Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L21/02104—Forming layers
  • H01L21/02107—Forming insulating materials on a substrate
  • H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
  • H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
  • H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
  • H01L21/02126—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
  • H01L21/0214—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC the material being a silicon oxynitride, e.g. SiON or SiON:H
• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C8/00—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
  • C23C8/06—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using gases
  • C23C8/34—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using gases more than one element being applied in more than one step
• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C8/00—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
  • C23C8/06—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using gases
  • C23C8/36—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using gases using ionised gases, e.g. ionitriding
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
  • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
  • H01J37/32—Gas-filled discharge tubes
  • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
  • H01J37/32192—Microwave generated discharge
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L21/02104—Forming layers
  • H01L21/02107—Forming insulating materials on a substrate
  • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
  • H01L21/02227—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process
  • H01L21/0223—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate
  • H01L21/02233—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate of the semiconductor substrate or a semiconductor layer
  • H01L21/02236—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate of the semiconductor substrate or a semiconductor layer group IV semiconductor
  • H01L21/02238—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate of the semiconductor substrate or a semiconductor layer group IV semiconductor silicon in uncombined form, i.e. pure silicon
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L21/02104—Forming layers
  • H01L21/02107—Forming insulating materials on a substrate
  • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
  • H01L21/02227—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process
  • H01L21/02252—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by plasma treatment, e.g. plasma oxidation of the substrate
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L21/02104—Forming layers
  • H01L21/02107—Forming insulating materials on a substrate
  • H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
  • H01L21/02318—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment
  • H01L21/02321—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment introduction of substances into an already existing insulating layer
  • H01L21/02329—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment introduction of substances into an already existing insulating layer introduction of nitrogen
  • H01L21/02332—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment introduction of substances into an already existing insulating layer introduction of nitrogen into an oxide layer, e.g. changing SiO to SiON
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L21/02104—Forming layers
  • H01L21/02107—Forming insulating materials on a substrate
  • H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
  • H01L21/02318—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment
  • H01L21/02337—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment treatment by exposure to a gas or vapour
  • H01L21/0234—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment treatment by exposure to a gas or vapour treatment by exposure to a plasma
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L21/02104—Forming layers
  • H01L21/02107—Forming insulating materials on a substrate
  • H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
  • H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
  • H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
  • H01L21/02164—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material being a silicon oxide, e.g. SiO2
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L21/02104—Forming layers
  • H01L21/02107—Forming insulating materials on a substrate
  • H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
  • H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
  • H01L21/02172—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides
  • H01L21/02175—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides characterised by the metal
  • H01L21/02181—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides characterised by the metal the material containing hafnium, e.g. HfO2
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L21/02104—Forming layers
  • H01L21/02107—Forming insulating materials on a substrate
  • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
  • H01L21/02227—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process
  • H01L21/02249—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by combined oxidation and nitridation performed simultaneously
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
  • H10D1/00—Resistors, capacitors or inductors
  • H10D1/60—Capacitors
  • H10D1/68—Capacitors having no potential barriers
  • H10D1/682—Capacitors having no potential barriers having dielectrics comprising perovskite structures
  • H10D1/684—Capacitors having no potential barriers having dielectrics comprising perovskite structures the dielectrics comprising multiple layers, e.g. comprising buffer layers, seed layers or gradient layers

Definitions

• the present invention generally relates to methods and systems suitable for producing electric devices and materials used for electronic devices.
• the present invention generally relates to a method for preparing an interfacial layer for a high-k dielectric layer on a substrate.
• a surface of said substrate is exposed to oxygen radicals formed by ultraviolet (UV) radiation induced dissociation of a first process gas comprising at least one molecular composition comprising oxygen to form an oxide film.
• the oxide film is exposed to nitrogen radicals formed by plasma induced dissociation of a second process gas comprising at least one molecular composition comprising nitrogen to nitridate the oxide film to form the interfacial layer.
• a high-k dielectric layer is formed on said interfacial layer.
• FIG. 1 illustrates one embodiment of a treatment system 1 for forming an oxynitride layer on a substrate.
• FIG. 2 illustrates one embodiment of schematic diagram of a processing system for performing an oxidation process.
• FIG. 3 illustrates one embodiment of an alternative processing system.
• FIG. 4 illustrates one embodiment of a plasma processing system containing a slot plane antenna (SPA) plasma source for processing a gate stack.
