TWI296636B - - Google Patents

Description

1296636 V. OBJECT OF THE INVENTION α) [Technical Field of the Invention] Electromagnetic wave for surface treatment of copper panel of the surface of the invention The present invention relates to a blackout, smelting, and electric shield using the surface treated copper box Use metal mesh. [Prior Art] Fabric = The conductive mesh for shielding is made of metallized fiber; material: ί to conductive mesh. The manufacture of the conductive stencil includes several methods for laminating a surface-treated copper town and a phase lithography method on an m film to produce a conductive stencil. The other method is to use the lithography method, and to form a conductive stencil with only surface-treated copper foil for the surface treatment of the copper box and the supporting substrate, II, #土板. 0 目尸m $ 111 is required to save power 'electrical generation to generate signal voltage, _v development' and with the reduction of the voltage, the brightness is reduced by a factor of two, so that the circuit board width of the conductive stencil is slightly fine, and Reduce f ^ ^ j: coverage of the glass panel of the stencil. Therefore, it is necessary to make the thickness of the guide plate 帛 and make the (4) easier. The former method (4) of the former forms a thin copper layer on the PET film as a shield of the electric crystal seed crystals, and then has a small stencil line width by lithography/Λ, I ϋ Conductive stencil. Lightning _ t ^ The use of any of the above methods to manufacture a conductive stencil, the guide Γ, set in the former aspect, through the front glass from the surface visible, the surface of the electrical stencil processing a single surface of the copper foil, Black

1296636 V. Description of the invention (2) Color processing to reflect the light transmission brightness. On the other hand, the blackening treatment of the multilayer printed wiring board forms a copper oxide layer to improve the adhesion to the resin layer of the inner layer circuit, and the blackening treatment of the multilayer printed wiring board has been conventionally applied thereto. The above-mentioned technology is disclosed in "Technical Trends of PDP Materials, Hitachi Chemical Technology Report No. 3 (1 9 9 9 - 7)", "Sakamoto Patent Publication Bulletin (Heisei) No. 11-186785", "Japan Patent Publication No. 2 - 31588" and the like.

However, there are serious problems in the above blackening process. That is, when a large amount of copper black oxide is adhered to the surface of the copper foil, a strong blackened surface having a strong color is surely obtained. However, the more the amount of the copper black oxide formed on the surface of the copper foil adheres, the easier it is to fall off from the blackened surface, that is, the more easily the powder falls off. When the powder is detached, the detached black oxide falls into the unused place, and when it is made transparent to integrate with the front panel glass: this causes dispersion of the transparent adhesive I, which causes the transparency to deteriorate. i Another black nickel plating, nickel sulfide plating, cobalt plating, etc. $

The ruthenium treatment can form a powder-free detachment like a blackening treatment, and has a good surface 丨. However, in the process of generally etching copper, the problem that etching cannot be performed by the blackened shoulder side occurs. The solution of the patent 2 = nickel problem is disclosed in the inventor's et al. - 045669. However, this still does not solve the problem of surface treatment copper foil with black processing surface.

1296636 V. Description of invention (3). In particular, there is currently a cobalt ruthenium on the market. It is difficult to use a copper etching solution for cobalt; the copper plating of the H plating film exists, thereby providing a problem of having a ten=: rhyme processing. It is easy to etch two in the same way as the copper etching process: the layer, the foil, and the surface treated copper foil with the surface of the surface of the copper surface. Conductive mesh # 疋 eye is an important topic. Electric Γ玍, 罔, 罔 , 即 f f f f f f f , 根据 根据 根据 根据 根据 根据 根据 根据 根据 根据 根据 根据 根据 根据 根据 根据 根据 根据 根据 根据 根据 根据 根据 根据 根据 根据 根据 根据 根据 根据 根据 根据 根据 根据 根据 根据 根据Plasma display 5| S ^ M f ^ d processing, and obtain high quality < with blackening: surface of the table = anti-recording ίί: surface treatment gongs including processing layer is not absolute: preparation:; ΐΐ layer Two situations. Therefore, for anti-recording, this layer is needed. The description of the warranty of the present invention will be made below. 4 dingling Zhiyue surface treatment copper foil Γ upper treatment steel 羯: surface treatment copper box of the present invention "------------------------------------------------ The surface is set in a single sheet of copper foil layer: Love S; a cobalt sulfate plating layer having a thickness of 2 〇〇mg/Dl 2 to 4 〇〇Dlg/m2; the cross-sectional height of the treated surface is 2 〇〇 nm or less. "The first surface treatment of copper bismuth and bismuth" is based on the following two. The cross-sectional structure of the surface-treated copper foil la is drawn. Page 7 2213-6405-PF(N2); Ahddub.ptd 1296636 ----- V. Description of the invention (4) is shown in Fig. 1. The surface treated surface in Fig. 1 ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ formed on the cobalt sulfate plating layer 4, from the 1 & on the shiny surface of the electrolytic copper Bo 7) using fine copper particles 3 into Eight other side kneading surface (that is, in the thick chain of the electrolytic copper box, the other side surface of the copper beryllium can be set as a thick chaining treatment ^ steel dangling as an example. Its roughening treatment. Fig. 2 is the core 'in the roughening /理' can also be used for the surface treatment miib. The y, / slightly roughening of the other side of the surface to improve the roughing of the layer 2 between the substrate and the like The side of the treatment layer 2: the adhesiveness can be set as needed. The method of the shape, or the adhesion of the fine oxygen can be used for the method of attaching the fine copper particles as described above, and the method of attaching the fine copper particles is not particularly limited. The roughening treatment 'the ruthenium layer 7 mainly uses the electrolytic copper obtained by the electrolytic method or the rolled copper foil obtained by the calendering method. Thereafter, the smooth surface of the copper tank layer 7 is provided with sulfuric acid plating. Layer 4. The sulfuric acid surface plating layer 4 described herein refers to a film layer formed by a method of electrowinning using a sulfuric acid starting solution. The plating layer 4 is a film layer having a weight thickness of 2 〇〇mg/m 2 to 4 〇〇nig/m 2 formed by a manufacturing method described later, and therefore has good solubility in a copper etching solution and can be sufficiently blackened. In the copper foil of the black-based electroplated coating film having a conventional cobalt layer, the thickness of the cobalt layer is about 1 000 mg/m 2 , which is relatively thick, which conflicts with the quality of the so-called dissolution property of the plating layer. As a result, not only the thickness is too thick, but also the dissolution rate of the steel etching solution is slow, and the cobalt element itself accumulates in the steel etching solution at a high concentration, thereby reducing the effect of the etching liquid. The value of the weight of the drill. The weight is calculated by dissolving the surface treated copper foil in an acid solution, and calculating the amount of cobalt per unit area by plasma atomic emission spectrometry.

