BRPI0718418A2 - Método de fabricação de um artigo semicondutor, chip de rede, cabeça de impressora de led, impressora de led, elemento semicondutor, método de fabricação de um dispositivo emissor de luz,, dispositivo emissor de luz, método de fabricação de uma rede de led, e, estrutura ligada - Google Patents

Método de fabricação de um artigo semicondutor, chip de rede, cabeça de impressora de led, impressora de led, elemento semicondutor, método de fabricação de um dispositivo emissor de luz,, dispositivo emissor de luz, método de fabricação de uma rede de led, e, estrutura ligada

Info

Publication number
BRPI0718418A2
BRPI0718418A2 BRPI0718418-2A2A BRPI0718418A BRPI0718418A2 BR PI0718418 A2 BRPI0718418 A2 BR PI0718418A2 BR PI0718418 A BRPI0718418 A BR PI0718418A BR PI0718418 A2 BRPI0718418 A2 BR PI0718418A2
Authority
BR
Brazil
Prior art keywords
led
manufacturing
led device
semiconductor
light
Prior art date
Application number
BRPI0718418-2A2A
Other languages
English (en)
Portuguese (pt)
Inventor
Takao Yonehara
Kenji Yamagata
Yoshinobu Sekiguchi
Kojiro Nishi
Original Assignee
Canon Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Kk filed Critical Canon Kk
Publication of BRPI0718418A2 publication Critical patent/BRPI0718418A2/pt

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
    • B41J2/447—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources
    • B41J2/45—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources using light-emitting diode [LED] or laser arrays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
    • H10H20/018—Bonding of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P58/00—Singulating wafers or substrates into multiple chips, i.e. dicing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/11—Separation of active layers from substrates

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Led Devices (AREA)
  • Led Device Packages (AREA)
  • Semiconductor Lasers (AREA)
BRPI0718418-2A2A 2006-10-27 2007-10-25 Método de fabricação de um artigo semicondutor, chip de rede, cabeça de impressora de led, impressora de led, elemento semicondutor, método de fabricação de um dispositivo emissor de luz,, dispositivo emissor de luz, método de fabricação de uma rede de led, e, estrutura ligada BRPI0718418A2 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006293306 2006-10-27
JP2006311625A JP5171016B2 (ja) 2006-10-27 2006-11-17 半導体部材、半導体物品の製造方法、その製造方法を用いたｌｅｄアレイ
PCT/JP2007/071267 WO2008050901A1 (en) 2006-10-27 2007-10-25 Semiconductor member, semiconductor article manufacturing method, and led array using the manufacturing method

Publications (1)

Publication Number Publication Date
BRPI0718418A2 true BRPI0718418A2 (pt) 2013-11-12

Family

ID=39324679

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0718418-2A2A BRPI0718418A2 (pt) 2006-10-27 2007-10-25 Método de fabricação de um artigo semicondutor, chip de rede, cabeça de impressora de led, impressora de led, elemento semicondutor, método de fabricação de um dispositivo emissor de luz,, dispositivo emissor de luz, método de fabricação de uma rede de led, e, estrutura ligada

Country Status (9)

Country Link
US (2) US8237761B2 (https=)
EP (1) EP2082439B1 (https=)
JP (1) JP5171016B2 (https=)
KR (1) KR101243522B1 (https=)
CN (1) CN101529605B (https=)
BR (1) BRPI0718418A2 (https=)
RU (1) RU2416135C2 (https=)
TW (1) TWI387129B (https=)
WO (1) WO2008050901A1 (https=)

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RU2009120060A (ru) 2011-01-10
CN101529605A (zh) 2009-09-09
TW200834988A (en) 2008-08-16
WO2008050901A1 (en) 2008-05-02
KR101243522B1 (ko) 2013-03-21
EP2082439A4 (en) 2011-08-03
US20120282716A1 (en) 2012-11-08
KR20090074091A (ko) 2009-07-03
CN101529605B (zh) 2011-05-11
TWI387129B (zh) 2013-02-21
US20100026779A1 (en) 2010-02-04
US8670015B2 (en) 2014-03-11
US8237761B2 (en) 2012-08-07
JP5171016B2 (ja) 2013-03-27

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