• SPA slot plane antenna
• FIG. 1 illustrates a treatment system 1 for forming an oxynitride layer on a substrate.
• the substrate can comprise a silicon substrate and the oxynitride layer can comprise a silicon oxynitride layer formed via oxidation and nitridation of the substrate.
• the substrate surface may be a silicon surface, an oxide surface, or a silicon oxide surface.
• the treatment system 1 comprises an oxidation system 10 configured to introduce an oxygen containing molecular composition to the substrate, and a nitridation system 20 configured to introduce a nitrogen containing molecular composition to the substrate.
• treatment system 1 further comprises a controller 30 coupled to the oxidation system 10 and the nitridation system 20, and configured to perform at least one of monitoring, adjusting, or controlling the process(es) performed in the oxidation system 10 and the nitridation system 20.
• controller 30 coupled to the oxidation system 10 and the nitridation system 20, and configured to perform at least one of monitoring, adjusting, or controlling the process(es) performed in the oxidation system 10 and the nitridation system 20.
• the oxidation system 10 and the nitridation system 20 are illustrated as separate modules in FIG. 1, they may comprise the same module.
• FIG. 2 presents a schematic diagram of a processing system for performing an oxidation process.
• the processing system 101 comprises a process chamber 110 having a substrate holder 120 configured to support a substrate 125 having a silicon (Si) surface.
• the process chamber 110 further contains an electromagnetic radiation assembly 130 for exposing the substrate 125 to electromagnetic radiation.
• the processing system 101 contains a power source 150 coupled to the electromagnetic radiation assembly 130, and a substrate temperature control system 160 coupled to substrate holder 120 and configured to elevate and control the temperature of substrate 125.
• a gas supply system 140 is coupled to the process chamber 110, and configured to introduce a process gas to process chamber 110.
• the process gas can include an oxygen containing gas, such as, for example, O 2 , NO, NO 2 or N 2 O.
• the process gas can be introduced at a flow rate of about 30 seem to about 5 slm, which includes 30, 35, 40, 45, 50, 55, 60, 65, 70, 75, 80, 85, 90, 100, 250, 275, 300, 400, 500, 600, 700, 800, 900, or 1000 (seem), 2, 3, 4, or 5 (slm), or any combination thereof.
• a purge gas can be introduced to process chamber 110.
• the purge gas may comprise an inert gas, such nitrogen or a noble gas (i.e., helium, neon, argon, xenon, krypton).
• the flow rate of the purge gas can be about 0 slm to about 5 slm, which includes 0, 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 20, 30, 35, 40, 45, 50, 55, 60, 65, 70, 75, 80, 85, 90, 100, 250, 275, 300, 400, 500, 600, 700, 800, 900, or 1000 (seem), 2, 3, 4, or 5 (slm), or any combination thereof.
• the electromagnetic radiation assembly 130 can, for example, comprise an ultraviolet (UV) radiation source.
• the UV source may be monochromatic or polychromatic. Additionally, the UV source can be configured to produce radiation at a wavelength sufficient for dissociating the process gas, i.e., O 2 .
• the ultraviolet radiation has a wavelength from about 145 nm to about 192 nm, which includes 145, 147, 150, 155, 171, 172, 173, 175, 180, 185, 190, and 192 nm as appropriate for the binding energy of the molecule which is dissociated.
• the electromagnetic radiation assembly 130 can operate at a power of about 5 mW/cm 2 to about 50 mW/cm 2 , which includes 5, 6, 7, 8, 9, 10, 11, 13, 15, 17, 19, 20, 30, 40, 50 mW/cm 2 , or any combination thereof.
• the electromagnetic radiation assembly 130 can include one, two, three, four, or more radiation sources.
• the sources can include lamps or lasers or a combination thereof.
• the processing system 101 may be configured to process 200 mm substrates, 300 mm substrates, or larger-sized substrates. In fact, it is contemplated that the processing system may be configured to process substrates, wafers, or LCDs regardless of their size, as would be appreciated by those skilled in the art.
• processing system 101 comprises substrate temperature control system 160 coupled to the substrate holder 120 and configured to elevate and control the temperature of substrate 125.
• Substrate temperature control system 160 comprises temperature control elements, such as a heating system that may comprise resistive heating elements, or thermoelectric heaters/coolers. Additionally, substrate temperature control system 160 may comprise a cooling system including a re-circulating coolant flow that receives heat from substrate holder 120 and transfers heat to a heat exchanger system (not shown), or when heating, transfers heat from the heat exchanger system.