IM 2213-6405>PF(N2);Ahddub.ptd Page 8 1296636 V. Description of invention (5) Conversion of surface-treated copper foil 1 m2 '^夏夏' 〇 In addition, the initial plating layer is electroplated without 6 cobalt plating The condition and the easy to dissolve in the steel etching solution will be greatly affected by the surface treatment of the copper foil. That is, the surface of the surface-treated indium antimony having the surface of the present invention which is obtained by the present invention has a relatively good surname: the electroplated coating obtained by the method is not quite uneven: the characteristic is the blackened surface. The degree is below 20Gnm for the hair-'5^, and the profile of the f-color treated surface is high TV, 13 is required to be written. That is, the smooth, shiny S & ^ 仏 仏 仏 仏 into a very β Tt * order blackening surface. However, this special indicates that there is a 2 in the presence of 2: avoiding the block guide in the high-pitched right and the error in the general control, and the position of the section door is not the same. The mc 疋 must be below 20 nm. Of course, the height of the profile exceeds 2 〇〇 nm due to errors in the process. For the surface treatment of copper foil of the invention! The cross section of the cobalt sulphate plating layer 4 and the sorghum are observed by the FIB analyzer. The ηΒ diagram is shown in the third = I, and the third figure shows the blackening on the shiny surface of the electrolytic copper pig. By. This FIB image is 6 inches from the observed surface. The direction of observation is the result. It can be seen from Fig. 3 that there is a certain concavity in the cross section of the blackened surface, and when the concavo-convex pattern is observed, it is generally carried out using a stylus type surface roughness meter. However, from the scale of Fig. 3, it is known that the unevenness cannot be correctly measured by the & surface roughness meter. Therefore, in the present invention, the Rmax value measured by the corresponding surface roughness meter is the "profile height" of the maximum difference between the w top and the valley in the field of view observed by the FIB chart. The position shown by "d" in Fig. 3 is the height of the section of Fig. 3, and it is known that it is about 10 〇 ηπι. And, $

