ES2079829T3 - Aparato de enlace a presion para transferir una rebanada semiconductora entre un recipiente transportable estanco a presion y un equipo de tratamiento. - Google Patents
Aparato de enlace a presion para transferir una rebanada semiconductora entre un recipiente transportable estanco a presion y un equipo de tratamiento.Info
- Publication number
- ES2079829T3 ES2079829T3 ES92480111T ES92480111T ES2079829T3 ES 2079829 T3 ES2079829 T3 ES 2079829T3 ES 92480111 T ES92480111 T ES 92480111T ES 92480111 T ES92480111 T ES 92480111T ES 2079829 T3 ES2079829 T3 ES 2079829T3
- Authority
- ES
- Spain
- Prior art keywords
- port
- container
- housing
- interior space
- section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
- G03F7/70541—Tagging, i.e. hardware or software tagging of features or components, e.g. using tagging scripts or tagging identifier codes for identification of chips, shots or wafers
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
- G03F7/70741—Handling masks outside exposure position, e.g. reticle libraries
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
- G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67353—Closed carriers specially adapted for a single substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67386—Closed carriers characterised by the construction of the closed carrier
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
- H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67727—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using a general scheme of a conveying path within a factory
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67736—Loading to or unloading from a conveyor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/14—Wafer cassette transporting
Abstract
Dispositivo de enlace a presión (200) que sirve para la transferencia de una pieza que debe ser tratada en un equipo de tratamiento, desde el interior de un recipiente portátil estanco a presión (100) del tipo constituido por un alojamiento en forma de caja (102) provista de una abertura de acceso (104) hecha estanca por un medio que forma una puerta separable (124) y un medio que forma válvula inyectora de gas (129), en un ambiente especificado, e inversamente, comprendiendo dicho dispositivo de enlace una sección de entrada/salida única y estando constituido por los elementos siguientes: una estructura en forma de caja (201) que comprende una zona de puerta que define un espacio interior (204) provisto de una abertura (205a) y de una segunda abertura (205''A) opuesta a dicha primera abertura y que comunica con dicho ambiente especificado; un medio que forma recubrimiento (214a) mandado por un medio de mando (209A) que sirve para hacer estanca dicha primera abertura para permitir a la zonade puerta actuar como sala de cambio; un medio que forma un manipulador de transporte (216A) provisto de un medio de aprehensión de pieza (218A) montado en dicha zona de puerta; medio de recepción de recipiente (221A) dispuestos por delante de dicha primera abertura con vistas a recibir un recipiente bien en una primera posición, a saber una posición de espera, o bien en una segunda posición, a saber una posición activa, adyacente a dicha primera abertura; un medio de aprieto/accionamiento (225a y b) que sirve para apretar y desplazar el recipiente de dicha primera posición a dicha segunda posición e inversamente.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP92480111A EP0582018B1 (en) | 1992-08-04 | 1992-08-04 | Pressurized interface apparatus for transferring a semiconductor wafer between a pressurized sealable transportable container and a processing equipment |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2079829T3 true ES2079829T3 (es) | 1996-01-16 |
Family
ID=8211798
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES92480111T Expired - Lifetime ES2079829T3 (es) | 1992-08-04 | 1992-08-04 | Aparato de enlace a presion para transferir una rebanada semiconductora entre un recipiente transportable estanco a presion y un equipo de tratamiento. |
Country Status (7)
Country | Link |
---|---|
US (1) | US5382127A (es) |
EP (1) | EP0582018B1 (es) |
JP (1) | JP2641377B2 (es) |
AT (1) | ATE129360T1 (es) |
CA (1) | CA2094436C (es) |
DE (1) | DE69205571T2 (es) |
ES (1) | ES2079829T3 (es) |
Families Citing this family (62)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2697003B1 (fr) * | 1992-10-16 | 1994-11-18 | Commissariat Energie Atomique | Système de manipulation et de confinement d'objets plats dans des boîtes individuelles. |
FR2733036B1 (fr) * | 1995-04-14 | 1997-07-04 | Unir | Dispositif de protection anti-contamination rapprochee |
US5759006A (en) * | 1995-07-27 | 1998-06-02 | Nitto Denko Corporation | Semiconductor wafer loading and unloading apparatus, and semiconductor wafer transport containers for use therewith |
