JP7003665B2 - 黒化めっき液、導電性基板の製造方法 - Google Patents
黒化めっき液、導電性基板の製造方法 Download PDFInfo
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- JP7003665B2 JP7003665B2 JP2017564219A JP2017564219A JP7003665B2 JP 7003665 B2 JP7003665 B2 JP 7003665B2 JP 2017564219 A JP2017564219 A JP 2017564219A JP 2017564219 A JP2017564219 A JP 2017564219A JP 7003665 B2 JP7003665 B2 JP 7003665B2
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/021—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material including at least one metal alloy layer
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
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- Chemical Kinetics & Catalysis (AREA)
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- Electrochemistry (AREA)
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- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
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Description
ニッケルイオンと、亜鉛イオンと、銅イオンと、アミド硫酸と、アンモニアとを含み、
ニッケルイオン濃度が2.0g/l以上30.0g/l以下、亜鉛イオン濃度が0.34g/l以上3.0g/l以下、銅イオン濃度が0.20g/l以上2.5g/l以下ある黒化めっき液を提供する。
(黒化めっき液)
本実施形態の黒化めっき液は、ニッケルイオンと、亜鉛イオンと、銅イオンと、アミド硫酸と、アンモニアとを含み、亜鉛イオン濃度を0.34g/l以上、銅イオン濃度を0.20g/l以上とすることができる。
(導電性基板)
次に、本実施形態の黒化めっき液を用いて形成した黒化層を含む導電性基板の一構成例について説明する。
(導電性基板の製造方法)
次に本実施形態の導電性基板の製造方法の一構成例について説明する。
透明基材の少なくとも一方の面上に銅層を形成する銅層形成工程。
銅層上に黒化めっき液を用いて黒化層を形成する黒化層形成工程。
(評価方法)
まず、得られた導電性基板の評価方法について説明する。
(1)反射率
測定は、紫外可視分光光度計(株式会社 島津製作所製 型式:UV-2600)に反射率測定ユニットを設置して行った。
(2)エッチング特性
まず、以下の実験例において得られた導電性基板の黒化層表面にドライフィルムレジスト(日立化成RY3310)をラミネート法により貼り付けた。そして、フォトマスクを介して紫外線露光を行い、さらに1%炭酸ナトリウム水溶液によりレジストを溶解して現像した。これにより、3.0μm以上10.0μm以下の範囲で0.5μm毎にレジスト幅が異なるパターンをもつサンプルを作製した。すなわち、レジスト幅が3.0μm、3.5μm、4.0μm・・・9.5μm、10.0μmと、0.5μm毎に異なる15種類の線状のパターンを形成した。
(試料の作製条件)
以下の各実験例では、以下に説明する条件で導電性基板を作製し、上述の評価方法により評価を行った。
[実験例1]
(1)黒化めっき液
実験例1では、ニッケルイオン、亜鉛イオン、銅イオン、アミド硫酸、アンモニアを含有する黒化めっき液を調製した。なお、黒化めっき液には、硫酸ニッケル6水和物、硫酸亜鉛7水和物、硫酸銅5水和物を添加することで、ニッケルイオン、亜鉛イオン、銅イオンを供給した。
(2)導電性基板
(銅層形成工程)
長さ100m、幅500mm、厚さ100μmの長尺状のポリエチレンテレフタレート樹脂(PET)製の透明基材の一方の面上に銅層を成膜した。なお、透明基材として用いたポリエチレンテレフタレート樹脂製の透明基材について、全光線透過率をJIS K 7361-1に規定された方法により評価を行ったところ97%であった。
(黒化層形成工程)
黒化層形成工程では、上述の本実験例の黒化めっき液を用いて電解めっき法により、銅層の一方の面上に黒化層を形成した。なお、黒化層形成工程においては黒化めっき液の温度が40℃、電流密度が0.2A/dm2、めっき時間が100secの条件で電解めっきを行い、黒化層を形成した。
[実験例2~実験例15]
黒化めっき液を調製する際、各実験例について、黒化めっき液内の亜鉛イオンの濃度、及び銅イオンの濃度を表1に示した値となるように変更した点以外は実験例1の場合と同様にして黒化めっき液を調製した。
Claims (3)
- ニッケルイオンと、亜鉛イオンと、銅イオンと、アミド硫酸と、アンモニアとを含み、