• the substrate temperature control system 160 may include temperature control elements disposed in the chamber wall of the process chamber 110 and any other component within the processing system 101.
• the substrate holder 120 can include a mechanical clamping system, or an electrical clamping system, such as an electrostatic clamping system, to affix substrate 125 to an upper surface of substrate holder 120.
• substrate holder 120 can further include a substrate backside gas delivery system configured to introduce gas to the back-side of substrate 125 in order to improve the gas-gap thermal conductance between substrate 125 and substrate holder 120.
• a substrate backside gas delivery system configured to introduce gas to the back-side of substrate 125 in order to improve the gas-gap thermal conductance between substrate 125 and substrate holder 120.
• the substrate backside gas system can comprise a two-zone gas distribution system, wherein the helium gas gap pressure can be independently varied between the center and the edge of substrate 125.
• the process chamber 110 is further coupled to a pressure control system 132, including a vacuum pumping system 134 and a valve 136, through a duct 138, wherein the pressure control system 134 is configured to controllably evacuate the process chamber 110 to a pressure suitable for forming the thin film on substrate 125, and suitable for use of the first and second process materials.
• the vacuum pumping system 134 can include a turbo-molecular vacuum pump (TMP) capable of a pumping speed up to about 5000 liters per second (and greater) and valve 136 can include a gate valve for throttling the chamber pressure. In conventional plasma processing devices, a about 500 to about 3000 liter per second TMP is generally employed.
• a device for monitoring chamber pressure can be coupled to the processing chamber 10.
• the pressure measuring device can be, for example, a Type 628B Baratron absolute capacitance manometer commercially available from MKS Instruments, Inc. (Andover, MA).
• the processing system 101 contains a controller 170 coupled to the process chamber 110, substrate holder 120, electromagnetic radiation assembly 130, power source 150, and substrate temperature control system 160.
• controller 170 can be coupled to a one or more additional controllers/computers (not shown), and controller 70 can obtain setup and/or configuration information from an additional controller/computer.
• singular processing elements 110, 120, 130, 150, 160, and 170
• the processing system 1 can comprise any number of processing elements having any number of controllers associated with them in addition to independent processing elements.
• the controller 170 can be used to configure any number of processing elements (110, 120, 130, 150, and 160), and the controller 170 can collect, provide, process, store, and display data from processing elements.
• the controller 170 can comprise a number of applications for controlling one or more of the processing elements.
• controller 170 can include a graphic user interface (GUI) component (not shown) that can provide easy to use interfaces that enable a user to monitor and/or control one or more processing elements.
• GUI graphic user interface
• controller 170 can comprise a microprocessor, memory, and a digital I/O port capable of generating control voltages sufficient to communicate and activate inputs to processing system 101 as well as monitor outputs from processing system 101.
• a program stored in the memory may be utilized to activate the inputs to the aforementioned components of the processing system 101 according to a process recipe in order to perform process.
• the controller 170 is a DELL PRECISION WORKSTATION 610TM, available from Dell Corporation, Austin, Texas.
• the controller 170 may be locally located relative to the processing system 101, or it may be remotely located relative to the processing system 101.
• the controller 170 may exchange data with the deposition 101 using at least one of a direct connection, an intranet, the Internet and a wireless connection.
• the controller 170 may be coupled to an intranet at, for example, a customer site (i.e., a device maker, etc.), or it may be coupled to an intranet at, for example, a vendor site (i.e., an equipment manufacturer).
• the controller 160 may be coupled to the Internet.
• the processing conditions can further include a substrate temperature between about 0° C and about 1000° C. Alternately, the substrate temperature can be between about 200° C and about 700° C.
• the oxidizing may be carried out at a substrate temperature of 200, 225, 250, 275, 300, 325, 350, 375, 400, 450, 500, 550, 600, 650, 700, 750, 800, 850, 900, 950, or 1000° C, or any combination thereof.
• the pressure in the process chamber 110 can, for example, be maintained between about 10 mTorr and about 30,000 mTorr. Alternately, the pressure can be maintained between about 20 mTorr and about 1000 mTorr. Yet alternately, the pressure can be maintained between about 50 mTorr and about 500 mTorr.
