JP4216250B2 - 基板処理装置 - Google Patents
基板処理装置 Download PDFInfo
- Publication number
- JP4216250B2 JP4216250B2 JP2004504289A JP2004504289A JP4216250B2 JP 4216250 B2 JP4216250 B2 JP 4216250B2 JP 2004504289 A JP2004504289 A JP 2004504289A JP 2004504289 A JP2004504289 A JP 2004504289A JP 4216250 B2 JP4216250 B2 JP 4216250B2
- Authority
- JP
- Japan
- Prior art keywords
- transfer
- case
- substrate
- transfer mechanism
- chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
2 搬送室
3A〜3F 処理室
4 搬送ケース
5 搬送機構
6 基板搬送口
7 ゲートバルブ
8 排気ライン
9 ガス供給ライン
10 レール
11 移動部
12 アーム部
13 把持部
20 ケース本体
21 ピック
22 移載機構
23 ロッド
24 ラック
25 連結部
26,34,37,38 真空シール
27 ガイド
28 カバー
30 ゲートバルブ
31 コイルスプリング
32 駆動部材
33 フランジ部材
35 スプリング収容部
36 スライド部材
40 搬送ケース取り付け機構
41 板状部材
42 レール部材
43 ケース固定部材
44 ドッキング用アクチュエータ
45 押圧用アクチュエータ
46 係合部材
47 ゲート用アクチュエータ
48 ピニオン
49 モータ
51 搬送口
52 ゲートバルブ
60 移動部材
61 ローラ
62 リニヤスケール
63 センサ
70 ボールネジ
71 ナット
72,74 レール
73 移動部材73
75 第2の移動部材
76A,76B プーリ
77 ベルト
79,80 傘歯車
81 モータ
Claims (3)
- 基板を搬入・搬出するための搬送口を有し、内部に収容した基板に対して処理を施すための複数の処理室と、
外部雰囲気から隔離された状態で基板を収容し、基板を搬入・搬出するための出入り口を有する搬送ケースと、
前記処理室に対して基板を搬入・搬出するための第1の位置に該搬送ケースを運ぶ搬送機構と、
前記処理室が周囲に接続され、前記搬送機構が移動する空間を画成する搬送室と
を有し、
前記搬送ケースの前記出入り口は前記第1の位置において前記処理室の前記搬送口に接続され、
前記搬送ケースは、前記出入り口を通じて基板を搬入・搬出する移載機構を有し、
前記搬送室は基板を搬入・搬出する基板搬送口を有し、前記搬送ケースは前記出入り口が該基板搬送口に接続される第2の位置と前記第1の位置との間で前記搬送機構により移動され、
前記移載機構を駆動するための移載機構駆動源は前記搬送ケースから分離されて固定した位置に設けられ、前記搬送ケースが前記第1又は第2の位置に固定された時に該移載機構駆動源は前記移載機構に接続されることを特徴とする基板処理装置。 - 請求項1記載の基板処理装置であって、
前記移載機構は、基板を移動するためのロッドと、連結部材により該ロッドに接続されたラックとを有し、
前記移載機構駆動源は、モータと該モータにより駆動されるピニオンとを有し、
前記移載機構の前記ラックの先端部に前記移載機構駆動源の前記ピニオンが係合することにより前記移載機構駆動源が前記移載機構に接続されることを特徴とする基板処理装置。 - 請求項1記載の基板処理装置であて、
前記移載機構は、歯車と、該歯車に取り付けられたボールネジと、該ボールネジに係合したナットと、該ナットに固定されて第1のレールに沿って移動可能な移動部材と、該移動部材に取り付けられた第2のレールと、該第2のレールの両端に回転可能に支持された一対のプーリと、該プーリの間に張られたベルトと、該ベルトに固定された第2の移動部材と、該ベルトを搬送ケースの本体に対して固定する係止部材とを有し、
前記移載機構駆動源は、モータと該モータにより駆動される歯車とを有し、
前記移載機構の前記歯車が前記移載機構駆動源の前記歯車に係合することにより前記移載機構駆動源が前記移載機構に接続されることを特徴とする基板処理装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002136102 | 2002-05-10 | ||
JP2002136102 | 2002-05-10 | ||
PCT/JP2003/005830 WO2003096410A1 (fr) | 2002-05-10 | 2003-05-09 | Dispositif de traitement de substrat |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008192320A Division JP4588778B2 (ja) | 2002-05-10 | 2008-07-25 | 基板処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2003096410A1 JPWO2003096410A1 (ja) | 2005-09-15 |
JP4216250B2 true JP4216250B2 (ja) | 2009-01-28 |
Family
ID=29416772
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004504289A Expired - Fee Related JP4216250B2 (ja) | 2002-05-10 | 2003-05-09 | 基板処理装置 |