ニッケルイオン濃度が2.0g/l以上30.0g/l以下、亜鉛イオン濃度が0.34g/l以上3.0g/l以下、銅イオン濃度が0.20g/l以上2.5g/l以下である黒化めっき液。 - pHが4.0以上6.5以下である請求項1に記載の黒化めっき液。
- 透明基材の少なくとも一方の面上に銅層を形成する銅層形成工程と、
前記銅層上に請求項1または2に記載の黒化めっき液を用いて黒化層を形成する黒化層形成工程とを有する導電性基板の製造方法。
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PCT/JP2017/002018 WO2017130869A1 (ja) | 2016-01-29 | 2017-01-20 | 黒化めっき液、導電性基板の製造方法 |
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JP7003665B2 true JP7003665B2 (ja) | 2022-01-20 |
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JP (1) | JP7003665B2 (ja) |
KR (1) | KR102631091B1 (ja) |
CN (1) | CN108603302A (ja) |
TW (1) | TWI791429B (ja) |
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WO2004093513A1 (ja) | 2003-04-18 | 2004-10-28 | Dai Nippon Printing Co. Ltd. | 電磁波遮蔽用シート、ディスプレイ用前面板及び電磁波遮蔽用シートの製造方法 |
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US3936694A (en) * | 1973-12-28 | 1976-02-03 | Sony Corporation | Display structure having light emitting diodes |
JPS61163289A (ja) * | 1985-01-14 | 1986-07-23 | Nippon Kagaku Sangyo Kk | ニツケル及びニツケル合金による黒色電気めつき浴 |
JPS61253381A (ja) * | 1985-05-07 | 1986-11-11 | Kawasaki Steel Corp | 溶接性、耐食性に優れた黒色化表面処理鋼板の製造方法 |
JPS63243299A (ja) * | 1987-03-30 | 1988-10-11 | Nippon Steel Corp | 複合メッキ鋼板の製造方法 |
JPH0637711B2 (ja) * | 1989-06-22 | 1994-05-18 | 新日本製鐵株式会社 | 黒色表面処理鋼板の製造方法 |
JPH0368795A (ja) * | 1989-08-07 | 1991-03-25 | K D K Kk | 印刷回路用銅箔の製造方法 |
JP4086132B2 (ja) | 2001-11-16 | 2008-05-14 | 株式会社ブリヂストン | 透明導電性フィルムおよびタッチパネル |
JP2004172343A (ja) * | 2002-11-20 | 2004-06-17 | Nikko Materials Co Ltd | レーザー穴開け用銅箔及びその製造方法 |
CN100515167C (zh) * | 2004-02-17 | 2009-07-15 | 日矿金属株式会社 | 具有黑化处理表面或层的铜箔 |
KR100604964B1 (ko) * | 2004-04-02 | 2006-07-26 | 일진소재산업주식회사 | 전자파 차폐용 흑화표면처리 동박의 제조방법 |
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WO2004093513A1 (ja) | 2003-04-18 | 2004-10-28 | Dai Nippon Printing Co. Ltd. | 電磁波遮蔽用シート、ディスプレイ用前面板及び電磁波遮蔽用シートの製造方法 |
Non-Patent Citations (1)
Title |
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JHA S.K., SHUKLA R.K., SRIVASTAVA S.C.,Studies of the electrodeposition of Ni-Cu-Zn alloys from a sulphate bath,Surface technology,NL,1981年11月,Vol.14,pp.53-63 |
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KR102631091B1 (ko) | 2024-01-29 |
JPWO2017130869A1 (ja) | 2018-11-22 |
TWI791429B (zh) | 2023-02-11 |
KR20180103070A (ko) | 2018-09-18 |
TW201739968A (zh) | 2017-11-16 |
WO2017130869A1 (ja) | 2017-08-03 |
CN108603302A (zh) | 2018-09-28 |
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