1296636 V. Description of invention (6) In the figure, the shape of 'sulphuric acid, the shape of the surface is formed, and the thickness of the bottom of the crucible is 2, along the copper box table J, no: no sulfuric acid surface plating is found: [, 2. Maintain a completely closed shape with powder shedding. θ / is given a special problem, and there is no coloration treatment surface. ^ ^ ^ When the FIB observation is made on the $^new-profile formed on the surface of the conventional steel foil treatment, the hshi h^5 diagram does not. That is, the state of the 4th R head, and the state of the "out" is obtained by the image of Fig. 4 and the section height (d) of the first section. At this time, it can be known that it is a considerable amount of blackened surface, 1 such as the above-mentioned dendritic sheet falling off, of course, it will also break and break black: ί: the surface causes color unevenness; Observed from the FIB cross-sectional view of Fig. 3, the copper foil has a surface treatment of the surface of the present invention, 曰: = although it is a glossy black "d electrolytic copper box and rolled copper When the glossy surface of the box is subjected to the inner color processing, the value of the value in the Lab chromaticity space is not particularly 掬 ri, and is above. Here 27 is about 41.胄Specially limit the upper limit of the target, and estimate the upper limit based on experience. The way of expressing the gloss of the chromaticity ^black it treatment surface is compared with the -, and the glossiness is used. In the blackening treatment of the present invention, it is preferable that the glossiness of the blackened surface [Gs (60.)] is 30 or less on the glossy surface of the electrolytic copper foil or the rolled copper foil. If the light is 2, page 12, 2213-6405-PF (N2); Ahddub.ptd 1296636 5, invention description (7) 30 or more, it will be in the state of the 黑 田 ^ ^ ^ And make the metallic luster f conspicuous. There is no special reference here. 其 ^ It is about 18. The 处理 Μ 先 先 先 , , 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第# aa Long preserved copper foil for the rust-proof layer. The first I) picture shows the surface of the surface of the copper foil 1 c. Fig. 7 is a cross-sectional view showing the phase pull of the phase/draw copper foil 1 d. If the purpose is only on the A 4 surface, use organic imprinting such as imidazole, tri-frustration, and inorganic anti-rust of a wide range of lead-based alloys such as brass. Therefore, in the case where the lead is formed into the cobalt sulfate plating layer, the sulfuric acid pin 2 of the surface treatment copper case of the invention is also applied to the two surfaces. "The other side surface of the spoon. However, when the rustproof surface is provided on both surfaces, the rust treatment layer is not only used to prevent the coarse-stitching treatment layer 2 μ 9 Temple's fall prevention, and as a protective layer of the cobalt sulfate plating layer 4 ", = Micro, the appearance of copper foil 3 de-surface treated copper foil. This rust-preventing layer 5 is capable of maintaining an alloy layer or a lead-cobalt layer for a long period of time. By using these anti-rust treatments in combination with the combination of the lead and nickel layers 4, the cobalt sulfate plating layer 4, the crucible 5 and the cobalt sulfate plating can be facilitated, that is, the rods and σ which are present separately from the cobalt sulfate plating layer 4 The rhyme is dissolved. Also 'month' brother, jgf ancient e gold layer or Asian ship - the first alloy layer, its sulfuric acid bud /, with sub-error - nickel speed. The dissolution of the plating layer 4 is relatively fast. Further, Figs. 8 and 9 show the cross-section of the surface treated copper foil 1 c with the chrome-treated layer 6 and the anti-caries treatment layer 5 - patterning. Compare separately

2213-6405-PF(N2); Ahddub.ptd Page 11 1296636 V. INSTRUCTIONS (8) ___ = Figure and 83⁄4, 7 and 9 are known to be surface treated with copper The difference in foil is only in the chrome-treated layer, which is the same in the show. The chrome-treated layer 6 is formed on the rust-preventing layer 5 formed of a sub-lead-nickel alloy layer or a sub-lead-tantalum layer, etc., and is formed on a single surface or γ-copper 匕 IS secret chrome-treated layer 6. It can significantly improve the surface ϋ emulsification performance, and effectively prevent the surface of oxidative discoloration, etc., and the manufacturing method of the surface-treated copper foil which has a blackened surface. (Method for Producing First Surface-treated Copper Foil) It is preferable to use the method of manufacturing the first surface-treated copper foil. This manufacturing method can be further subdivided into the case of using a bath: ":", the following is divided into "first surface treatment copper / description two method A", "first surface treatment copper foil manufacturing method" A method of manufacturing a surface-treated copper box Α: First, a method of manufacturing a blackening treatment method in the case of a groove will be described. The cold used in the method for producing a surface-treated copper crucible of the invention is the same as the surface of the other side of the cobalt sulfate-plated layer formed above, and the copper box may not be used. The conditions for the % treatment are not particularly limited, for example, in forming this super. When granulating, it is generally possible to use a cut copper electrolyte. For example, in sulfuric acid steel-soluble steel, the conditions are set as follows: copper concentration is 5 to 10 g/l, sulfuric acid concentration is 100 to 120 g/l, gas concentration is 2 〇 to 3 〇 ppm, and 9-phenyl acridine is 50~300mg/l, liquid temperature is 3〇~4〇〇c, current density is 5~2〇α/_2.