• the oxidizing may be carried out at a pressure of about 1 mTorr to about 30,000 mTorr, which includes 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 20, 30, 40, 50, 60, 70, 80, 90, 100, 250, 500, 750, 1,000, 10,000, 20,000, or 30,000 mTorr, or any combination thereof.
• the processing system 200 includes a process chamber 210 accommodating therein a substrate holder 220 equipped with a heater 224 that can be a resistive heater configured to elevate the temperature of substrate 225. Alternately, the heater 224 may be a lamp heater or any other type of heater. Furthermore the process chamber 210 contains an exhaust line 238 connected to the bottom portion of the process chamber 210 and to a vacuum pump 234. The substrate holder 220 can be rotated by a drive mechanism (not shown).
• the substrate may be rotated in the plane of the substrate surface at a rate of about 1 rpm to about 60 rpm, which includes 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 30, 40, 50, or 60 rpm, or any combination thereof.
• the process chamber 210 contains a process space 245 above the substrate 225.
• the inner surface of the process chamber 210 contains an inner liner 212 made of quartz in order to suppress metal contamination of the substrate 225 to be processed.
• the process chamber 210 contains a gas line 240 with a nozzle 242 located opposite the exhaust line 238 for flowing a process gas over the substrate 225.
• the process gas crosses the substrate 225 in a processing space 245 in a laminar flow and is evacuated from the process chamber 210 by the exhaust line 238.
• a remote plasma source 252 is connected, with a gas inlet 250 suitable for generating a plasma remotely and upstream of the substrate 225.
• the substrate 225 may be exposed to ultraviolet radiation from an ultraviolet radiation source 230 emitting light through a quartz window 232 into the processing space 245 between the nozzle 242 and the substrate 225.
• the ultraviolet radiation source 230 and quartz window 232 can cover the whole substrate 225.
• a controller 270 includes a microprocessor, a memory, and a digital I/O port capable of generating control voltages sufficient to communicate and activate inputs of the processing system 200 as well as monitor outputs from the plasma processing system 200. Moreover, the controller 270 is coupled to and exchanges information with process chamber 210, the pump 234, the heater 224, the ultraviolet radiation source 230, and remote plasma source 252.
• the controller 270 may be implemented as a UNIX-based workstation. Alternately, the controller 270 can be implemented as a general-purpose computer, digital signal processing system, etc.
• Prior to oxidizing it may be desirable to clean the substrate surface, or remove a native oxide from the substrate surface.
• the substrate 125 is then placed on substrate holder 120 (FIG. 1) or 220 (FIG. 2).
• Conditions in process chamber 110 or 210 pressure, temperature, substrate rotation, etc. are then brought to the desired values.
• an oxygen containing molecular composition is introduced into process chamber 110 or 210 via gas supply system 140 or nozzle 242.
• Electromagnetic radiation assembly 130 or 230 is energized to form oxygen radicals from the process gas.
• the population of oxygen radicals can be enhanced by supplying an oxygen containing molecular composition to inlet 250. Oxygen radicals are produced as the gas passes through remote plasma source 252 and are then introduced into process chamber 210.
• the oxygen radicals associate with the surface of substrate 125 to oxidize the surface of the substrate.
• the composition of the surface can be SiO 2 .
• the oxidizing may be carried out for a time of about 5 seconds to about 25 minutes, which includes 5, 10, 15, 20, 25, 30, 35, 40, 50, 60 (seconds), 2, 3, 4, 5, 6, 7, 8, 9, 10, 15, 20, or 25 (minutes), or any combination thereof.
• the oxide film can have a thickness of about 0.1 nm to about 3 nm, which range includes 0.1, 0.2, 0.3, 0.4, 0.5, 0.6, 0.7, 0.8, 0.9, 1, 1.1, 1.2, 1.3, 1.4, 1.5, 1.6, 1.7, 1.8, 1.9, 2, 2.1, 2.3, 2.4, 2.5, 2.6, 2.7, 2.8, 2.9, or 3.0 nm.
• the oxide film may have a thickness variation ⁇ of about 0.2% to about 4%, which includes 0.2, 0.3, 0.5, 0.7, 0.9, 1, 2, 3, or 4%.
• FIG. 4 is a simplified block-diagram of a plasma processing system containing a slot plane antenna (SPA) plasma source for performing a nitridation process according to an embodiment of the invention.
