TWI296636B - - Google Patents

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Publication number
TWI296636B
TWI296636B TW093118760A TW93118760A TWI296636B TW I296636 B TWI296636 B TW I296636B TW 093118760 A TW093118760 A TW 093118760A TW 93118760 A TW93118760 A TW 93118760A TW I296636 B TWI296636 B TW I296636B
Authority
TW
Taiwan
Prior art keywords
copper foil
layer
treatment
treated copper
treated
Prior art date
Application number
TW093118760A
Other languages
English (en)
Chinese (zh)
Other versions
TW200504148A (en
Inventor
Akiko Sugimoto
Original Assignee
Mitsui Mining & Smelting Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co filed Critical Mitsui Mining & Smelting Co
Publication of TW200504148A publication Critical patent/TW200504148A/zh
Application granted granted Critical
Publication of TWI296636B publication Critical patent/TWI296636B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0094—Shielding materials being light-transmitting, e.g. transparent, translucent
    • H05K9/0096—Shielding materials being light-transmitting, e.g. transparent, translucent for television displays, e.g. plasma display panel
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/38—Chromatising
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Plasma & Fusion (AREA)
  • Electromagnetism (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Laminated Bodies (AREA)
TW093118760A 2003-07-28 2004-06-28 Surface-treated copper foil having blackening-treated surface, process for producing the surface-treated copper foil and, electromagnetic wave shielding conductive mesh for front panel of plasma display TW200504148A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2003281288 2003-07-28
JP2003353198 2003-10-14
JP2004027706A JP4458519B2 (ja) 2003-07-28 2004-02-04 黒色化処理面を備える表面処理銅箔、その表面処理銅箔の製造方法及びその表面処理銅箔を用いたプラズマディスプレイの前面パネル用の電磁波遮蔽導電性メッシュ

Publications (2)

Publication Number Publication Date
TW200504148A TW200504148A (en) 2005-02-01
TWI296636B true TWI296636B (ko) 2008-05-11

Family

ID=34108578

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093118760A TW200504148A (en) 2003-07-28 2004-06-28 Surface-treated copper foil having blackening-treated surface, process for producing the surface-treated copper foil and, electromagnetic wave shielding conductive mesh for front panel of plasma display

Country Status (5)

Country Link
JP (1) JP4458519B2 (ko)
KR (1) KR100686789B1 (ko)
CN (1) CN1701137B (ko)
TW (1) TW200504148A (ko)
WO (1) WO2005010241A1 (ko)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4575719B2 (ja) * 2003-11-13 2010-11-04 三井金属鉱業株式会社 茶褐色化処理面を備える表面処理銅箔、その表面処理銅箔の製造方法及びその表面処理銅箔を用いたプラズマディスプレイの前面パネル用の電磁波遮蔽導電性メッシュ
TW200718347A (en) * 2005-07-14 2007-05-01 Mitsui Mining & Smelting Co Blackening surface treated copper foil and electromagnetic wave shielding conductive mesh for front panel of plasma display using the blackening surface treated copper foil
WO2008081904A1 (ja) 2006-12-27 2008-07-10 Hitachi Chemical Co., Ltd. 凹版及びこれを用いた導体層パターン付き基材
JP2009021412A (ja) * 2007-07-12 2009-01-29 Hitachi Chem Co Ltd 表面黒化銅金属の製造法、導体層パターン付き基材の製造法、導体層パターン付き基材及びそれを用いた電磁波遮蔽部材
JP2009152285A (ja) * 2007-12-19 2009-07-09 Hitachi Chem Co Ltd 金属パターン及び導体層パターン付き基材の製造法、導体層パターン付き基材並びにそれを用いた電磁波遮蔽部材
JP2009158842A (ja) * 2007-12-27 2009-07-16 Hitachi Chem Co Ltd 表面黒化銅金属の製造法、導体層パターン付き基材の製造法、導体層パターン付き基材及びそれを用いた電磁波遮蔽部材
CN101906630B (zh) * 2010-08-03 2011-08-10 山东金宝电子股份有限公司 电解铜箔的黑色表面处理工艺
CN102660695B (zh) * 2012-04-17 2015-07-29 重庆材料研究院 一种铜丝及其制备屏蔽铜网的方法
TW201940323A (zh) 2018-03-09 2019-10-16 日商大日本印刷股份有限公司 導電性膜、感測器、觸控面板及影像顯示裝置
CN109680307A (zh) * 2019-01-21 2019-04-26 苏州宝士杰塑料科技有限公司 一种装饰性单盐无镍枪色电镀工艺

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5585689A (en) * 1978-12-25 1980-06-27 Seiko Instr & Electronics Ltd Black color plating bath
JPS6191385A (ja) * 1984-10-12 1986-05-09 Nippon Kagaku Sangyo Kk 黒色電気鍍金浴
JPH0654831B2 (ja) * 1990-08-14 1994-07-20 株式会社ジャパンエナジー 印刷回路用銅箔の処理方法
JP2717910B2 (ja) * 1992-11-19 1998-02-25 日鉱グールド・フォイル株式会社 印刷回路用銅箔及びその製造方法
US6224991B1 (en) * 1999-09-13 2001-05-01 Yates Foil Usa, Inc. Process for electrodeposition of barrier layer over copper foil bonding treatment, products thereof and electrolyte useful in such process
JP3330925B2 (ja) * 2000-04-05 2002-10-07 株式会社日鉱マテリアルズ レーザー穴開け用銅箔
JP3998975B2 (ja) * 2001-12-28 2007-10-31 大日本印刷株式会社 電磁波遮蔽用シート
JP2003201597A (ja) * 2002-01-09 2003-07-18 Nippon Denkai Kk 銅箔とその製造方法及び該銅箔を用いた電磁波シールド体
JP2004119961A (ja) * 2002-09-02 2004-04-15 Furukawa Techno Research Kk チップオンフィルム用、プラズマディスプレイ用、または高周波プリント配線板用銅箔
JP4573254B2 (ja) * 2002-10-25 2010-11-04 Ｊｘ日鉱日石金属株式会社 プラズマディスプレーパネル用銅箔及びその製造方法
JP2004162143A (ja) * 2002-11-15 2004-06-10 Nippon Denkai Kk プリント配線板用銅箔の製造方法
JP2004172343A (ja) * 2002-11-20 2004-06-17 Nikko Materials Co Ltd レーザー穴開け用銅箔及びその製造方法
KR101065758B1 (ko) * 2003-02-27 2011-09-19 후루카와 덴키 고교 가부시키가이샤 전자파 실드용 동박, 그 제조방법 및 전자파 실드체

Also Published As

Publication number Publication date
KR100686789B1 (ko) 2007-02-26
CN1701137A (zh) 2005-11-23
JP4458519B2 (ja) 2010-04-28
TW200504148A (en) 2005-02-01
CN1701137B (zh) 2010-04-21
JP2005139544A (ja) 2005-06-02
KR20050063784A (ko) 2005-06-28
WO2005010241A1 (ja) 2005-02-03

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