JP7031663B2 - 導電性基板 - Google Patents
導電性基板 Download PDFInfo
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- JP7031663B2 JP7031663B2 JP2019513580A JP2019513580A JP7031663B2 JP 7031663 B2 JP7031663 B2 JP 7031663B2 JP 2019513580 A JP2019513580 A JP 2019513580A JP 2019513580 A JP2019513580 A JP 2019513580A JP 7031663 B2 JP7031663 B2 JP 7031663B2
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- 239000000758 substrate Substances 0.000 title claims description 208
- 229910052751 metal Inorganic materials 0.000 claims description 246
- 239000002184 metal Substances 0.000 claims description 246
- 238000007747 plating Methods 0.000 claims description 102
- 239000013078 crystal Substances 0.000 claims description 90
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 78
- 239000000463 material Substances 0.000 claims description 71
- 239000010949 copper Substances 0.000 claims description 69
- 229910052802 copper Inorganic materials 0.000 claims description 66
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 64
- 229910052759 nickel Inorganic materials 0.000 claims description 32
- 229910000480 nickel oxide Inorganic materials 0.000 claims description 21
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 claims description 21
- 239000000126 substance Substances 0.000 claims description 21
- BFDHFSHZJLFAMC-UHFFFAOYSA-L nickel(ii) hydroxide Chemical compound [OH-].[OH-].[Ni+2] BFDHFSHZJLFAMC-UHFFFAOYSA-L 0.000 claims description 17
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 6
- 239000010410 layer Substances 0.000 description 565
- 238000000034 method Methods 0.000 description 79
- 238000005530 etching Methods 0.000 description 76
- 239000000243 solution Substances 0.000 description 73
- 239000002585 base Substances 0.000 description 58
- 239000010408 film Substances 0.000 description 31
- 239000010409 thin film Substances 0.000 description 30
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 18
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 17
- 238000004519 manufacturing process Methods 0.000 description 17
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 12
- 230000009257 reactivity Effects 0.000 description 12
- 238000000059 patterning Methods 0.000 description 11
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 10
- 229910001431 copper ion Inorganic materials 0.000 description 10
- 238000009713 electroplating Methods 0.000 description 10
- 229910001453 nickel ion Inorganic materials 0.000 description 10
- 238000004544 sputter deposition Methods 0.000 description 10
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 9
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 8
- 125000004429 atom Chemical group 0.000 description 8
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 8
- 229910052799 carbon Inorganic materials 0.000 description 8
- 239000001257 hydrogen Substances 0.000 description 8
- 229910052739 hydrogen Inorganic materials 0.000 description 8
- 229910052757 nitrogen Inorganic materials 0.000 description 8
- 239000001301 oxygen Substances 0.000 description 8
- 229910052760 oxygen Inorganic materials 0.000 description 8
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 7
- 229910045601 alloy Inorganic materials 0.000 description 7
- 239000000956 alloy Substances 0.000 description 7
- 238000010030 laminating Methods 0.000 description 7
- 238000001228 spectrum Methods 0.000 description 7
- 238000002834 transmittance Methods 0.000 description 7
- 239000007789 gas Substances 0.000 description 6
- 239000003002 pH adjusting agent Substances 0.000 description 6
- -1 polyethylene terephthalate Polymers 0.000 description 6
- 229920000139 polyethylene terephthalate Polymers 0.000 description 6
- 239000005020 polyethylene terephthalate Substances 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 238000007740 vapor deposition Methods 0.000 description 6
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 5
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 5