• the plasma produced in the plasma processing system 400 is characterized by low electron temperature (less than about 1.5 eV) and high plasma density (e.g., >about lxlO 12 /cm 3 ), that enables damage-free processing of gate stacks according to the invention.
• the plasma processing system 400 can, for example, be a TRIASTM SPA processing system from Tokyo Electron Limited, Akasaka, Japan.
• the plasma processing system 400 contains a process chamber 450 having an opening portion 451 in the upper portion of the process chamber 450 that is larger than a substrate 458.
• a cylindrical dielectric top plate 454 made of quartz or aluminum nitride or aluminum oxide is provided to cover the opening portion 451.
• Gas lines 472 are located in the side wall of the upper portion of process chamber 450 below the top plate 454.
• the number of gas lines 472 can be 16 (only two of which are shown in FIG. 4). Alternately, a different number of gas feed lines 472 can be used.
• the gas lines 472 can be circumferentially arranged in the process chamber 450, but this is not required for the invention.
• a process gas can be evenly and uniformly supplied into the plasma region 459 in process chamber 450 from the gas lines 472.
• a feed line 472 on the upstream side of the substrate 458 relative to the exhaust may be configured as a remote RF plasma source suitable for nitridation.
• microwave power is provided to the process chamber 450 through the top plate 454 via a plane antenna member 460 having a plurality of slots 460A.
• the slot plane antenna 460 can be made from a metal plate, for example copper.
• a waveguide 463 is disposed on the top plate 454, where the waveguide 463 is connected to a microwave power supply 461 for generating microwaves with a frequency of about 2.45GHz, for example.
• the waveguide 463 contains a flat circular waveguide 463A with a lower end connected to the slot plane antenna 460, a circular waveguide 463B connected to the upper surface side of the circular waveguide 463 A, and a coaxial waveguide converter 463C connected to the upper surface side of the circular waveguide 463B. Furthermore, a rectangular waveguide 463D is connected to the side surface of the coaxial waveguide converter 463C and the microwave power supply 461.
• an axial portion 462 of an electroconductive material is coaxially provided, so that one end of the axial portion 462 is connected to the central (or nearly central) portion of the upper surface of slot plane antenna 460, and the other end of the axial portion 462 is connected to the upper surface of the circular waveguide 463B, thereby forming a coaxial structure.
• the circular waveguide 463B is constituted so as to function as a coaxial waveguide.
• the microwave power can, for example, be between about 0.5 W/cm 2 and about 4 W/cm 2 . Alternately, the microwave power can be between about 0.5 W/cm 2 and about 3 W/cm 2 .
• a substrate holder 452 is provided opposite the top plate 454 for supporting and heating a substrate 458 (e.g., a wafer).
• the substrate holder 452 contains a heater 457 to heat the substrate 458, where the heater 457 can be a resistive heater. Alternately, the heater 457 may be a lamp heater or any other type of heater.
• the process chamber 450 contains an exhaust line 453 connected to the bottom portion of the process chamber 450 and to a vacuum pump 455.
• a gas containing a molecular composition having nitrogen may be introduced into any of system 20 ( Figure 1), process chambers 110 (Figure T), 210 ( Figure 3), and/or 450 ( Figure 4).
• Any nitrogen containing composition is suitable, e.g., any OfN 2 , NH 3 , NO, N 2 O, NO 2 , alone or in combination.
• the nitrogen containing composition may be dissociated via either microwave radiation plasma induced dissociation based on microwave irradiation via a plane antenna having a plurality of slits or in-chamber plasma induced dissociation, or, alternatively, it may be dissociated by an RF plasma source located upstream of the substrate via the coupling of RF power to the nitrogen containing composition.
• any nitrogen containing composition is suitable, e.g., any of N 2 , NO, N 2 O, NO 2 , alone or in combination.
• the molecular composition in the nitriding, oxynitriding, or annealing process gas may include N 2 and optionally at least one gas selected from the group consisting of H 2 , Ar, He, Ne, Xe, or Kr, or any combination thereof.
• the molecular composition in the second process gas comprises N 2 and H 2 and optionally at least one gas selected from the group consisting OfH 2 , Ar, He, Ne, Xe, or Kr, or any combination thereof.
• the nitrogen containing molecular composition in the process gas may suitably comprise N 2 , and the nitrogen radicals are produced from plasma induced dissociation of the N 2 .