2213-6405-PF(N2); Ahddub.ptd Page 12 1296636 V. Description of the Invention (9) a) The process is to form a cobalt sulfate plating layer on the shiny side of the above copper foil. ^Cobalt sulfate electroplating layer is not stirred bath system using 8g / 1~1 0g / 1 of hydrated cobalt heptahydrate pH 5 is also determined to be more than 4.0 cobalt sulfate plating solution, electrolysis with 2A / din2 electric density, To form a black cobalt sulfate plating layer. That is, the ί Ϊ Ϊ solution disturbs the situation of the sulphate plating condition. Here, if the cobalt sulphate diacid is less than 8 g/i, the sulfur formed will be uniform. The speed is slowed down, and the thickness of the nickel sulfate layer is further reduced--relatively, the cobalt sulphate of the right heptahydrate is more than 1 〇g/; l, the 黑色 of the blackened state with a good color tone of the cobalt-cobalt plating layer disappears . It is better to use the solution of the cobalt sulfate plating solution at this time = (5). Adjusted in this range, a good yield of ^^ oxygen: Κ "cobalt plating layer can be obtained. When adjusting this ρΗ, it is preferable to add no other electrolyte such as hydrogen emulsified sodium or potassium cesium oxide. This is because the cobalt black solution It is easy to change to metallic color. The 1s etch can be stably maintained at a temperature above 4·0 by maintaining the concentration of metal ions in the solution at a certain level, because the concentration of the above::2 ί cobalt ion is stable. $ 'Most # uses *Soluble cobalt electrode. = Appropriately added with chlorine oxidation to make the separation: The electrolytic density of electrolysis is 2A/dm2 or more, #矿矿 even if used excessively Electrolytic current, and shape 1 is true. Therefore, there is little powder shedding at this place, and the upper limit of current density is not limited. 玎page 13 2213-6405-PF(N2); Ahddub.ptd 1296636 (Invention) (10) In accordance with the general technical knowledge, considering the productivity of the process, it is determined to be used in any of the b) bismuth, for the copper foil of the above process, to obtain a black cobalt plating layer Treatment: washing, drying, washing method here, dry The method is not to deal with the copper pig. The method of J suction can use the general first surface treatment copper foil manufacturing method B: In this case, the Rideau virtual king Φ, + > The method for manufacturing the color treatment method is described in the following: The method for producing the surface-treated copper foil of the present invention is formed on the shiny surface of the copper box by using: lower = electricity 3

Sulfur formed by a non-stirred sulphate plating bath A dense blackened surface. In the process of standing 罨 plating phase 冋 = hour (eight), 10 g / b 40 g / 1 of heptahydrate sulfuric acid =, pH value of 4.0 or more, liquid temperature of 30 1 or less set of sulfuric acid starting plating solution, using a stirring bath, The current density of 4A/dm2 was electrolyzed, and a black cobalt sulfate plating layer was formed on the shiny side of the foil as described above. That is, here, the difference in the manufacturing method A of the first surface-treated copper crucible is that electrolysis is carried out while stirring the cobalt sulfate plating solution while sulfuric acid = electrowinning. The lower the concentration of sulfuric acid, the lower the concentration of cobalt sulfate, the more likely it is to produce a good blackening state. However, if the cobalt sulfate heptahydrate in the cobalt sulfate plating solution is less than "10g/l, the plating speed of the cobalt sulfate plating layer formed by the stirring bath is slowed down, and the thickness of the nickel sulfate layer is made more uneven. Lack of industrial productivity. If the cobalt sulfate heptahydrate exceeds 40g/ι, the formed cobalt sulfate plating layer is not easy to form a dense concave and convex pattern.

1296636 V. Description of invention (11) A good blackening state disappears. At this time, the pH of the solution of the sulfuric acid starting plating solution was adjusted to a range of .5 in 4 μ μ. Set to this range 4.; When, the most = fixed: a good black initial plating. Adjusting this ΡΗ田Ζ 虱 rolling other electrolytes such as sodium or potassium hydroxide. Second, because Ϊ = black solution is easy to change to metallic color. The value of the stable gold Λ ion concentration _, 4. 〇 above the dry circumference is also the same as above. At this time, the copper sulphate ore solution, the pot liquid, and the tetra-dial two have a lower liquid temperature at this time, and the more: the tendency is obtained. When the liquid temperature A ο Π Μ Μ — — — — 巴 巴 巴 巴 巴 巴 巴 巴 巴 — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — In the surface treatment, a good blackened surface was obtained. flow. In the i fan = electric =: =::: using the following electric pattern of sulfuric acid; ίί adhesion, good micro-concave surface, generally ^: ^ black plating on the surface with concave and convex pattern Table method. Then, i::: current flows into the excessively matt gray area. Good black current density is small. ★ It is more stable. Consider industrial productivity. 'Use small current density as much as possible' 〇· 5A/dm2. In addition, the square ^, live: It can be estimated that the lower limit of the current density is the first surface treatment steel, and the current density is more than 4A/dm2, and the above-mentioned copper sheet is processed, A method A, The blackening portion 2213-6405-PF(N2) can be formed to the same degree as the blackening treatment without roughening; Ahddub.ptd, page 15 1296636 V, invention description (12), so that the manufacturing is lost. The meaning of method B. Further, a blackened surface is formed in the current density range; the above phenomenon occurs. There is no powder-like b) in the process of b) washing the copper box of the above process to obtain the surface treatment H which is treated with blackening of the Qiu t-mine layer. Here, the washing method and drying method are There are no special restrictions, you can use '〗 〖 to do. (Method for Producing Second Surface-treated Copper Foil) In the case of the second surface-treated copper foil, a surface-treated copper having a black sulfated surface treated with a cobalt sulfate plating layer is produced in the same manner as the above-described second surface-treated copper foil. The foil 'afterwards forms an anti-rust treatment layer. Therefore, the manufacturing process includes: "a) forming a black cobalt sulfate plating layer on the shiny side of the copper foil; b) forming a rustproof treatment layer on both surfaces or a single surface of the copper foil forming the black cobalt sulfate plating layer ; and c) thereafter, washing and drying. That is, in the method of manufacturing the first surface-treated copper foil (the manufacturing method A and the manufacturing method B), only the formation process of the rust-preventing treatment layer is increased. Therefore, the formation process of the rust-preventing treatment layer will be described here. A copper foil formed by forming a black sulfuric acid initial plating layer is prepared to form a rust-preventing treatment layer on the rain surface or a single surface thereof. Regarding the use of conventional imidazole, organic rust prevention of benzotrim 4, and inorganic rust prevention of an Asian alloy such as sub-error or brass used in general, it can be carried out by a general method, and therefore it is not used here. Detailed explanation. The following description will be made on the case where the lead-nickel-nickel plating solution or the sub-ship-# alloy plating solution is subjected to a plating treatment to form a rust-preventing treatment layer. First of all

