CN101236897B - 半导体装置的制造方法 - Google Patents
半导体装置的制造方法 Download PDFInfo
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- CN101236897B CN101236897B CN2008100094499A CN200810009449A CN101236897B CN 101236897 B CN101236897 B CN 101236897B CN 2008100094499 A CN2008100094499 A CN 2008100094499A CN 200810009449 A CN200810009449 A CN 200810009449A CN 101236897 B CN101236897 B CN 101236897B
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310052224.2A CN103456686B (zh) | 2007-02-02 | 2008-02-02 | 半导体装置的制造方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007023747 | 2007-02-02 | ||
| JP2007023747 | 2007-02-02 | ||
| JP2007-023747 | 2007-02-02 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310052224.2A Division CN103456686B (zh) | 2007-02-02 | 2008-02-02 | 半导体装置的制造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101236897A CN101236897A (zh) | 2008-08-06 |
| CN101236897B true CN101236897B (zh) | 2013-03-27 |
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Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310052224.2A Expired - Fee Related CN103456686B (zh) | 2007-02-02 | 2008-02-02 | 半导体装置的制造方法 |
| CN2008100094499A Expired - Fee Related CN101236897B (zh) | 2007-02-02 | 2008-02-02 | 半导体装置的制造方法 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310052224.2A Expired - Fee Related CN103456686B (zh) | 2007-02-02 | 2008-02-02 | 半导体装置的制造方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (3) | US7968382B2 (enExample) |
| JP (4) | JP5214988B2 (enExample) |
| KR (2) | KR101470806B1 (enExample) |
| CN (2) | CN103456686B (enExample) |
Families Citing this family (100)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101617399B (zh) * | 2007-02-27 | 2011-05-18 | 富士通半导体股份有限公司 | 半导体存储器件及其制造、测试方法、封装树脂形成方法 |
| JP5388500B2 (ja) | 2007-08-30 | 2014-01-15 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| EP2218059B1 (en) * | 2007-11-06 | 2015-07-15 | Vallourec Oil And Gas France | Rfid transponder enclosure for harsh enviroments |
| US20090135366A1 (en) * | 2007-11-26 | 2009-05-28 | World Properties, Inc. | PDLC with thermally transferred electrode |
| US7829971B2 (en) * | 2007-12-14 | 2010-11-09 | Denso Corporation | Semiconductor apparatus |
| US20090193676A1 (en) * | 2008-01-31 | 2009-08-06 | Guo Shengguang | Shoe Drying Apparatus |
| US8216876B2 (en) * | 2008-02-20 | 2012-07-10 | Sharp Kabushiki Kaisha | Method for manufacturing flexible semiconductor substrate |
| EP2172977A1 (en) | 2008-10-03 | 2010-04-07 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
| JP2011003522A (ja) | 2008-10-16 | 2011-01-06 | Semiconductor Energy Lab Co Ltd | フレキシブル発光装置、電子機器及びフレキシブル発光装置の作製方法 |
| TW202404099A (zh) * | 2008-11-07 | 2024-01-16 | 日商半導體能源研究所股份有限公司 | 半導體裝置和其製造方法 |
| CN101740631B (zh) * | 2008-11-07 | 2014-07-16 | 株式会社半导体能源研究所 | 半导体装置及该半导体装置的制造方法 |
| JP2010129785A (ja) * | 2008-11-27 | 2010-06-10 | Mitsubishi Heavy Ind Ltd | 光電変換装置の製造方法 |
| US8742531B2 (en) * | 2008-12-08 | 2014-06-03 | Arizona Board Of Regents, Acting For And On Behalf Of Arizona State University | Electrical devices including dendritic metal electrodes |
