JPS6464231A - Conveyor - Google Patents
ConveyorInfo
- Publication number
- JPS6464231A JPS6464231A JP21911187A JP21911187A JPS6464231A JP S6464231 A JPS6464231 A JP S6464231A JP 21911187 A JP21911187 A JP 21911187A JP 21911187 A JP21911187 A JP 21911187A JP S6464231 A JPS6464231 A JP S6464231A
- Authority
- JP
- Japan
- Prior art keywords
- knots
- intermediating
- conveying
- follower
- knot
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Testing Electric Properties And Detecting Electric Faults (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
PURPOSE:To reduce dusting characteristics, to save space and to enable conveyance smoothly by arranging a conveying arm consisting of a four-bar link mechanism, a fixing knot of which is fixed into an anteroom, into a vacuum treater and holding an article to be treated to an intermediating knot for the conveying arm. CONSTITUTION:A conveying arm 5a conveying a tray 12, on which an article to be treated 11 is placed, into a treating chamber 1 from a loading mechanism 13 and a conveying arm 5b conveying the tray 12 to a separating mechanism 14 from the treating chamber 1 are installed into an anteroom 2. Each conveying arm 5a, 5b is composed of four-bar link mechanisms made up of fixing knots 2b, drive knots 6, intermediating knots 7 and follower knots 8. One ends of the drive knots 6 and one ends of the follower knots 8 are respectively connected rotatably at the specified positions of the fixing knots 2b, and the other ends of the drive knots 6 and the follower knots 8 are engaged by the intermediating knots 7. Holding arms 10 are fixed at one ends of the intermediating knots 7. The intermediating knot 7 and the follower knot 8 are formed to a straight shape at the atmospheric air side terminal of the locus 17 of the center of the article to be treated 11, and a point P3, a point P4 and a point P5 are arranged on a straight line. Accordingly, the conveying arms can be operated smoothly.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21911187A JPS6464231A (en) | 1987-09-03 | 1987-09-03 | Conveyor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21911187A JPS6464231A (en) | 1987-09-03 | 1987-09-03 | Conveyor |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6464231A true JPS6464231A (en) | 1989-03-10 |
Family
ID=16730422
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP21911187A Pending JPS6464231A (en) | 1987-09-03 | 1987-09-03 | Conveyor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6464231A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5364222A (en) * | 1992-02-05 | 1994-11-15 | Tokyo Electron Limited | Apparatus for processing wafer-shaped substrates |
US5382127A (en) * | 1992-08-04 | 1995-01-17 | International Business Machines Corporation | Pressurized interface apparatus for transferring a semiconductor wafer between a pressurized sealable transportable container and a processing equipment |
US5486080A (en) * | 1994-06-30 | 1996-01-23 | Diamond Semiconductor Group, Inc. | High speed movement of workpieces in vacuum processing |
EP1119022A2 (en) * | 1995-07-19 | 2001-07-25 | Hitachi, Ltd. | Vacuum processing apparatus and semiconductor manufacturing line using the same |
US6748293B1 (en) | 2003-03-24 | 2004-06-08 | Varian Semiconductor Equipment Associates, Inc. | Methods and apparatus for high speed object handling |
JP2006156762A (en) * | 2004-11-30 | 2006-06-15 | Sumitomo Eaton Noba Kk | Wafer treatment apparatus and method therefor, and ion implanter |
-
1987
- 1987-09-03 JP JP21911187A patent/JPS6464231A/en active Pending
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5364222A (en) * | 1992-02-05 | 1994-11-15 | Tokyo Electron Limited | Apparatus for processing wafer-shaped substrates |
US5382127A (en) * | 1992-08-04 | 1995-01-17 | International Business Machines Corporation | Pressurized interface apparatus for transferring a semiconductor wafer between a pressurized sealable transportable container and a processing equipment |
US5486080A (en) * | 1994-06-30 | 1996-01-23 | Diamond Semiconductor Group, Inc. | High speed movement of workpieces in vacuum processing |
EP1119022A2 (en) * | 1995-07-19 | 2001-07-25 | Hitachi, Ltd. | Vacuum processing apparatus and semiconductor manufacturing line using the same |
US6752579B2 (en) | 1995-07-19 | 2004-06-22 | Hitachi, Ltd. | Vacuum processing apparatus and semiconductor manufacturing line using the same |
US6895685B2 (en) | 1995-07-19 | 2005-05-24 | Hitachi, Ltd. | Vacuum processing apparatus and semiconductor manufacturing line using the same |
US7347656B2 (en) | 1995-07-19 | 2008-03-25 | Hitachi, Ltd. | Vacuum processing apparatus and semiconductor manufacturing line using the same |
US6748293B1 (en) | 2003-03-24 | 2004-06-08 | Varian Semiconductor Equipment Associates, Inc. | Methods and apparatus for high speed object handling |
JP2006156762A (en) * | 2004-11-30 | 2006-06-15 | Sumitomo Eaton Noba Kk | Wafer treatment apparatus and method therefor, and ion implanter |
US8096744B2 (en) | 2004-11-30 | 2012-01-17 | Sen Corporation, An Shi And Axcelis Company | Wafer processing system, wafer processing method, and ion implantation system |
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