KR100852863B1 - 흑화 처리 면 또는 층을 가지는 동박 - Google Patents
흑화 처리 면 또는 층을 가지는 동박 Download PDFInfo
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- KR100852863B1 KR100852863B1 KR1020067017302A KR20067017302A KR100852863B1 KR 100852863 B1 KR100852863 B1 KR 100852863B1 KR 1020067017302 A KR1020067017302 A KR 1020067017302A KR 20067017302 A KR20067017302 A KR 20067017302A KR 100852863 B1 KR100852863 B1 KR 100852863B1
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- copper foil
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/0054—Casings specially adapted for display applications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0094—Shielding materials being light-transmitting, e.g. transparent, translucent
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12431—Foil or filament smaller than 6 mils
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12431—Foil or filament smaller than 6 mils
- Y10T428/12438—Composite
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12903—Cu-base component
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12903—Cu-base component
- Y10T428/1291—Next to Co-, Cu-, or Ni-base component
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12931—Co-, Fe-, or Ni-base components, alternative to each other
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12944—Ni-base component
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12993—Surface feature [e.g., rough, mirror]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
- Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
- Y10T428/264—Up to 3 mils
- Y10T428/265—1 mil or less
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/27—Web or sheet containing structurally defined element or component, the element or component having a specified weight per unit area [e.g., gms/sq cm, lbs/sq ft, etc.]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Laminated Bodies (AREA)
- Electroplating Methods And Accessories (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
Description
Claims (19)
- 동박의 편면(片面) 또는 양면이 전기도금에 의하여 흑색으로 되는 처리가 시행된 것으로서, 흑; ΔL*= -100, 백; ΔL*= 0, 으로 나타내는 색차계(色差計)로 측정된 흑색으로 처리된 면의 색차 ΔL*≤-70이며, 채도 C*≤15이고, 또한 동박의 편면 혹은 양면이 흑색으로 되는 처리 면의 조화입자가 1㎛ 이하로서, 이 면의 표면조도(表面粗度)Ra가 0.5㎛이하, Rt가 4.0㎛ 이하, Rz가 3.5㎛ 이하 인 것을 특징으로 하는 흑화처리 면 또는 층을 가지는 동박.
- 제1항에 있어서, 동박의 편면(片面) 또는 양면이 흑색으로 되는 처리가 시행된 것이며, 흑색으로 처리된 면의 광택도 ≤15인 것을 특징으로 하는 흑화처리 면 또는 층을 가지는 동박.
- 삭제
- 제1항에 있어서, 전기 도금에 의해 Co, Ni-Cu, Co-Cu, Ni-Co-Cu의 적어도 1종 이상을 피복한 흑색처리 면인 것을 특징으로 하는 흑화처리 면 또는 층을 가지는 동박.
- 제4항에 있어서, Ni-Cu 도금 처리의 Ni의 부착량이 200~1000mg/㎡이거나, 또는 이 Ni-Cu 도금 처리 후에 Ni 또는 Ni-Co도금 처리한 도금 면의 Ni+Co 부착량이 250~1500mg/㎡인 것을 특징으로 하는 흑화처리 면 또는 층을 가지는 동박.
- 제4항에 있어서, Ni-Co-Cu 도금 처리의 Ni+Co의 부착량이 130~1000mg/㎡이거나, 또는 이 Ni-Co-Cu 처리 후에 Ni 또는 Ni-Co 도금 처리한 도금 면의 Ni+Co 부착량이 250~1500mg/㎡인 것을 특징으로 하는 흑화처리 면 또는 층을 가지는 동박.
- 제4항에 있어서, Co-Cu 도금 처리의 Co부착량이 300~1000mg/㎡이거나, 또는 Co-Cu 도금 처리 후에 Ni 또는 Ni-Co 도금 처리한 도금 면의 Ni+Co 부착량이 350~1500mg/㎡인 것을 특징으로 하는 흑화처리 면 또는 층을 가지는 동박.
- 제4항에 있어서, Co 도금 처리의 Co부착량이 1000~5000mg/㎡이거나, 또는 Co 도금 처리 후에 Ni 또는 Ni-Co 도금 처리한 도금 면의 Ni+Co 부착량이 1050~2000mg/㎡인 것을 특징으로 하는 흑화처리 면 또는 층을 가지는 동박.
- 제1항, 제2항, 제4항 내지 8항 중 어느 한 항에 있어서, 동박이 8~18㎛의 전해(電解)동박 또는 압연 동박인 것을 특징으로 하는 흑화처리 면 또는 층을 가지는 동박.
- 제1항, 제2항, 제4항 내지 제8항 중 어느 한 항에 있어서, 흑색으로 되는 처리한 층의 위에 방청 처리 층을 구비하고 있는 것을 특징으로 하는 흑화처리 면 또는 층을 가지는 동박.
