WO2005079130A1 - 黒化処理面又は層を有する銅箔 - Google Patents
黒化処理面又は層を有する銅箔 Download PDFInfo
- Publication number
- WO2005079130A1 WO2005079130A1 PCT/JP2005/000884 JP2005000884W WO2005079130A1 WO 2005079130 A1 WO2005079130 A1 WO 2005079130A1 JP 2005000884 W JP2005000884 W JP 2005000884W WO 2005079130 A1 WO2005079130 A1 WO 2005079130A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- copper foil
- layer
- blackened
- plating
- black
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/0054—Casings specially adapted for display applications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0094—Shielding materials being light-transmitting, e.g. transparent, translucent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12431—Foil or filament smaller than 6 mils
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12431—Foil or filament smaller than 6 mils
- Y10T428/12438—Composite
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12903—Cu-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12903—Cu-base component
- Y10T428/1291—Next to Co-, Cu-, or Ni-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12931—Co-, Fe-, or Ni-base components, alternative to each other
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12944—Ni-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12993—Surface feature [e.g., rough, mirror]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
- Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
- Y10T428/264—Up to 3 mils
- Y10T428/265—1 mil or less
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/27—Web or sheet containing structurally defined element or component, the element or component having a specified weight per unit area [e.g., gms/sq cm, lbs/sq ft, etc.]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Electroplating Methods And Accessories (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/597,460 US7341796B2 (en) | 2004-02-17 | 2005-01-25 | Copper foil having blackened surface or layer |
JP2005517916A JP4354955B2 (ja) | 2004-02-17 | 2005-01-25 | 黒化処理面又は層を有する銅箔 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004039179 | 2004-02-17 | ||
JP2004-039179 | 2004-02-17 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2005079130A1 true WO2005079130A1 (ja) | 2005-08-25 |
Family
ID=34857839
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2005/000884 WO2005079130A1 (ja) | 2004-02-17 | 2005-01-25 | 黒化処理面又は層を有する銅箔 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7341796B2 (ja) |
JP (1) | JP4354955B2 (ja) |
KR (1) | KR100852863B1 (ja) |
CN (1) | CN100515167C (ja) |
TW (1) | TWI246398B (ja) |