2213-6405-PF(N2); Ahddub.ptd Page 16 1296636 V. Description of invention (13) Explain the case of Asian ship-nickel alloy plating. There is no particular limitation on the use of the lead-nickel-nickel alloy plating solution, and an example is given here, for example, nickel sulfate having a nickel concentration of 5.2 g/l, and a concentration of the lead used is 〇·b lg/1. The pyrophosphate pyrolysis, pyrophosphate clock is 50~50 0g/l, the liquid temperature is set to 2〇~5 (rc, the pH is 8~11, the current density is 0.3~10A/dm2, etc.) Lead-cobalt alloy plating. There is no special restriction on the use of the lead-based alloy ore solution. Here, for example, cobalt sulfate with a cobalt concentration of 2.5 g/l and a lead concentration of ruthenium are used. • Bu 1§/1 lead pyrophosphate, potassium pyrophosphate 50~500g/l, liquid temperature set to 2〇~5〇〇c, &quot;value 8~11, current density 0.3~l The condition of 〇A/dm2, etc. The rust-preventing layer including the combination of the bismuth-cobalt alloy plating and the chrome-treated layer described later has a particularly good anti-corrosion property. a In the case of the second surface-treated copper town, After forming a lead-nickel alloy layer or a lead-cobalt alloy layer on the mi surface, a chromium layer is formed, so that better tamper resistance can be obtained. That is, open 3μ, +, &Amp; ^ ^ J 1 After forming the above rust-preventing treatment layer, a chromium treatment process can be performed. The chrome treatment process is carried out by θ ^ « ^ I, even if the chromium solution is in contact with the copper surface. The displacement treatment medium may be buried, and any one of electrolytic chromium treatment may be used, which is included in the chromium solution φ; 隹 士, + L aL l ^ / night 仃 / 仃 夜 夜 夜 。 。 。 。 。 。 。 。 , used here, the six, f, ffl ^ rm wonderful β $ chromium solution, can be used in the general method, the field A - the main two * field ▲ washed, dried to form a blackened surface Surface treatment copper box. <Electrically conductive mesh for electromagnetic wave shielding, shi persimmon and 々 品 ♦ 罔 罔 罔 & & & & & 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本The ancient black money 曰 ^ raw blackening treatment of the powder drop situation 'not only has a good black, 蝼 ^ into a blackened surface can also be general

2213-6405-PF(N2); Ahddub.ptd Page 17 1296636 V. Description of the Invention (14) When the copper etching process is used in the process of etching and removing, some advantages can be reported, and the present invention can be said to be conductive for shielding electromagnetic waves. [Effect of the Invention] The thickness of the black cobalt-cobalt plating layer of the present invention is small, and the amount of the conductive screen for the uniform wave shielding is small, so that the etching property is good, and the copper-etching liquid of the hydrogen peroxide system is further provided. The efficiency of processing the copper foil yield plating layer is increased, and. Therefore, if it is applied to the manufacture of a printed circuit board, it is easy to perform processing of an arbitrary shape. According to this, it is very suitable for the stencil of the plasma display panel. The surface treated copper box of the treated surface, regardless of the sulfur, exhibits a good black color in accordance with the electromagnetic properties of the plasma display panel. In addition, since the cobalt content does not lower the general action of ferric chloride and sulfuric acid, the life of the solution is prolonged. The method for producing a surface-treated copper foil can be improved by dissolving the sulfuric acid formed under the above-mentioned production conditions in the copper etching solution. [Embodiment] The surface of the blackened surface is used for the surface treatment of electromagnetic wave shielding. Conductive stencil The following is a result of manufacturing the copper foil described above and using copper worm liquid. [Example 1] In the present embodiment, 1 a ' was produced and experimentally shaped by a residual method to confirm the etching performance. The first surface-treated copper foil is not used as the conductive mesh for electromagnetic wave shielding. In this embodiment, copper is used as the electric M ^ ^ . Then, using a sulfuric acid/liquid, the thickness is 15/min, 150 g/i, and the liquid temperature is 3 〇.