| JP4894910B2 (ja) * | 2009-01-15 | 2012-03-14 | 株式会社デンソー | 半導体装置の製造方法及び半導体装置並びにその半導体装置を内蔵する多層基板 |
| US8247276B2 (en) * | 2009-02-20 | 2012-08-21 | Semiconductor Energy Laboratory Co., Ltd. | Thin film transistor, method for manufacturing the same, and semiconductor device |
| KR101613865B1 (ko) * | 2009-03-26 | 2016-04-20 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 발광 장치 및 그 제작 방법 |
| JP2011009704A (ja) * | 2009-05-26 | 2011-01-13 | Seiko Epson Corp | 薄膜装置、薄膜装置を備えた可撓性回路基板、及び薄膜装置の製造方法 |
| KR101810699B1 (ko) * | 2009-06-30 | 2018-01-25 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 제작 방법 |
| EP2315375A1 (fr) * | 2009-07-07 | 2011-04-27 | Gemalto SA | Dispositif indicateur de champ radiofréquence et procédé de fabrication |
| EP2284922A1 (en) * | 2009-08-06 | 2011-02-16 | Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO | Method of manufacturing an opto-electric device |
| KR101149433B1 (ko) * | 2009-08-28 | 2012-05-22 | 삼성모바일디스플레이주식회사 | 플렉서블 표시 장치 및 그 제조 방법 |
| CN102024410B (zh) | 2009-09-16 | 2014-10-22 | 株式会社半导体能源研究所 | 半导体装置及电子设备 |
| CN104157694A (zh) | 2009-09-30 | 2014-11-19 | 大日本印刷株式会社 | 薄膜元件用基板、薄膜元件、薄膜晶体管及其制造方法 |
| KR101155900B1 (ko) * | 2009-11-10 | 2012-06-20 | 삼성모바일디스플레이주식회사 | 무기막, 상기 무기막을 포함하는 표시 장치 및 그 제조 방법 |
| KR101084230B1 (ko) * | 2009-11-16 | 2011-11-16 | 삼성모바일디스플레이주식회사 | 유기 발광 표시 장치 및 유기 발광 표시 장치의 제조 방법 |
| CN102074616B (zh) * | 2009-11-19 | 2013-03-27 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 一种选择性发射极太阳能电池的制备方法 |
| CN104022115B (zh) | 2009-12-25 | 2017-04-12 | 株式会社半导体能源研究所 | 半导体装置 |
| JP2011233858A (ja) * | 2010-04-09 | 2011-11-17 | Dainippon Printing Co Ltd | 薄膜素子用基板の製造方法、薄膜素子の製造方法、薄膜トランジスタの製造方法、薄膜素子、および薄膜トランジスタ |
| US8634228B2 (en) * | 2010-09-02 | 2014-01-21 | Semiconductor Energy Laboratory Co., Ltd. | Driving method of semiconductor device |
| JP5852874B2 (ja) * | 2010-12-28 | 2016-02-03 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| JP5872912B2 (ja) * | 2011-01-21 | 2016-03-01 | 株式会社半導体エネルギー研究所 | 発光装置 |
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| CN1397984A (zh) * | 2001-07-16 | 2003-02-19 | 株式会社半导体能源研究所 | 半导体器件及剥离方法以及半导体器件的制造方法 |
| CN1472772A (zh) * | 2002-07-16 | 2004-02-04 | ��ʽ����뵼����Դ�о��� | 剥离方法 |
| US7084045B2 (en) * | 2003-12-12 | 2006-08-01 | Seminconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
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|---|---|
| US20150270321A1 (en) | 2015-09-24 |
| JP2017010053A (ja) | 2017-01-12 |
| KR101470806B1 (ko) | 2014-12-09 |
| CN103456686B (zh) | 2016-09-14 |
| JP6175174B2 (ja) | 2017-08-02 |
| US8994060B2 (en) | 2015-03-31 |
| CN103456686A (zh) | 2013-12-18 |
| JP2013153177A (ja) | 2013-08-08 |
| US9184221B2 (en) | 2015-11-10 |
| US7968382B2 (en) | 2011-06-28 |
| JP2015167135A (ja) | 2015-09-24 |
| JP2008211191A (ja) | 2008-09-11 |
| KR101467973B1 (ko) | 2014-12-02 |
| CN101236897A (zh) | 2008-08-06 |
| JP5214988B2 (ja) | 2013-06-19 |
| KR20140041655A (ko) | 2014-04-04 |
| US20110248291A1 (en) | 2011-10-13 |
| US20090004772A1 (en) | 2009-01-01 |
| JP6014195B2 (ja) | 2016-10-25 |
| KR20080072571A (ko) | 2008-08-06 |
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