WO (1) | WO2005079130A1 (ja) |
Cited By (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006103189A (ja) * | 2004-10-06 | 2006-04-20 | Furukawa Circuit Foil Kk | 表面処理銅箔並びに回路基板 |
JP2007142080A (ja) * | 2005-11-17 | 2007-06-07 | Bridgestone Corp | 電磁波シールド性光透過窓材の製造方法及び電磁波シールド性光透過窓材 |
JP2007311701A (ja) * | 2006-05-22 | 2007-11-29 | Hitachi Chem Co Ltd | 電磁波シールドフィルム |
JP2008013847A (ja) * | 2006-06-07 | 2008-01-24 | Furukawa Circuit Foil Kk | 表面処理電解銅箔及びその製造方法、並びに回路基板 |
JP2008021964A (ja) * | 2006-03-28 | 2008-01-31 | Fujifilm Corp | 導電膜及びその製造方法、並びに透光性電磁波シールド膜 |
KR100849958B1 (ko) * | 2006-12-12 | 2008-08-01 | 키스타 주식회사 | 금속 질감의 흑색 착색방법 |
KR100852515B1 (ko) * | 2007-04-06 | 2008-08-18 | 주식회사 엘지화학 | 디스플레이 장치의 필터 |
JP2009149928A (ja) * | 2007-12-19 | 2009-07-09 | Hitachi Cable Ltd | 印刷回路用銅箔 |
JP2010226012A (ja) * | 2009-03-25 | 2010-10-07 | Dainippon Printing Co Ltd | 電磁波遮蔽フィルタ |
KR20110006626A (ko) | 2009-07-14 | 2011-01-20 | 아지노모토 가부시키가이샤 | 동박이 부착된 접착 필름 |
JP2011044550A (ja) * | 2009-08-20 | 2011-03-03 | Hitachi Cable Ltd | プリント配線板用銅箔およびその製造方法 |
US8034542B2 (en) | 2006-03-28 | 2011-10-11 | Fujifilm Corporation | Conductive film and manufacturing method thereof, and transparent electromagnetic shielding film |
JP2014019914A (ja) * | 2012-07-19 | 2014-02-03 | Fukuda Metal Foil & Powder Co Ltd | 高放射率金属箔 |
WO2014109396A1 (ja) * | 2013-01-11 | 2014-07-17 | Jx日鉱日石金属株式会社 | 表面処理銅箔、積層板、キャリア付銅箔、プリント配線板、プリント回路板、電子機器、及びプリント配線板の製造方法 |
KR101423762B1 (ko) | 2006-06-07 | 2014-07-25 | 후루카와 덴키 고교 가부시키가이샤 | 표면 처리 전해 동박 및 그 제조 방법, 및 회로 기판 |
JP2014152396A (ja) * | 2013-02-06 | 2014-08-25 | Nan Ya Plastic Corp | 複合式両面黒色銅箔及びその製造方法 |
CN104349582A (zh) * | 2013-07-30 | 2015-02-11 | 古河电气工业株式会社 | 线路板用铜箔及线路板 |
JPWO2013129508A1 (ja) * | 2012-03-01 | 2015-07-30 | 三井金属鉱業株式会社 | キャリア箔付銅箔、キャリア箔付銅箔の製造方法及びそのキャリア箔付銅箔を用いて得られるレーザー孔明け加工用の銅張積層板 |
JP2016029215A (ja) * | 2013-08-29 | 2016-03-03 | Jx金属株式会社 | 表面処理金属材、キャリア付金属箔、コネクタ、端子、積層体、シールドテープ、シールド材、プリント配線板、金属加工部材、電子機器、及び、プリント配線板の製造方法 |
JP2018090906A (ja) * | 2016-12-06 | 2018-06-14 | Jx金属株式会社 | 表面処理銅箔、キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法 |
WO2018193940A1 (ja) * | 2017-04-17 | 2018-10-25 | 住友金属鉱山株式会社 | 導電性基板 |
JP2018172782A (ja) * | 2017-03-31 | 2018-11-08 | Jx金属株式会社 | 表面処理銅箔、樹脂層付き表面処理銅箔、キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法 |
JP2018172785A (ja) * | 2017-03-31 | 2018-11-08 | Jx金属株式会社 | 表面処理銅箔、樹脂層付き表面処理銅箔、キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法 |
WO2019151421A1 (ja) * | 2018-01-31 | 2019-08-08 | 東洋鋼鈑株式会社 | 電磁波シールド用めっき積層体、電磁波シールド材および電磁波シールド材の製造方法 |
