは前記フィーダロボットの上を通過することができる請求項8記載の半導体ワークピース処理システム。
- 前記少なくとも1つのオーバーヘッドガントリーは、少なくとも3つの自由度を有する少なくとも1つのオーバーヘッドキャリアを含む請求項8記載の半導体ワークピース処理システム。
- 前記基板保持コンテナはアクセスサイドを有し、前記少なくとも1つのオーバーヘッドキャリアは回動装置を有し、当該回動装置は、前記少なくとも1つのオーバーヘッドキャリアによって保持された基板保持コンテナを回転させることにより、前記アクセスサイドの方向に向かせる請求項10記載の半導体ワークピース処理システム。
- 前記フィーダロボットは当該フィーダロボットによって保持されている基板保持コンテナを回転させる回動装置を含む請求項8記載の半導体ワークピース処理システム。
- 前記少なくとも1つのオーバーヘッドガントリーは、前記少なくとも1つの基板処理ツールの対向配置された積載ポートに用いられる請求項8記載の半導体ワークピース処理システム。
- 前記少なくとも1つのオーバーヘッドガントリーは少なくとも1つのキャリアを有し、当該少なくとも1つのキャリアは、当該少なくとも1つのキャリアによって保持されている基板保持コンテナを回転させることができ、当該回転により、前記基板保持コンテナの向きが前記対向配置された積載ポートのそれぞれの向きに一致する請求項13記載の半導体ワークピース処理システム。
- 前記少なくとも1つのキャリアは前記基板保持コンテナのオンザフライ回転のために設けられたものである請求項14記載の半導体ワークピース処理システム。
- 前記フィーダロボットの移動は、前記基板保持コンテナが、前記第1搬送セクションと前記少なくとも1つの基板保持コンテナストレージとの間で、前記第1搬送セクションにおける基板保持コンテナ搬送フローを実質的に中断させることなく搬送されるように制限されることを特徴とする請求項8に記載の半導体ワークピース処理システム。
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US20160111308A1 (en) | 2016-04-21 |
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WO2008024225A3 (en) | 2008-10-16 |
WO2008024225A2 (en) | 2008-02-28 |
JP2016174167A (ja) | 2016-09-29 |
JP2013145898A (ja) | 2013-07-25 |
KR20140069354A (ko) | 2014-06-09 |
KR20150126065A (ko) | 2015-11-10 |
US10679882B2 (en) | 2020-06-09 |
US8272827B2 (en) | 2012-09-25 |
KR101707925B1 (ko) | 2017-02-17 |
US20080063496A1 (en) | 2008-03-13 |
KR101841753B1 (ko) | 2018-03-23 |
US20130089396A1 (en) | 2013-04-11 |
CN101578700B (zh) | 2012-11-14 |
KR20170018984A (ko) | 2017-02-20 |
JP5930985B2 (ja) | 2016-06-08 |
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