- 238000004458 analytical method Methods 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 5
- 150000002431 hydrogen Chemical class 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 150000003839 salts Chemical class 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- VEQPNABPJHWNSG-UHFFFAOYSA-N Nickel(2+) Chemical compound [Ni+2] VEQPNABPJHWNSG-UHFFFAOYSA-N 0.000 description 4
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 4
- 238000004833 X-ray photoelectron spectroscopy Methods 0.000 description 4
- 239000012790 adhesive layer Substances 0.000 description 4
- 235000013339 cereals Nutrition 0.000 description 4
- 229910052804 chromium Inorganic materials 0.000 description 4
- 239000008139 complexing agent Substances 0.000 description 4
- 239000012212 insulator Substances 0.000 description 4
- 238000007733 ion plating Methods 0.000 description 4
- 229910052742 iron Inorganic materials 0.000 description 4
- 229910052748 manganese Inorganic materials 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 4
- 229910052750 molybdenum Inorganic materials 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 230000001629 suppression Effects 0.000 description 4
- 229910052715 tantalum Inorganic materials 0.000 description 4
- 229910052719 titanium Inorganic materials 0.000 description 4
- 229910052721 tungsten Inorganic materials 0.000 description 4
- 229910052720 vanadium Inorganic materials 0.000 description 4
- WMFOQBRAJBCJND-UHFFFAOYSA-M Lithium hydroxide Chemical compound [Li+].[OH-] WMFOQBRAJBCJND-UHFFFAOYSA-M 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000001556 precipitation Methods 0.000 description 3
- 229910052718 tin Inorganic materials 0.000 description 3
- 229910052725 zinc Inorganic materials 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- JJLJMEJHUUYSSY-UHFFFAOYSA-L Copper hydroxide Chemical compound [OH-].[OH-].[Cu+2] JJLJMEJHUUYSSY-UHFFFAOYSA-L 0.000 description 2
- 239000005750 Copper hydroxide Substances 0.000 description 2
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 2
- 239000005751 Copper oxide Substances 0.000 description 2
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 241000209094 Oryza Species 0.000 description 2
- 235000007164 Oryza sativa Nutrition 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 150000001408 amides Chemical class 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 229910001956 copper hydroxide Inorganic materials 0.000 description 2
- 229910000431 copper oxide Inorganic materials 0.000 description 2
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000008187 granular material Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 229910001092 metal group alloy Inorganic materials 0.000 description 2
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 2
- 229940053662 nickel sulfate Drugs 0.000 description 2
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 2
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 239000011112 polyethylene naphthalate Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000005546 reactive sputtering Methods 0.000 description 2
- 235000009566 rice Nutrition 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 229910000029 sodium carbonate Inorganic materials 0.000 description 2
- 238000000992 sputter etching Methods 0.000 description 2
- IIACRCGMVDHOTQ-UHFFFAOYSA-N sulfamic acid Chemical compound NS(O)(=O)=O IIACRCGMVDHOTQ-UHFFFAOYSA-N 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 1
- 239000005749 Copper compound Substances 0.000 description 1
- 229910017813 Cu—Cr Inorganic materials 0.000 description 1
- 229910017881 Cu—Ni—Fe Inorganic materials 0.000 description 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- 229910018054 Ni-Cu Inorganic materials 0.000 description 1
- 229910018487 Ni—Cr Inorganic materials 0.000 description 1
- 229910018481 Ni—Cu Inorganic materials 0.000 description 1
- 229910018605 Ni—Zn Inorganic materials 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- 229910011212 Ti—Fe Inorganic materials 0.000 description 1