Families Citing this family (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070209547A1 (en) * | 2004-08-10 | 2007-09-13 | Nippon Mining & Metals Co., Ltd. | Barrier Film For Flexible Copper Substrate And Sputtering Target For Forming Barrier Film |
WO2006137240A1 (ja) * | 2005-06-23 | 2006-12-28 | Nippon Mining & Metals Co., Ltd. | プリント配線板用銅箔 |
JP4904933B2 (ja) * | 2005-09-27 | 2012-03-28 | 日立電線株式会社 | ニッケルめっき液とその製造方法、ニッケルめっき方法およびプリント配線板用銅箔 |
WO2007145164A1 (ja) * | 2006-06-12 | 2007-12-21 | Nippon Mining & Metals Co., Ltd. | 粗化処理面を備えた圧延銅又は銅合金箔及び圧延銅又は銅合金箔の粗化方法 |
KR20090080978A (ko) * | 2006-11-29 | 2009-07-27 | 닛코 킨조쿠 가부시키가이샤 | 2 층 구리 피복 적층판 |
KR20120034750A (ko) * | 2007-03-20 | 2012-04-12 | 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 | 무접착제 플렉시블 라미네이트 및 그 제조 방법 |
KR20080087238A (ko) * | 2007-03-26 | 2008-10-01 | 엘지전자 주식회사 | 플라즈마 디스플레이 패널의 콘트라스트 향상 광학 시트 및그 제작 방법 |
CN101669237A (zh) * | 2007-04-20 | 2010-03-10 | 日矿金属株式会社 | 锂二次电池用电解铜箔及该铜箔的制造方法 |
US8642893B2 (en) * | 2007-09-28 | 2014-02-04 | Jx Nippon Mining & Metals Corporation | Copper foil for printed circuit and copper-clad laminate |
WO2009050970A1 (ja) | 2007-10-18 | 2009-04-23 | Nippon Mining & Metals Co., Ltd. | 金属被覆ポリイミド複合体、同複合体の製造方法及び同複合体の製造装置 |
US8568899B2 (en) * | 2007-10-18 | 2013-10-29 | Jx Nippon Mining & Metals Corporation | Metal covered polyimide composite, process for producing the composite, and process for producing electronic circuit board |
TW200934330A (en) * | 2007-11-26 | 2009-08-01 | Furukawa Electric Co Ltd | Surface treated copper foil and method for surface treating the same, and stack circuit board |
KR101199816B1 (ko) * | 2007-12-27 | 2012-11-12 | 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 | 2 층 동장 적층판의 제조 방법 및 2 층 동장 적층판 |
KR20130012592A (ko) * | 2008-02-04 | 2013-02-04 | 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 | 무접착제 플렉시블 라미네이트 |
KR101289803B1 (ko) * | 2008-05-16 | 2013-07-26 | 삼성테크윈 주식회사 | 회로 기판 및 그 제조 방법 |
US8142905B2 (en) * | 2008-06-17 | 2012-03-27 | Jx Nippon Mining & Metals Corporation | Copper foil for printed circuit board and copper clad laminate for printed circuit board |
EP2366469A1 (en) * | 2008-11-25 | 2011-09-21 | JX Nippon Mining & Metals Corporation | Method of winding up copper foil or copper-clad laminate |
KR101288641B1 (ko) * | 2008-11-25 | 2013-07-22 | 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 | 인쇄 회로용 동박 |
JP2009143234A (ja) | 2008-12-24 | 2009-07-02 | Nippon Mining & Metals Co Ltd | キャリア付金属箔 |
EP2371535A4 (en) | 2008-12-26 | 2012-05-09 | Jx Nippon Mining & Metals Corp | FLEXIBLE COATING AND A FLEXIBLE SUBSTRATE FOR ELECTRONIC CIRCUITS SHAPED WITH THEIR HELP |