US5997588A (en) * | 1995-10-13 | 1999-12-07 | Advanced Semiconductor Materials America, Inc. | Semiconductor processing system with gas curtain |
US5810537A (en) * | 1995-10-18 | 1998-09-22 | Bye/Oasis Engineering Inc. | Isolation chamber transfer apparatus |
FR2747112B1 (fr) | 1996-04-03 | 1998-05-07 | Commissariat Energie Atomique | Dispositif de transport d'objets plats et procede de transfert de ces objets entre ledit dispositif et une machine de traitement |
FR2747111B1 (fr) | 1996-04-03 | 1998-04-30 | Commissariat Energie Atomique | Systeme d'accouplement pour un transfert confine d'un objet plat d'une boite de confinement vers une unite de traitement de l'objet |
US5882171A (en) * | 1996-10-01 | 1999-03-16 | Balzers Aktiengesellschaft | Transport and transfer apparatus |
JP2853677B2 (ja) * | 1996-10-28 | 1999-02-03 | 日本電気株式会社 | 半導体装置製造ライン |
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FR2874744B1 (fr) * | 2004-08-30 | 2006-11-24 | Cit Alcatel | Interface sous vide entre une boite de mini-environnement et un equipement |
US20070258796A1 (en) * | 2006-04-26 | 2007-11-08 | Englhardt Eric A | Methods and apparatus for transporting substrate carriers |
CN102548217B (zh) * | 2010-12-14 | 2014-10-01 | 富葵精密组件(深圳)有限公司 | 固持装置 |
CN105592944B (zh) * | 2013-07-29 | 2018-05-11 | 贝克太阳能有限公司 | 对基板进行的空间有限的加工 |
CN107112265B (zh) * | 2015-01-09 | 2020-12-04 | 应用材料公司 | 基板传送机构 |
US11798826B2 (en) * | 2020-09-18 | 2023-10-24 | Nanya Technology Corporation | Wafer-measuring apparatus and wafer-transferring method thereof |
IT202100003611A1 (it) * | 2021-02-17 | 2022-08-17 | Geico Spa | Metodo e impianto per il trattamento superficiale di scocche di veicoli o parti di esse |
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JPS57113245A (en) * | 1980-12-29 | 1982-07-14 | Fujitsu Ltd | Sample conveying method into vacuum device |
US4758127A (en) * | 1983-06-24 | 1988-07-19 | Canon Kabushiki Kaisha | Original feeding apparatus and a cassette for containing the original |
JPS6026662A (ja) * | 1983-07-21 | 1985-02-09 | バルツエルス・アクチエンゲゼルシヤフト | 材料担体を使用する真空スライド装置 |
JPH0787084B2 (ja) * | 1985-02-06 | 1995-09-20 | 株式会社日立製作所 | 真空装置の試料交換機構 |
US4724874A (en) * | 1986-05-01 | 1988-02-16 | Asyst Technologies | Sealable transportable container having a particle filtering system |
FR2620049B2 (fr) * | 1986-11-28 | 1989-11-24 | Commissariat Energie Atomique | Procede de traitement, stockage et/ou transfert d'un objet dans une atmosphere de haute proprete, et conteneur pour la mise en oeuvre de ce procede |
US4776745A (en) * | 1987-01-27 | 1988-10-11 | The United States Of America As Represented By The Secretary Of The Air Force | Substrate handling system |
JP2539447B2 (ja) * | 1987-08-12 | 1996-10-02 | 株式会社日立製作所 | 枚葉キャリアによる生産方法 |
JPS6444036A (en) * | 1987-08-12 | 1989-02-16 | Hitachi Ltd | Mechanism for transferring wafer between apparatuses |
JPS6464231A (en) * | 1987-09-03 | 1989-03-10 | Toshiba Corp | Conveyor |
JPH01125821A (ja) * | 1987-11-10 | 1989-05-18 | Matsushita Electric Ind Co Ltd | 気相成長装置 |
JPH0227356A (ja) * | 1988-07-15 | 1990-01-30 | Fujitsu Ltd | 防塵型板状体保管ケース |
US4901011A (en) * | 1988-11-04 | 1990-02-13 | Tokyo Electron Limited | Carrier for transferring plate-like objects one by one, a handling apparatus for loading or unloading the carrier, and a wafer probing machine fitted with the handling apparatus for the wafer carrier |
US4995430A (en) * | 1989-05-19 | 1991-02-26 | Asyst Technologies, Inc. | Sealable transportable container having improved latch mechanism |
JPH03214645A (ja) * | 1990-01-18 | 1991-09-19 | Mitsubishi Electric Corp | 半導体ウエハの収納・搬送装置 |
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JPH0419081A (ja) * | 1990-05-15 | 1992-01-23 | Seiko Instr Inc | 真空内搬送ロボット |
DE4024973C2 (de) * | 1990-08-07 | 1994-11-03 | Ibm | Anordnung zum Lagern, Transportieren und Einschleusen von Substraten |
US5145303A (en) * | 1991-02-28 | 1992-09-08 | Mcnc | Method and apparatus for reducing particulate contamination in processing chambers |
-
1992
- 1992-08-04 ES ES92480111T patent/ES2079829T3/es not_active Expired - Lifetime
- 1992-08-04 EP EP92480111A patent/EP0582018B1/en not_active Expired - Lifetime
- 1992-08-04 AT AT92480111T patent/ATE129360T1/de not_active IP Right Cessation
- 1992-08-04 DE DE69205571T patent/DE69205571T2/de not_active Expired - Lifetime
-
1993
- 1993-04-20 CA CA002094436A patent/CA2094436C/en not_active Expired - Fee Related
- 1993-06-29 JP JP5158474A patent/JP2641377B2/ja not_active Expired - Fee Related
- 1993-08-03 US US08/102,076 patent/US5382127A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
ATE129360T1 (de) | 1995-11-15 |
EP0582018B1 (en) | 1995-10-18 |
US5382127A (en) | 1995-01-17 |
JPH06104333A (ja) | 1994-04-15 |
CA2094436A1 (en) | 1994-02-05 |
CA2094436C (en) | 1998-10-27 |
JP2641377B2 (ja) | 1997-08-13 |
DE69205571T2 (de) | 1996-06-13 |
DE69205571D1 (de) | 1995-11-23 |
EP0582018A1 (en) | 1994-02-09 |
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