• the oxynitride film obtained under nitridation may have a thickness of about 0.1 to about 5 nm, which range includes 0.1, 0.2, 0.3, 0.4, 0.5, 0.6, 0.7, 0.8, 0.9, 1, 1.1, 1.2, 1.3, 1.4, 1.5,
• the oxynitride film may have a thickness variation ⁇ of about 0.2% to about 4%, which includes 0.2, 0.3, 0.5, 0.7, 0.9, 1, 2, 3, or 4%.
• the nitriding may be carried out at a substrate temperature of about 20° C to about
• 1000° C which range includes 20, 30, 40, 50, 60, 70, 80, 90, 100, 125, 150, 175, 200, 225, 250,
• the nitriding may be carried out at a pressure of about 1 mTorr to about 30,000 mTorr, which includes 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 20, 30, 40, 50, 60, 70, 80, 90, 100, 250, 500, 750, 1,000,
• the flow rate of the nitrogen containing molecular composition N 2 may range from about 2 seem to about 5 slm, and that of the second gas may be about 100 seem to about 5 slm.
• the nitriding may be carried out for a time of about 5 seconds to about 25 minutes, which range includes 5, 10, 15, 20, 25, 30, 35, 40, 50, 60 (seconds), 2, 3, 4, 5, 6, 7, 8, 9, 10, 15, 20, or 25 (minutes), or any combination thereof.
• the oxynitride film may have a nitrogen concentration of about 20% or less, which includes 4, 6, 8, 10, 12, 14, 16, 18, and 20% or less.
• the nitriding plasma may be generated by a microwave output of about 0.5 W/cm 2 to about 5 W/cm 2 , which includes 0.5, 0.6, 0.7, 0.8, 0.9, 1, 1.1, 1.3, 1.5, 1.7, 1.9, 2, 3, 4, or 5 W/cm 2 , or any combination thereof.
• the microwave irradiation may comprise a microwave frequency of about 300 MHz to about 10 GHz, which includes 300, 400, 500, 600, 700, 800, 900, or 1000 (MHz), 1.5, 2, 3, 4, 5, 6, 7, 8, 9, or 10 (GHz).
• the plasma may comprise an electron temperature of less than about 3 eV, which includes 0.1, 0.3, 0.5, 0.7, 0.9, 1, 1.5, 2, 2.5, or 3 eV, or any combination thereof.
• the plasma may have a density of about 1 x 10 u /cm 3 to about 1 x 10 13 /cm 3 or higher, and a density uniformity of about ⁇ 3% or less, which includes ⁇ 1, ⁇ 2, and ⁇ 3%.
• the plane antenna member may have a surface area on a surface thereof greater than the area of the substrate surface on which the film is deposited.
• the plasma chamber may be lined with quartz to prevent metal contamination.
• a horizontal plate (not shown) with holes may be located between the top plate 454 and the substrate 125 to reduce the amount of nitrogen radicals reaching the substrate.
• the plate may be made of quartz, aluminum oxide, aluminum nitride, or other material.
• the pattern of the holes in the plate is designed to provide a uniform exposure of radicals to the substrate.
• the oxynitride film may suitably have the formula SiON.
• a controller 499 includes a microprocessor, a memory, and a digital I/O port capable of generating control voltages sufficient to communicate and activate inputs of the plasma processing system 400 as well as monitor outputs from the plasma processing system 400. Moreover, the controller 499 is coupled to and exchanges information with process chamber 450, the pump 455, the heater 457, and the microwave power supply 461. A program stored in the memory is utilized to control the aforementioned components of plasma processing system 400 according to a stored process recipe.
• processing system controller 499 is a UNIX- based workstation. Alternately, the controller 499 can be implemented as a general-purpose computer, digital signal processing system, etc.
• the controller 499 may be locally located relative to the plasma processing system 400 or it may be remotely located relative to the plasma processing system 400 via an internet or intranet. Thus, the controller 499 can exchange data with the plasma processing system 400 using at least one of a direct connection, an intranet, or the internet.
• the controller 499 may be coupled to an intranet at a customer site (i.e., a device maker, etc.), or coupled to an intranet at a vendor site (i.e., an equipment manufacturer).
• another computer i.e., controller, server, etc.
• RFN nitriding can be performed.
• the oxide film (or oxynitride film) may be exposed to nitrogen radicals formed by an upstream plasma induced dissociation of an upstream process gas comprising an upstream molecular composition comprising nitrogen, and wherein said upstream plasma induced dissociation comprises using plasma generated via the coupling of radio frequency (RF) power to said upstream process gas.