WO2012043182A1 (ja) | 2010-09-27 | 2012-04-05 | Jx日鉱日石金属株式会社 | プリント配線板用銅箔、その製造方法、プリント配線板用樹脂基板及びプリント配線板 |
JP5475897B1 (ja) * | 2012-05-11 | 2014-04-16 | Jx日鉱日石金属株式会社 | 表面処理銅箔及びそれを用いた積層板、銅箔、プリント配線板、電子機器、並びに、プリント配線板の製造方法 |
JP5417538B1 (ja) * | 2012-06-11 | 2014-02-19 | Jx日鉱日石金属株式会社 | 表面処理銅箔及びそれを用いた積層板、プリント配線板、電子機器、並びに、プリント配線板の製造方法 |
JP5481577B1 (ja) * | 2012-09-11 | 2014-04-23 | Jx日鉱日石金属株式会社 | キャリア付き銅箔 |
KR102015838B1 (ko) * | 2012-11-20 | 2019-08-29 | 제이엑스금속주식회사 | 캐리어 부착 동박 |
CN105008593B (zh) * | 2013-02-28 | 2018-08-24 | 三井金属矿业株式会社 | 黑化表面处理铜箔、黑化表面处理铜箔的制造方法、覆铜层压板及柔性印刷线路板 |
CN105189829B (zh) * | 2013-06-13 | 2018-06-01 | Jx日矿日石金属株式会社 | 附载体的铜箔、覆铜积层板、印刷电路板、电子机器、及印刷电路板的制造方法 |
MY168616A (en) * | 2013-07-23 | 2018-11-14 | Jx Nippon Mining & Metals Corp | Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper clad laminate and method for producing printed wiring board |
MY182166A (en) * | 2013-09-20 | 2021-01-18 | Namics Corp | Copper foil, copper foil with carrier foil, and copper-clad laminate |
JP6393126B2 (ja) * | 2013-10-04 | 2018-09-19 | Jx金属株式会社 | 表面処理圧延銅箔、積層板、プリント配線板、電子機器及びプリント配線板の製造方法 |
WO2017130865A1 (ja) * | 2016-01-29 | 2017-08-03 | 住友金属鉱山株式会社 | 黒化めっき液、導電性基板の製造方法 |
CN108603302A (zh) * | 2016-01-29 | 2018-09-28 | 住友金属矿山株式会社 | 黑化镀液、导电性基板的制造方法 |
CN108400338B (zh) * | 2017-02-03 | 2021-11-30 | Jx金属株式会社 | 表面处理铜箔以及使用其的集电体、电极及电池 |
CN108754552B (zh) * | 2018-05-04 | 2020-06-16 | 瑞声光学解决方案私人有限公司 | 压延铜遮光圈片制备方法及压延铜遮光圈片 |
JP7352939B2 (ja) * | 2019-05-09 | 2023-09-29 | ナミックス株式会社 | 複合銅部材 |
CN110344105B (zh) * | 2019-08-05 | 2020-10-09 | 中色奥博特铜铝业有限公司 | 一种压延铜箔的双面表面处理方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002341783A (ja) * | 2001-05-18 | 2002-11-29 | Shuho:Kk | 電子画像表示装置におけるディスプレーフィルタ |
JP2003201597A (ja) * | 2002-01-09 | 2003-07-18 | Nippon Denkai Kk | 銅箔とその製造方法及び該銅箔を用いた電磁波シールド体 |
JP2003218583A (ja) * | 2002-01-22 | 2003-07-31 | Nitto Denko Corp | 透光性電磁波シールド部材の製造方法 |
JP2003318596A (ja) * | 2002-02-21 | 2003-11-07 | Dainippon Printing Co Ltd | 電磁波遮蔽用シート |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3289684B2 (ja) * | 1998-09-11 | 2002-06-10 | 日本電気株式会社 | プラズマディスプレイパネル、プラズマディスプレイモジュール及びその駆動方法 |
JP3258308B2 (ja) * | 2000-02-03 | 2002-02-18 | 株式会社日鉱マテリアルズ | レーザー穴開け性に優れた銅箔及びその製造方法 |
US20020182432A1 (en) * | 2000-04-05 | 2002-12-05 | Masaru Sakamoto | Laser hole drilling copper foil |
JP3628585B2 (ja) * | 2000-04-05 | 2005-03-16 | 株式会社日鉱マテリアルズ | 銅張り積層板及び銅張り積層板のレーザーによる穴開け方法 |
JP4006618B2 (ja) * | 2001-09-26 | 2007-11-14 | 日鉱金属株式会社 | キャリア付銅箔の製法及びキャリア付銅箔を使用したプリント基板 |