- 229910001080 W alloy Inorganic materials 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 229910002091 carbon monoxide Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 150000001880 copper compounds Chemical class 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- JZCCFEFSEZPSOG-UHFFFAOYSA-L copper(II) sulfate pentahydrate Chemical compound O.O.O.O.O.[Cu+2].[O-]S([O-])(=O)=O JZCCFEFSEZPSOG-UHFFFAOYSA-L 0.000 description 1
- ZQLBQWDYEGOYSW-UHFFFAOYSA-L copper;disulfamate Chemical compound [Cu+2].NS([O-])(=O)=O.NS([O-])(=O)=O ZQLBQWDYEGOYSW-UHFFFAOYSA-L 0.000 description 1
- 229960003280 cupric chloride Drugs 0.000 description 1
- 150000001925 cycloalkenes Chemical class 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- KHYBPSFKEHXSLX-UHFFFAOYSA-N iminotitanium Chemical compound [Ti]=N KHYBPSFKEHXSLX-UHFFFAOYSA-N 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002932 luster Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- RRIWRJBSCGCBID-UHFFFAOYSA-L nickel sulfate hexahydrate Chemical compound O.O.O.O.O.O.[Ni+2].[O-]S([O-])(=O)=O RRIWRJBSCGCBID-UHFFFAOYSA-L 0.000 description 1
- 229940116202 nickel sulfate hexahydrate Drugs 0.000 description 1
- 229910001000 nickel titanium Inorganic materials 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920006289 polycarbonate film Polymers 0.000 description 1
- 229920006290 polyethylene naphthalate film Polymers 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- IIACRCGMVDHOTQ-UHFFFAOYSA-M sulfamate Chemical compound NS([O-])(=O)=O IIACRCGMVDHOTQ-UHFFFAOYSA-M 0.000 description 1
- 238000000870 ultraviolet spectroscopy Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Laminated Bodies (AREA)
- Non-Insulated Conductors (AREA)
Description
透明基材と、
前記透明基材の少なくとも一方の面上に形成された金属層と、
前記金属層上に形成された黒化層とを有し、
前記黒化層は、ニッケルの単体と、ニッケル酸化物と、ニッケル水酸化物と、銅とを含有する粗化めっき層であり、
前記黒化層は、平均結晶粒サイズが50nm以上150nm以下の粒状結晶を含む導電性基板を提供する。
(導電性基板)
本実施形態の導電性基板は、透明基材と、透明基材の少なくとも一方の面上に形成された金属層と、金属層上に形成された黒化層とを有することができる。そして、黒化層は、ニッケルの単体と、ニッケル酸化物と、ニッケル水酸化物と、銅とを含有する粗化めっき層とすることができる。
(導電性基板の製造方法)
次に本実施形態の導電性基板の製造方法の一構成例について説明する。
透明基材の少なくとも一方の面上に金属層を形成する金属層形成工程。
金属層上に黒化層を形成する黒化層形成工程。
(評価方法)
以下の実験例において作製した試料について以下の方法により評価を行った。
(1)黒化層の成分分析
黒化層の成分分析は、X線光電子分光装置(PHI社製、形式:QuantaSXM)により行った。なお、X線源には単色化Al(1486.6eV)を使用した。
(2)反射率測定
測定は、紫外可視分光光度計(株式会社 島津製作所製 型式:UV-2600)に反射率測定ユニットを設置して行った。
(3)エッチング特性
まず、以下の実験例において得られた導電性基板の黒化層表面にドライフィルムレジスト(日立化成RY3310)をラミネート法により貼り付けた。そして、フォトマスクを介して紫外線露光を行い、さらに1%炭酸ナトリウム水溶液によりレジストを溶解して現像した。これにより、3.0μm以上10.0μm以下の範囲で0.5μm毎にレジスト幅が異なるパターンをもつサンプルを作製した。すなわち、レジスト幅が3.0μm、3.5μm、4.0μm・・・9.5μm、10.0μmと、0.5μm毎に異なる15種類の線状のパターンを形成した。
(4)黒化層が含有する結晶の形状、サイズ
黒化層の粗化面となる、透明基材と対向する面とは反対側の面、具体的には図1Aの表面Aについて、走査型電子顕微鏡により観察を行い、黒化層が含有する結晶の形状、サイズについて評価を行った。
(5)サイドエッチング量
まず、以下の実験例において得られた導電性基板の黒化層表面にドライフィルムレジスト(日立化成RY3310)をラミネート法により貼り付けた。そして、フォトマスクを介して紫外線露光を行い、さらに1%炭酸ナトリウム水溶液によりレジストを溶解して現像した。これにより黒化層上に、互いに平行な複数の直線状のパターンのレジストを有するサンプルを作製した。
(試料の作製条件)
以下に説明する条件で導電性基板を作製し、上述の評価方法により評価を行った。実験例1~実験例10のいずれもが実施例となる。
[実験例1]
図1Aに示した構造を有する導電性基板を作製した。
(金属層形成工程)
長さ300m、幅250mm、厚さ100μmの長尺状のポリエチレンテレフタレート樹脂(PET)製の透明基材の一方の面上に金属層として銅層を成膜した。なお、透明基材として用いたポリエチレンテレフタレート樹脂製の透明基材について、全光線透過率をJIS K 7361-1に規定された方法により評価を行ったところ97%であった。
(黒化層形成工程)
黒化層形成工程では、黒化めっき液を用いて電解めっき法により、銅層の一方の面上に黒化層を形成した。
[実験例2~実験例10]
各実験例において、黒化層を形成する際の黒化めっき液中のニッケルイオン濃度、銅イオン濃度、黒化層の成膜時の電流密度、及びめっき時間を表1に示したように変更した点以外は実験例1と同様にして導電性基板を作製し、評価を行った。結果を表1、表2に示す。
11、51 透明基材
12、12A、12B、52 金属層
13、13A、13B、32A、32B、53 黒化層
Claims (6)
- 透明基材と、
前記透明基材の少なくとも一方の面上に形成された金属層と、
前記金属層上に形成された黒化層とを有し、
前記黒化層は、ニッケルの単体と、ニッケル酸化物と、ニッケル水酸化物と、銅とを含有する粗化めっき層であり、
前記黒化層は、平均結晶粒サイズが50nm以上150nm以下の粒状結晶を含む導電性基板。 - 透明基材と、
前記透明基材の少なくとも一方の面上に形成された金属層と、
前記金属層上に形成された黒化層とを有し、
前記黒化層は、ニッケルの単体と、ニッケル酸化物と、ニッケル水酸化物と、銅とを含有する粗化めっき層であり、
前記黒化層は、平均長さが100nm以上300nm以下であり、平均幅が30nm以上80nm以下、平均アスペクト比が2.0以上4.5以下の針状結晶を含む導電性基板。 - 前記黒化層中に含まれるニッケルと、銅とは、原子数の比率で、
ニッケルを100とした場合に、銅が5以上90以下である請求項1または請求項2に記載の導電性基板。 - 前記透明基材と、前記金属層との間に密着層を有する請求項1から請求項3のいずれか1項に記載の導電性基板。
- 前記黒化層の厚さが50nm以上350nm以下である請求項1から請求項4のいずれか一項に記載の導電性基板。
- 前記金属層が銅または銅合金の層である請求項1から請求項5のいずれか一項に記載の導電性基板。
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