• RF radio frequency
• the processing system illustrated in Figure 3 includes a remote plasma source 252 with a gas inlet 250, which is suitable for generating plasma remotely and upstream of substrate 125.
• Nitrogen plasma produced in remote plasma source 252 is caused to flow downstream and over the surface of substrate 125 to the exhaust line 238 and pump 234.
• the substrate can be rotated (as shown by the circular arrow) in the process system of Figure 3. In this way, uniformity in nitridation, oxynitridation, or annealing under nitrogen is improved.
• a remote RF plasma source can be included in feed line 472, and would be suitable as a remote RF plasma source for nitridation.
• Possible parameters for RF nitriding are set forth below: RFN
• One embodiment includes forming at least one high-k dielectric film selected from the group consisting of ZrO 2 , HfO 2 , Ta 2 O 5 , ZrSiO 4 , Al 2 O 3 , HfSiO, HfAlO, HfSiON, Si 3 N 4 , and BaSrTiO 3 , or any combination thereof, on the oxynitride film.
• the high-k dielectric film suitably has a dielectric constant higher than about 4 at about 20° C.
• the high-k dielectric film has a dielectric constant of about 4 to about 300 at about 20° C, which includes 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 30, 50, 70, 90, 100, 200, or 300, or any combination thereof.
• the high-k dielectric film may be suitably formed on the oxynitride film by at least one process selected from the group consisting of chemical vapor deposition (CVD), atomic-layer deposition (ALD), metallo-organic CVD (MOCVD), and physical vapor deposition (PVD), or any combination thereof.
• CVD chemical vapor deposition
• ALD atomic-layer deposition
• MOCVD metalo-organic CVD
• PVD physical vapor deposition
• the high-k dielectric film may be annealed and/or nitrided as appropriate. LP anneal
• the subject film e.g., the nitrided or oxynitrided film or high-k dielectric layer
• it may be annealed.
• the LP (low pressure) anneal suitably anneals the oxynitride and/or the high-k dielectric film.
• the LP annealing may be carried out at a pressure of about 5 mTorr to about 800 Torr, which includes 5, 6, 7, 8, 9, 10, 20, 30, 40, 50, 60, 70, 80, 90, 100, 250, 500, 750, 1,000, 10,000,
• the LP annealing may be carried out at a temperature of about 500° C to about 1200° C, which includes 500, 550, 600, 650, 700, 750, 800, 850, 900, 950, 1000, 1100, or 1200° C, or any combination thereof.
• the LP annealing may be carried out under an annealing gas comprising at least one molecular composition comprising oxygen, nitrogen, H 2 , Ar, He, Ne, Xe, or Kr, or any combination thereof at a flow rate of 0 to 2OsIm.
• LP annealing is effected under N 2 at an N 2 flow rate of about 0 slm to about 2OsIm, which includes 2, 3, 4, 5, 6, 7, 8, 9, 10, 20, 30, 35, 40, 45, 50, 55, 60, 65, 70, 75, 80, 85, 90, 100, 250, 275, 300, 400, 500, 600, 700, 800, 900, or 1000 (seem), 2, 3, 4, 5, 10, 15, or 20 (slm), or any combination thereof.
• the LP annealing may be carried out for a time of about 1 seconds to about 10 minutes, which range includes 1, 2, 3, 4, 5, 6, 1, 8, 9, 10, 15, 20, 25, 30, 35, 40, 50, 60 (seconds), 2, 3, 4, 5, 6, 7, 8, 9, or 10 (minutes), or any combination thereof.
• the LP annealing and the nitriding may be carried out in the same process chamber, in which case it is possible to carry out at least one purging step is carried out after the nitriding and prior to the annealing. Of course, it is also possible to carry out nitriding and the annealing in different process chambers. In this embodiment, it is possible to transfer the film-bearing substrate from one chamber to another without contacting ambient atmosphere, air, etc.
• An alternative set of conditions for performing LP annealing are set forth below: Anneal (LPA)
• the UVO2/N2 Post Anneal suitably anneals the oxynitride film or the high-k dielectric layer by exposing the film or layer to oxygen radicals and nitrogen radicals formed by ultraviolet (UV) radiation induced dissociation of an annealing gas comprising at least one molecular composition comprising oxygen and nitrogen.