2213-6405-PF(N2); Ahddub.ptd 1296636 V. Inventive Note (15) _ Solution 'and immerse (4) in this solution for 10 minutes, then dilute; * ί after this thickness of 15 ❹ electrolytic steel box The rough sugar surface is roughened. At this time, the roughening treatment 俦 "to extend the ancestor to make the copper concentration of the sulphuric acid to the second solution, the use of "Omg / i solution, and the use of liquid temperature of 38t: Benzidin ISA / df, electrolysis time 2 seconds of electrolysis conditions. The first two are on the surface of the copper foil that has been treated. ®,,, 曰 No! This roughness a) in the process, in the above-mentioned electrolytic copper foil. This sulfuric acid, (10) layer 4 formation system Use a cobalt sulphate solution with a concentration of 10 g/l, a pH of y/, and a cobalt sulphate plating solution at a concentration of 10 g/l, with a current of 2 A/dm2, 隹:·; text/dish is 30 C black Sulfuric acid Mingdian clock layer (conversion; degree of electrolysis into two 8 seconds of electrolysis, in the form of (four) sub-concentration and μ special V whole" electrolysis between the solutions, no need to adjust the thick sound of metal ions due to short At the time of the formation of sulfuric acid (four). The reason for the degree of Chen. Figure 11 shows that b) in the process, with sufficient pure water into the drying temperature of 150 ° C in the drying furnace to stay about 4 color; The ring is obtained with a very good color tone; the moisture is dried, and la. Between the above processes, the principle of the surface treatment copper box J J1 women's platoon about 1 5 Zhong Cheng, to prevent the penetration of a solution of pre-treatment process., / Air <the surface treated copper foil> A ΠΒ apparatus having a blackening was observed that obtained by the above process

2213-6405-PF(N2); Ahddub.ptd Page 19 V. OBJECT DESCRIPTION OF THE INVENTION (16) The surface of the surface treated steel foil is the same as that of the surface of the blackened surface. Lab's Lab color empty door medium (d) is 100nffl, the blackening is..., in r color:: paste, gloss [_ peeling will test, and there is no %::: mouth <electric water does not show ^ Manufacture of electromagnetic wave shielding mesh board > hood; = It is the surface sticker electricity: wave shielding conductive mesh 2 = ίϊί :: The board spacing is 200, the stencil line width is 罔, exposed by ultraviolet light, Form a pattern with (4) Wm5: stencil around. In the same Xiao Xiao, also: (4). In the subsequent development step, the pattern 4 cannot be removed, and the development is performed using an alkaline solution to form an etching pattern. Then, the copper chloride etching is performed using the ferric chloride sweet etching liquid as the copper surface side, and then the etching mask layer is peeled off: The conductive stencil for the earthing area is shielded. Knot, not only does the surname have no residue: Cheng: Magnetic wave engraving process is quite good. Figure i2 shows the etched state used to measure the etched pattern (circuit line width is 1 3 // m). From the second x2 x , the measurement ‘not only has no etch residue•, but also a neat circuit that can be phased back. (Resolution 2) In the present embodiment, the second surface-treated copper foil 1 having the pinzo-nickel alloy layer as the anti-money treatment 1296636 and the invention (17) layer shown in Fig. 6 is produced. c. The shape of the conductive mesh for electromagnetic wave shielding was experimentally produced by the etch method to confirm the etching performance. Therefore, since the blackening treatment layer for forming the cobalt sulfate plating layer is the same as that of the first embodiment, only the rustproof treatment conditions will be described here. The conversion thickness of the black cobalt sulfate plating layer was the same as that of Example 1, which was 3 2 0 mg / m 2 . Here, a copper foil formed by performing a black cobalt sulfate plating layer on the single surface of Example 1 was prepared. The surface is plated with a lead-nickel alloy plating solution to form a lead-nickel alloy layer on both surfaces. The formation of the sub-lead-nickel alloy layer includes the use of a sulfuric acid having a nickel concentration of 2 · 0 g / 1 , the use of a sub-error ? 0 g / l of a pyro-acidic acid error, and a coke filling acid clock of 25 〇g/1, the liquid temperature was set to 35 ° C, the pH was 10, and the current density was 5 A/dm 2 , and electrolysis was performed for about 5 seconds to plate a uniform and smooth film layer on both surfaces. Then, as in Example 1, rinsing with sufficient pure water, staying in a drying oven with a heater at an ambient temperature of 150 Torr for about 4 seconds, and drying the water to obtain a blackening treatment with a very good color tone. Surface treatment of copper foil 1 c. Between the above processes, a pure water cleaning process of about 5 seconds is arranged in principle to prevent penetration of the solution of the pretreatment process. <Physical properties of surface-treated copper foil> The cross-section of the surface-treated copper foil having the blackened surface obtained by the above process was observed by a FIB apparatus, and as a result, the same cross section as that of Fig. 3 was obtained, and the height of the blackened surface was obtained. For 丨丨5nm, the L value in the Lab chromaticity space of the blackened surface is 28, and the gloss [Gs (6 〇. is 2 ι. In addition, the adhesive tape is attached to the blackened surface, and the tape is attached) Stripping