TW583688B (en) * | 2002-02-21 | 2004-04-11 | Dainippon Printing Co Ltd | Electromagnetic shielding sheet and method of producing the same |
KR101065758B1 (ko) * | 2003-02-27 | 2011-09-19 | 후루카와 덴키 고교 가부시키가이샤 | 전자파 실드용 동박, 그 제조방법 및 전자파 실드체 |
-
2005
- 2005-01-25 CN CNB2005800050917A patent/CN100515167C/zh active Active
- 2005-01-25 US US10/597,460 patent/US7341796B2/en active Active
- 2005-01-25 JP JP2005517916A patent/JP4354955B2/ja not_active Expired - Fee Related
- 2005-01-25 KR KR1020067017302A patent/KR100852863B1/ko active IP Right Grant
- 2005-01-25 WO PCT/JP2005/000884 patent/WO2005079130A1/ja active Application Filing
- 2005-01-31 TW TW094102889A patent/TWI246398B/zh active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002341783A (ja) * | 2001-05-18 | 2002-11-29 | Shuho:Kk | 電子画像表示装置におけるディスプレーフィルタ |
JP2003201597A (ja) * | 2002-01-09 | 2003-07-18 | Nippon Denkai Kk | 銅箔とその製造方法及び該銅箔を用いた電磁波シールド体 |
JP2003218583A (ja) * | 2002-01-22 | 2003-07-31 | Nitto Denko Corp | 透光性電磁波シールド部材の製造方法 |
JP2003318596A (ja) * | 2002-02-21 | 2003-11-07 | Dainippon Printing Co Ltd | 電磁波遮蔽用シート |
Cited By (37)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006103189A (ja) * | 2004-10-06 | 2006-04-20 | Furukawa Circuit Foil Kk | 表面処理銅箔並びに回路基板 |
JP2007142080A (ja) * | 2005-11-17 | 2007-06-07 | Bridgestone Corp | 電磁波シールド性光透過窓材の製造方法及び電磁波シールド性光透過窓材 |
JP2008021964A (ja) * | 2006-03-28 | 2008-01-31 | Fujifilm Corp | 導電膜及びその製造方法、並びに透光性電磁波シールド膜 |
US8034542B2 (en) | 2006-03-28 | 2011-10-11 | Fujifilm Corporation | Conductive film and manufacturing method thereof, and transparent electromagnetic shielding film |
JP2007311701A (ja) * | 2006-05-22 | 2007-11-29 | Hitachi Chem Co Ltd | 電磁波シールドフィルム |
JP2008013847A (ja) * | 2006-06-07 | 2008-01-24 | Furukawa Circuit Foil Kk | 表面処理電解銅箔及びその製造方法、並びに回路基板 |
JP4712759B2 (ja) * | 2006-06-07 | 2011-06-29 | 古河電気工業株式会社 | 表面処理電解銅箔及びその製造方法、並びに回路基板 |
KR101423762B1 (ko) | 2006-06-07 | 2014-07-25 | 후루카와 덴키 고교 가부시키가이샤 | 표면 처리 전해 동박 및 그 제조 방법, 및 회로 기판 |
KR100849958B1 (ko) * | 2006-12-12 | 2008-08-01 | 키스타 주식회사 | 금속 질감의 흑색 착색방법 |
KR100852515B1 (ko) * | 2007-04-06 | 2008-08-18 | 주식회사 엘지화학 | 디스플레이 장치의 필터 |
WO2008123723A1 (en) * | 2007-04-06 | 2008-10-16 | Lg Chem, Ltd. | Filter of display device |
JP2009149928A (ja) * | 2007-12-19 | 2009-07-09 | Hitachi Cable Ltd | 印刷回路用銅箔 |
JP2010226012A (ja) * | 2009-03-25 | 2010-10-07 | Dainippon Printing Co Ltd | 電磁波遮蔽フィルタ |
KR20110006626A (ko) | 2009-07-14 | 2011-01-20 | 아지노모토 가부시키가이샤 | 동박이 부착된 접착 필름 |
JP2011044550A (ja) * | 2009-08-20 | 2011-03-03 | Hitachi Cable Ltd | プリント配線板用銅箔およびその製造方法 |
JP2017136862A (ja) * | 2012-03-01 | 2017-08-10 | 三井金属鉱業株式会社 | レーザー孔明け加工用の銅張積層板の製造方法 |