- 제9항에 있어서, 흑색으로 되는 처리한 층의 위에 방청 처리 층을 구비하고 있는 것을 특징으로 하는 흑화처리 면 또는 층을 가지는 동박.
- 제10항에 있어서, 방청 처리 층이 Cr, Zn, Zn-Ni, Zn-Ni-P로부터 선택한 1종 이상인 것을 특징으로 하는 흑화처리 면 또는 층을 가지는 동박.
- 제11항에 있어서, 방청 처리 층이 Cr, Zn, Zn-Ni, Zn-Ni-P로부터 선택한 1종 이상인 것을 특징으로 하는 흑화처리 면 또는 층을 가지는 동박.
- 제1항, 제2항, 제4항 내지 제8항 중 어느 한 항에 있어서, 플라즈마 디스플레이용 동박인 것을 특징으로 하는 흑화처리 면 또는 층을 가지는 동박.
- 제9항에 있어서, 플라즈마 디스플레이용 동박인 것을 특징으로 하는 흑화처리 면 또는 층을 가지는 동박.
- 제10항에 있어서, 플라즈마 디스플레이용 동박인 것을 특징으로 하는 흑화처리 면 또는 층을 가지는 동박.
- 제11항에 있어서, 플라즈마 디스플레이용 동박인 것을 특징으로 하는 흑화처리 면 또는 층을 가지는 동박.
- 제12항에 있어서, 플라즈마 디스플레이용 동박인 것을 특징으로 하는 흑화처리 면 또는 층을 가지는 동박.
- 제13항에 있어서, 플라즈마 디스플레이용 동박인 것을 특징으로 하는 흑화처리 면 또는 층을 가지는 동박.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JPJP-P-2004-00039179 | 2004-02-17 | ||
JP2004039179 | 2004-02-17 |
Publications (2)
Publication Number | Publication Date |
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KR20070003880A KR20070003880A (ko) | 2007-01-05 |
KR100852863B1 true KR100852863B1 (ko) | 2008-08-18 |
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Application Number | Title | Priority Date | Filing Date |
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KR1020067017302A KR100852863B1 (ko) | 2004-02-17 | 2005-01-25 | 흑화 처리 면 또는 층을 가지는 동박 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7341796B2 (ko) |
JP (1) | JP4354955B2 (ko) |
KR (1) | KR100852863B1 (ko) |
CN (1) | CN100515167C (ko) |
TW (1) | TWI246398B (ko) |
WO (1) | WO2005079130A1 (ko) |
Cited By (2)
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KR20160135369A (ko) * | 2013-02-28 | 2016-11-25 | 미쓰이금속광업주식회사 | 흑색화 표면 처리 구리박, 흑색화 표면 처리 구리박의 제조 방법, 구리 클래드 적층판 및 플렉시블 프린트 배선판 |
KR101762049B1 (ko) * | 2013-06-13 | 2017-07-26 | 제이엑스금속주식회사 | 캐리어 부착 구리박, 구리 피복 적층판, 프린트 배선판, 전자 기기, 및, 프린트 배선판의 제조 방법 |
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JP2006103189A (ja) * | 2004-10-06 | 2006-04-20 | Furukawa Circuit Foil Kk | 表面処理銅箔並びに回路基板 |
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KR100852515B1 (ko) * | 2007-04-06 | 2008-08-18 | 주식회사 엘지화학 | 디스플레이 장치의 필터 |
WO2008132987A1 (ja) * | 2007-04-20 | 2008-11-06 | Nippon Mining & Metals Co., Ltd. | リチウム二次電池用電解銅箔及び該銅箔の製造方法 |
EP2216427B1 (en) * | 2007-09-28 | 2013-01-23 | JX Nippon Mining & Metals Corporation | Copper foil for printed circuit and copper clad laminate |
KR101199817B1 (ko) * | 2007-10-18 | 2012-11-09 | 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 | 금속 피복 폴리이미드 복합체, 그 복합체의 제조 방법 및 그 복합체의 제조 장치 |
CN101827958A (zh) * | 2007-10-18 | 2010-09-08 | 日矿金属株式会社 | 金属包覆的聚酰亚胺复合体、该复合体的制造方法以及电子电路板的制造方法 |
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JPWO2005079130A1 (ja) | 2008-02-21 |
US20070141377A1 (en) | 2007-06-21 |
CN100515167C (zh) | 2009-07-15 |
JP4354955B2 (ja) | 2009-10-28 |
CN1922947A (zh) | 2007-02-28 |
KR20070003880A (ko) | 2007-01-05 |
TWI246398B (en) | 2005-12-21 |
WO2005079130A1 (ja) | 2005-08-25 |
US7341796B2 (en) | 2008-03-11 |
TW200529738A (en) | 2005-09-01 |
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