1296636 ——————- V. In the test of the invention (18), no powder shedding was found. &lt;Manufacture of Electromagnetic Wave Screening Screen for Plasma Display> As in Example 1, the obtained surface treatment was used = a conductive mesh plate was used. As a result, even the 'where ~ to make electromagnetics is quite good etching. [Embodiment 3] This embodiment is an etching method having a f-type nickel alloy layer and a chromium-treated layer #2nd surface-treated steel two-layer layer as shown in FIG. The tester for electromagnetic wave shielding is experimentally produced: 1, 'and to: recognize the residual performance..., to form the sulfuric acid: Lu is the same as the second (five), so here only ^ is the same as = sulfuric acid The thickness is calculated and the formation of the rust layer is the same as in the second embodiment. After the lead-nickel alloy shovel is formed on the household m, the two surfaces are subjected to '^ treatment. Here, electrolysis treatment is used, and the setting conditions of the electrolysis conditions are 〇g/l, the pH is 11.5, and the liquid temperature is 35. 〇, electrolytic density is 8A/dm2, and electrolysis time is 5 seconds. Then, when the formation of the chromium layer is completed, the flushing is performed with sufficient pure water to heat the ambient temperature to 15 Torr. In the drying oven of the crucible, the surface treated copper foil le having a very good hue of the blackened surface was obtained by leaving it for about 4 seconds. Between the above processes, a pure water cleaning process of about 15 seconds is arranged in principle to prevent penetration of the solution of the pretreatment process. 2213-6405-PF(N2); Ahddub.ptd Page 22 1296636 V. Description of Invention (19) <Physical properties of surface-treated copper foil> Using a FIB apparatus, the surface-treated copper foil having the surface obtained by the above process was observed. Called surface, coated..., color processing surface: The height of the colorized surface is 12lnm, the blackening: the L value of the Lab's Lab color space is 27, and the gloss [Gs(6; A point tape was attached to the blackened surface, and no powder peeling was observed in the test of =. The manufacturing of the electromagnetic wave shielding mesh for the plasma display was as follows. The copper ruthenium was surface-treated to form a conductive stencil for wave shielding. As a result, even if the etching treatment of the rust-preventing treatment layer was not affected, and there was no etching residue, it was said to be a relatively good etching. [Embodiment 4] In this embodiment, the second surface-treated copper case 1c having the lead-starting alloy layer as the rust-preventing treatment layer shown in Fig. 6 is produced, and the electromagnetic wave shielding is performed by the test method in the remaining test method. Use the shape of the conductive mesh to confirm the residual energy Therefore, the blackening treatment layer to form the cobalt sulfate plating layer is the same as in the first embodiment, so only the rustproof treatment conditions will be described here. The converted thickness of the black and color cobalt sulfate plating layer and the embodiment 1 Similarly, it is 320 mg/m2. Here, a copper foil which is formed on the glossy surface of Example 1 to form a black barium sulfate electroplated layer is prepared, and the two surfaces are plated with a sub-alloy-alloy plating solution for two. A lead-cobalt alloy layer is formed on the surface. The formation of the lead-and-face alloy layer includes the use of cobalt sulfate having a cobalt concentration of 2.0 g/1, using sub-2213-6405-PF (N2); Ahddub.ptd 23rd Page 1296636 V. Description of the invention (20) The pyrophosphate acid error with a concentration of 0 · 5 g / 1 is 2,500 g / 1, the liquid temperature is set to 35 ° C, and the pH is 10, With a current density of 5 A/dm 2 , electrolysis was carried out for about 5 seconds to electroplate a uniform and smooth film layer on both surfaces. Then, as in Example 1, it was rinsed with sufficient pure water to heat the heater. Allow the environment to reach a temperature of 150 ° C in the drying oven for about 4 seconds, drain the water, and get very good The surface treatment copper box 1 c of the blackened surface of the color tone. In principle, a pure water cleaning process of about 5 seconds is arranged between the above processes to prevent the penetration of the solution of the pretreatment process. Physical properties> The cross section of the surface-treated copper foil having the blackened surface obtained by the above process was observed by a FIB apparatus, and as a result, the same cross section as that of Fig. 3 was obtained. The height of the blackened surface was 128 nm, and the blackening was performed. The l value in the Lab chromaticity space at the surface is 28, and the gloss [Gs (6 〇. . Further, an adhesive tape was attached to the blackened surface, and no powder peeling was observed in the test of the tape. : <Manufacture of Electromagnetic Wave Screening Screen for Plasma Display> As in Example 1, the obtained surface-treated copper foil was used to shield the conductive mesh. As a result, even if there is an anti-rust treatment, the electromagnetic etching is not affected, and there is no etching residue for 16 and 4 d, which is quite good etching. η 疋 疋 [Example 5]