US10212814B2 (en) | 2012-03-01 | 2019-02-19 | Mitsui Mining & Smelting Co., Ltd. | Copper foil provided with carrier foil, manufacturing method of the copper foil provided with carrier foil, and copper clad laminate for laser drilling manufactured by using the copper foil provided with carrier foil |
JP2017160540A (ja) * | 2012-03-01 | 2017-09-14 | 三井金属鉱業株式会社 | キャリア箔付銅箔、キャリア箔付銅箔の製造方法及びそのキャリア箔付銅箔を用いて得られるレーザー孔明け加工用の銅張積層板 |
JPWO2013129508A1 (ja) * | 2012-03-01 | 2015-07-30 | 三井金属鉱業株式会社 | キャリア箔付銅箔、キャリア箔付銅箔の製造方法及びそのキャリア箔付銅箔を用いて得られるレーザー孔明け加工用の銅張積層板 |
JP2014019914A (ja) * | 2012-07-19 | 2014-02-03 | Fukuda Metal Foil & Powder Co Ltd | 高放射率金属箔 |
WO2014109396A1 (ja) * | 2013-01-11 | 2014-07-17 | Jx日鉱日石金属株式会社 | 表面処理銅箔、積層板、キャリア付銅箔、プリント配線板、プリント回路板、電子機器、及びプリント配線板の製造方法 |
JP2014133936A (ja) * | 2013-01-11 | 2014-07-24 | Jx Nippon Mining & Metals Corp | 表面処理銅箔、積層板、プリント配線板及びプリント回路板 |
JP2014152396A (ja) * | 2013-02-06 | 2014-08-25 | Nan Ya Plastic Corp | 複合式両面黒色銅箔及びその製造方法 |
JP5706026B1 (ja) * | 2013-07-30 | 2015-04-22 | 古河電気工業株式会社 | 配線板用銅箔及び配線板 |
CN104349582B (zh) * | 2013-07-30 | 2018-11-13 | 古河电气工业株式会社 | 线路板用铜箔及线路板 |
CN104349582A (zh) * | 2013-07-30 | 2015-02-11 | 古河电气工业株式会社 | 线路板用铜箔及线路板 |
JP2016029215A (ja) * | 2013-08-29 | 2016-03-03 | Jx金属株式会社 | 表面処理金属材、キャリア付金属箔、コネクタ、端子、積層体、シールドテープ、シールド材、プリント配線板、金属加工部材、電子機器、及び、プリント配線板の製造方法 |
JP2018090906A (ja) * | 2016-12-06 | 2018-06-14 | Jx金属株式会社 | 表面処理銅箔、キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法 |
JP7356209B2 (ja) | 2017-03-31 | 2023-10-04 | Jx金属株式会社 | 表面処理銅箔、樹脂層付き表面処理銅箔、キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法 |
JP2018172782A (ja) * | 2017-03-31 | 2018-11-08 | Jx金属株式会社 | 表面処理銅箔、樹脂層付き表面処理銅箔、キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法 |
JP2018172785A (ja) * | 2017-03-31 | 2018-11-08 | Jx金属株式会社 | 表面処理銅箔、樹脂層付き表面処理銅箔、キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法 |
WO2018193940A1 (ja) * | 2017-04-17 | 2018-10-25 | 住友金属鉱山株式会社 | 導電性基板 |
JPWO2018193940A1 (ja) * | 2017-04-17 | 2020-02-27 | 住友金属鉱山株式会社 | 導電性基板 |
JP7031663B2 (ja) | 2017-04-17 | 2022-03-08 | 住友金属鉱山株式会社 | 導電性基板 |
JPWO2019151421A1 (ja) * | 2018-01-31 | 2021-02-12 | 東洋鋼鈑株式会社 | 電磁波シールド用めっき積層体、電磁波シールド材および電磁波シールド材の製造方法 |
JP7148555B2 (ja) | 2018-01-31 | 2022-10-05 | 東洋鋼鈑株式会社 | 電磁波シールド材および電磁波シールド材の製造方法 |
WO2019151421A1 (ja) * | 2018-01-31 | 2019-08-08 | 東洋鋼鈑株式会社 | 電磁波シールド用めっき積層体、電磁波シールド材および電磁波シールド材の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
US7341796B2 (en) | 2008-03-11 |
TW200529738A (en) | 2005-09-01 |
KR20070003880A (ko) | 2007-01-05 |
JP4354955B2 (ja) | 2009-10-28 |
JPWO2005079130A1 (ja) | 2008-02-21 |