JP2008192320A Expired - Fee Related JP4588778B2 (ja) | 2002-05-10 | 2008-07-25 | 基板処理装置 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008192320A Expired - Fee Related JP4588778B2 (ja) | 2002-05-10 | 2008-07-25 | 基板処理装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7780391B2 (ja) |
JP (2) | JP4216250B2 (ja) |
AU (1) | AU2003231451A1 (ja) |
WO (1) | WO2003096410A1 (ja) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
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JP4493955B2 (ja) * | 2003-09-01 | 2010-06-30 | 東京エレクトロン株式会社 | 基板処理装置及び搬送ケース |
US20070020067A1 (en) * | 2005-07-22 | 2007-01-25 | Au Optronics Corporation | Storage cassette for large panel glass substrates |
US20090022574A1 (en) * | 2007-07-16 | 2009-01-22 | Eudy Steve L | Workpiece loading system |
JP5338335B2 (ja) * | 2008-08-13 | 2013-11-13 | 東京エレクトロン株式会社 | 搬送容器の開閉装置及びプローブ装置 |
TW201013760A (en) * | 2008-09-17 | 2010-04-01 | Inotera Memories Inc | A wafer base clean room and a method of using the wafer base clean room |
JP2013229373A (ja) * | 2012-04-24 | 2013-11-07 | Tokyo Electron Ltd | 基板処理装置及びそのメンテナンス方法 |
JP6094731B2 (ja) * | 2012-11-08 | 2017-03-15 | ソニー株式会社 | 光ファイバケーブル処理装置およびその処理方法 |
US10043689B2 (en) * | 2015-06-05 | 2018-08-07 | Hirata Corporation | Chamber apparatus and processing system |
US20200292084A1 (en) * | 2016-06-02 | 2020-09-17 | Applied Materials, Inc. | Gate valve for continuous tow processing |
US11139183B2 (en) * | 2018-05-24 | 2021-10-05 | Taiwan Semiconductor Manufacturing Co., Ltd. | Systems and methods for dry wafer transport |
KR20230024400A (ko) | 2020-06-17 | 2023-02-20 | 어플라이드 머티어리얼스, 인코포레이티드 | 고온 화학 기상 증착 덮개 |
CN116400052B (zh) * | 2023-06-07 | 2023-08-25 | 北京建工环境修复股份有限公司 | 一种双通道便携式有机污染物检测器 |
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-
2003
- 2003-05-09 WO PCT/JP2003/005830 patent/WO2003096410A1/ja active Application Filing
- 2003-05-09 JP JP2004504289A patent/JP4216250B2/ja not_active Expired - Fee Related
- 2003-05-09 AU AU2003231451A patent/AU2003231451A1/en not_active Abandoned
- 2003-05-09 US US10/513,813 patent/US7780391B2/en not_active Expired - Fee Related
-
2008
- 2008-07-25 JP JP2008192320A patent/JP4588778B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US20050238464A1 (en) | 2005-10-27 |
WO2003096410A1 (fr) | 2003-11-20 |
JP2008283215A (ja) | 2008-11-20 |
US7780391B2 (en) | 2010-08-24 |
JPWO2003096410A1 (ja) | 2005-09-15 |
JP4588778B2 (ja) | 2010-12-01 |
AU2003231451A1 (en) | 2003-11-11 |
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