KR100604964B1 - 전자파 차폐용 흑화표면처리 동박의 제조방법 - Google Patents
전자파 차폐용 흑화표면처리 동박의 제조방법 Download PDFInfo
- Publication number
- KR100604964B1 KR100604964B1 KR1020040023096A KR20040023096A KR100604964B1 KR 100604964 B1 KR100604964 B1 KR 100604964B1 KR 1020040023096 A KR1020040023096 A KR 1020040023096A KR 20040023096 A KR20040023096 A KR 20040023096A KR 100604964 B1 KR100604964 B1 KR 100604964B1
- Authority
- KR
- South Korea
- Prior art keywords
- copper foil
- electromagnetic wave
- treated copper
- blackening
- black
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/34—Anodisation of metals or alloys not provided for in groups C25D11/04 - C25D11/32
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/38—Chromatising
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D9/00—Electrolytic coating other than with metals
- C25D9/04—Electrolytic coating other than with metals with inorganic materials
- C25D9/08—Electrolytic coating other than with metals with inorganic materials by cathodic processes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0094—Shielding materials being light-transmitting, e.g. transparent, translucent
- H05K9/0096—Shielding materials being light-transmitting, e.g. transparent, translucent for television displays, e.g. plasma display panel
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Description
색 깔 | 얼룩 | 문지름에 의한 분락 | 박리강도(Peel Strength )(kgf/㎝) | |
실시예 1 | 흑색 | ▲ | ● | 0.32 |
실시에 2 | 흑색 | ▲ | ● | 0.21 |
실시예 3 | 흑색 | ▲ | ● | 0.62 |
실시예 4 | 흑색 | ▲ | ● | 0.58 |
실시예 5 | 흑색 | ▲ | ● | 0.54 |
비교예 1 | 흑색 | △ | ○ | 0.68 |
비교예 2 | 흑색 | △ | ○ | 0.69 |
Claims (10)
- 전해도금욕에 동박을 음극으로 배치하고, 상기 동박의 표면에 흑화도금층을 형성시켜 제조되는 전자파 차폐용 표면처리동박의 제조방법에 있어서,Co와 음극에서의 수소 발생을 억제하는 산화제를 포함하는 전해도금욕를 이용하여 상기 동박 표면에 흑색의 Co 산화물 도금층을 형성시키는 것을 특징으로 하는 전자파 차폐용 흑화표면처리 동박의 제조방법.
- 제1항에 있어서,상기 산화제는, KNO3, NH4NO3, HNO3, NaNO3, NH4ClO3, KClO3, NaClO3, KMnO4 중에서 선택되는 하나 이상의 것임을 특징으로 하는 전자파 차폐용 흑화표면처리 동박의 제조방법.
- 제2항에 있어서,상기 산화제의 농도는, 1 ~ 40g/l 인 것을 특징으로 하는 전자파 차폐용 흑화표면처리 동박의 제조방법.
- 제1항에 있어서,상기 전해도금욕에 Ni, Fe 중 하나 이상의 금속이온이 더 포함되는 것을 특 징으로 하는 전자파 차폐용 흑화표면처리 동박의 제조방법.
- 제4항에 있어서,상기 전해도금욕 중 Co, Ni, Fe의 금속성분 총농도는 1 ~ 80g/l 인 것을 특징으로 하는 전자파 차폐용 흑화표면처리 동박의 제조방법.
- 제1항 내지 제5항 중 어느 한 항에 있어서,상기 Co 산화물 도금층을 형성하기 전에, 동박의 표면에 미세 동입자층을 석출 형성시키는 단계를 더 포함하는 것을 특징으로 하는 전자파 차폐용 흑화표면처리 동박의 제조방법.
- 제6항에 있어서,상기 Co 산화물 도금층의 표면에 전해 크로메이트층을 형성하는 단계를 더 포함하는 것을 특징으로 하는 전자파 차폐용 흑화표면처리 동박의 제조방법.
- 제6항에 있어서,도금층이 형성된 표면의 이면에 Zn 또는 Zn 합금으로 구성된 도금 피막층을 형성하는 단계를 더 포함하는 것을 특징으로 하는 전자파 차폐용 흑화표면처리 동박의 제조방법.
- 제6항의 방법에 의하여 제조된 것을 특징으로 하는 전자파 차폐용 흑화표면처리 동박.
- 제9항의 흑화표면처리 동박을 절연성 투명기재에 적층하여 제조되는 것을 특징으로 하는 전자파 차폐용 복합재료.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020040023096A KR100604964B1 (ko) | 2004-04-02 | 2004-04-02 | 전자파 차폐용 흑화표면처리 동박의 제조방법 |
JP2007506086A JP4326019B2 (ja) | 2004-04-02 | 2005-03-31 | 電磁波遮蔽用黒化表面処理銅箔の製造方法 |
PCT/KR2005/000952 WO2006004299A1 (en) | 2004-04-02 | 2005-03-31 | Method for manufacturing black surface-treated copper foil for emi shield |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020040023096A KR100604964B1 (ko) | 2004-04-02 | 2004-04-02 | 전자파 차폐용 흑화표면처리 동박의 제조방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20050097831A KR20050097831A (ko) | 2005-10-10 |
KR100604964B1 true KR100604964B1 (ko) | 2006-07-26 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR1020040023096A KR100604964B1 (ko) | 2004-04-02 | 2004-04-02 | 전자파 차폐용 흑화표면처리 동박의 제조방법 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4326019B2 (ko) |
KR (1) | KR100604964B1 (ko) |
WO (1) | WO2006004299A1 (ko) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5993984A (ja) * | 1982-11-17 | 1984-05-30 | Fuji Electric Co Ltd | 水封式ポンプ装置 |
JP2007332418A (ja) * | 2006-06-15 | 2007-12-27 | Fukuda Metal Foil & Powder Co Ltd | 表面処理銅箔 |
KR101692262B1 (ko) | 2012-05-09 | 2017-01-17 | 오꾸노 케미칼 인더스트리즈 컴파니,리미티드 | 흑색 Cr-Co 합금 도금 피막용 흑화 처리액 |
KR20150077943A (ko) * | 2013-12-30 | 2015-07-08 | 일진머티리얼즈 주식회사 | 동박, 이를 포함하는 전기부품 및 전지 |
CN108603302A (zh) * | 2016-01-29 | 2018-09-28 | 住友金属矿山株式会社 | 黑化镀液、导电性基板的制造方法 |
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TW230290B (ko) * | 1991-11-15 | 1994-09-11 | Nikko Guruder Foreer Kk | |
JP3222002B2 (ja) * | 1993-12-27 | 2001-10-22 | 株式会社日鉱マテリアルズ | 印刷回路用銅箔及びその製造方法 |
US6497806B1 (en) * | 2000-04-25 | 2002-12-24 | Nippon Denkai, Ltd. | Method of producing a roughening-treated copper foil |
JP3374127B2 (ja) * | 2000-11-27 | 2003-02-04 | 古河サーキットフォイル株式会社 | 金属箔、それを用いた回路基板用の積層板 |
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2004
- 2004-04-02 KR KR1020040023096A patent/KR100604964B1/ko active IP Right Grant
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2005
- 2005-03-31 JP JP2007506086A patent/JP4326019B2/ja active Active
- 2005-03-31 WO PCT/KR2005/000952 patent/WO2006004299A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
JP4326019B2 (ja) | 2009-09-02 |
KR20050097831A (ko) | 2005-10-10 |
WO2006004299A1 (en) | 2006-01-12 |
JP2007531820A (ja) | 2007-11-08 |
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