• UV radiation ultraviolet
• the UVO2/N2 Post Anneal suitably anneals the oxynitride film by exposing said oxynitride film to oxygen radicals and nitrogen radicals formed by ultraviolet (UV) radiation induced dissociation of an annealing gas comprising at least one molecular composition comprising oxygen and nitrogen.
• the oxygen and nitrogen radicals are dissociated from an annealing gas comprising at least one molecular composition comprising oxygen and nitrogen selected from the group consisting of O 2 , N 2 , NO, NO 2 , and N 2 O, or any combination thereof.
• Other gases may be present for example one or more of H 2 , Ar, He, Ne, Xe, or Kr, or any combination thereof.
• the annealing gas flows across the oxynitride and/or high-k dielectric surface such that the oxygen and nitrogen radicals are comprised within a laminar flow of the annealing gas across the surface.
• the annealing may be carried out at a pressure of about 1 mTorr to about 80,000 mTorr, which includes 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 20, 30, 40, 50, 60, 70, 80, 90, 100, 250, 500, 750, 1,000,
• the annealing may be carried out at a temperature of about 400° C to about 1200° C, which includes 500, 550, 600, 650, 700, 750, 800, 850, 900, 950, 1000, 1100, or 1200° C, or any combination thereof.
• the annealing gas may have a flow rate of about 0 slm to about 2OsIm, which includes
• the annealing may be carried out for a time of about 1 second to about 10 minutes, which range includes 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 15, 20, 25, 30, 35, 40, 50, 60 (seconds), 2, 3, 4, 5,
• the ultraviolet radiation of this anneal may include wavelengths of about 145 to about
• the radiation may be monochromatic or polychromatic.
• It may originate from an ultraviolet radiation source operating at a power of about 5 mW/cm 2 to about 50 mW/cm 2 , which includes 0.5, 0.6, 0.7, 0.8, 0.9, 1, 1.1, 1.3, 1.5, 1.7, 1.9, 2, 3,
• One or more ultraviolet sources may be used.
• the annealing and the nitriding may be carried out in the same process chamber, in which case it is possible to carry out at least one purging step is carried out after the nitriding and prior to the annealing.
• the RFN post anneal suitably anneals the oxynitride film by exposing the oxynitride film to nitrogen radicals formed by an upstream plasma induced dissociation of an upstream annealing gas comprising an upstream molecular composition comprising nitrogen, and wherein said upstream plasma induced dissociation comprises using plasma generated via the coupling of radio frequency (RF) power to the upstream annealing gas, such that the nitrogen radicals flow across the surface in a laminar manner.
• RF radio frequency
• the annealing may be suitably carried out at a pressure of about 1 mTorr to about
• 20,000 mTorr which includes 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 20, 30, 40, 50, 60, 70, 80, 90, 100, 250,
• the annealing may be suitably carried out at a substrate temperature of about 20° C to about 1200° C, which includes 20, 30, 40, 50, 60, 70, 80, 90, 100, 200, 300, 400, 500, 550, 600,
• the annealing may be carried out is carried out for a time of about 1 second to about 25 min, which range includes 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 15, 20, 25, 30, 35, 40, 50, 60 (seconds), 2, 3,
• the annealing may be carried out under N 2 at an N 2 flow rate of about 2 seem to about
• 20 slm which includes 0, 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 20, 30, 35, 40, 45, 50, 55, 60, 65, 70, 75, 80,
• the annealing may also be carried out in the presence of other gases, for example, H2,
• Ar He, Ne, Xe, or Kr, or any combination thereof.
• the flow rate of these other gases may be about
• the annealing may be carried out using plasma remotely generated via the coupling of radio frequency (RF) power having a frequency of about 40 kHz to about 4 MHz with the upstream annealing gas, which includes 40, 50, 60, 70, 80, 90, 100, 200, 300, 400, 500, 600, 700, 800, 900, or 1000 (kHz), 1.5, 2, 3, or 4 (MHz), or any combination thereof.
• RF radio frequency
• An electronic or semiconductor device may be formed using the method herein, followed by forming at least one selected from the group consisting of poly-silicon, amorphous- silicon, and SiGe, or any combination thereof, on the high-k dielectric film.
• Other suitable systems and methods are described in the following references, the entire contents of each of which are independently incorporated by reference: JP 2001-012917, filed January 22, 2001;

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