TWI246398B (en) | 2005-12-21 |
CN1922947A (zh) | 2007-02-28 |
US20070141377A1 (en) | 2007-06-21 |
KR100852863B1 (ko) | 2008-08-18 |
CN100515167C (zh) | 2009-07-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2005079130A1 (ja) | 黒化処理面又は層を有する銅箔 | |
CN111971421B (zh) | 表面处理铜箔、覆铜积层板及印刷配线板 | |
JP4681936B2 (ja) | プラズマディスプレイ電磁波シールドフィルター用銅箔 | |
TWI632054B (zh) | 高頻電路用銅箔、高頻電路用覆銅積層板、高頻電路用印刷配線板、高頻電路用附載體銅箔、電子機器、及印刷配線板之製造方法 | |
KR20140063409A (ko) | 흑화된 초박형 포일을 갖는 구리 포일 구조체 및 그 제조 방법 | |
JP5868890B2 (ja) | 複合式両面黒色銅箔及びその製造方法 | |
JP2007332418A (ja) | 表面処理銅箔 | |
JP2008227352A (ja) | 電磁波遮蔽シート、その製造方法、及びプラズマディスプレイパネル用フィルター | |
TW200529245A (en) | Electromagnetic shielding material and method for producing the same | |
JP4573254B2 (ja) | プラズマディスプレーパネル用銅箔及びその製造方法 | |
JP2008166655A (ja) | 電磁波シールド材用銅箔 | |
KR100560672B1 (ko) | 표면 처리 동박 및 그 제조 방법 | |
KR100738164B1 (ko) | 갈색화 표면처리 동박 및 그 제조방법 및 이 갈색화표면처리 동박을 이용한 플라즈마 디스플레이의 전면패널용 전자파 차폐 도전성 메쉬 | |
JP2004241761A (ja) | 電磁波遮蔽用シート、及びその製造方法 | |
JP4867261B2 (ja) | 電磁波遮蔽シート | |
JP2007227532A (ja) | 電磁波遮蔽シート | |
JP4867263B2 (ja) | 電磁波遮蔽シート | |
CN116970934B (zh) | 一种电解铜箔双面黑化表面处理工艺 | |
KR20050022441A (ko) | 표면 처리 동박 | |
JP2023069796A (ja) | 表面処理銅箔 | |
JP2004253587A (ja) | 透明電磁波シールド用複合材及びその製造方法 | |
JP2004253588A (ja) | 複合材及びその製造方法 | |
JP2005290541A (ja) | 電磁波遮蔽用黒化表面処理銅箔の製造方法 | |
JP2005079596A (ja) | 電磁波遮蔽用シールド材 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 200580005091.7 Country of ref document: CN |
|
AK | Designated states |
Kind code of ref document: A1 Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW |
|
AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LT LU MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG |
|
DPEN | Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed from 20040101) | ||
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
DPEN | Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed from 20040101) | ||
WWE | Wipo information: entry into national phase |
Ref document number: 2005517916 Country of ref document: JP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2007141377 Country of ref document: US Ref document number: 10597460 Country of ref document: US |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
WWW | Wipo information: withdrawn in national office |
Ref document number: DE |
|
WWE | Wipo information: entry into national phase |
Ref document number: 1020067017302 Country of ref document: KR |
|
122 | Ep: pct application non-entry in european phase | ||
WWP | Wipo information: published in national office |
Ref document number: 10597460 Country of ref document: US |