1296636

V. INSTRUCTIONS INSTRUCTIONS (21) #刻法试验制作制作制作 Confirmation of characterization performance. Because the shape of the conductive mesh plate for magnetic wave shielding is layered, it is the same as the blackening treatment of the cobalt plating layer of the embodiment. The same is true for the S color protection, so only the rust prevention is used here. The treatment conditions are the same as two: the shape of the sputum of the anti-recording treatment layer of the second “Shengu electric ore layer” is formed on the two surfaces: J: chrome treatment with a lead-precious alloy. Here, after the picking, the two surfaces were subjected to acid 5, &quot;, the enthalpy value was U.5, and the liquid temperature was 35. . , electricity ': to include chromium 8A / dm2, electrolysis time is 5 seconds. I heart is then 'when the formation of the chrome layer is completed, with sufficient pure water to enter: the ambient temperature reaches 15 (the rc drying oven stays about "less Ϊ: obtain a blackened surface with very good color tone Surface treatment _e. In principle, a pure water cleaning process between the above processes is to prevent the penetration of the solution of the pretreatment process. <Physical properties of the surface-treated copper foil> ^ With the FIB device, the observation has the above process The cross section of the surface-treated copper foil of the obtained blackened surface was obtained, and as a result, the cross section of the blackened surface was obtained as the cross-sectional height of the blackened surface, which was 1 2 〇ηιη, and the blackened surface was in the Lab chromaticity space. The 丄 value was 29, and the gloss [Gs (60.)] was 22. In addition, in the test in which the adhesive tape was attached to the blackened surface and the tape was peeled off, no powder peeling was observed. Manufacture of Electromagnetic Wave Masking Screen for Display> As in Example 1, the obtained surface-treated copper foil was used to fabricate electromagnetic

1296636

Ik V. INSTRUCTIONS (22) Conductive stencil for wave shielding. As a result, even if there is a rust-preventing treatment layer, the residual is not affected, and there is no etching residue, and it can be said that a relatively good surname is performed. [Embodiment 6] This embodiment differs from Embodiment 1 in that the rough surface of the electrolytic copper foil is not roughened. Hereinafter, as in Embodiment 1, a cobalt sulfate plating layer is formed on the shiny surface of the electrolytic copper box. The treated layer was blackened to produce the second surface-treated copper foil 1 b as shown in Fig. 2, and the same test as in Example 1 was carried out. Therefore, in order to avoid the same description as in the first embodiment, the description thereof is omitted here. The converted thickness of the black cobalt sulfate plating layer was 31 〇 mg/m 2 . Fig. 13 shows the blackened surface (sulfur, cobalt plating layer) of the surface-treated copper foil obtained herein. |夂<Physical properties of surface-treated copper pigs> The cross-section of the surface-treated copper box having the blackened wide surface obtained by the above process was observed by a fib apparatus, and the result was obtained on the same side as the third figure, and the blackened surface was The height of the section is 丨丨6nm, and the L value of the Lab chromaticity space of the black _4 surface is 27, and the glossiness [Gs (6〇, . . . In addition, the adhesive tape is attached to the blackened surface, And =23. In the test, no powder shedding was observed. &gt; Fabrication of Electromagnetic Wave Screening Screen with Stripping <Microprocessor Display> As in Example 1, the obtained surface copper box wave shielding conductivity was used. The stencil. As a result, even if there is a rust-proof treatment for electromagnetic remneration, it is not affected 'and there is no etching residue, two: there is a fairly good etching. 'It can be said that

I296636 V. INSTRUCTION DESCRIPTION (23) [Embodiment 7] This embodiment is the same as the embodiment 6, and is not subjected to electric power, coarse rounding treatment, and the use of the above-mentioned roughening: the rough surface of the rough surface is blackened. The electromagnetic wave shape was experimentally produced by the first etching method as shown in Fig. 2 to confirm the etching performance. In the present embodiment, the copper I obtained by electrolyzing a copper sulfate solution is used. Then, use a sulfuric acid solution with a sulfuric acid concentration of 15 〇g / 1, liquid :, , , 5, and soak the copper foil in the solution ‘&quot;, face cleaning. ,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, The formation of the sulfur (4) electro-mineral layer is carried out by using a stirring bath to make the hydrazine sulfate, the pH value of 5.5, and the liquid temperature of 27 ° C of barium sulfate f, and electrolysis at a current density of 1 A/dm 2 for 15 seconds. To form a color cobalt cobalt plating layer (converted to a thickness of 334 mg / m 2 ). At this time, the solution = 2 ion concentration is not specially adjusted. This is because a short-term solution does not need to adjust the concentration of metal ions. For the reason, the cobalt sulfate coating layer is drawn in Fig. 14. 1~ b) In the process, rinse with sufficient pure water, and stay in the drying furnace with a temperature of 150 t for about 4 seconds. The moisture-treated # is dried, and the surface-treated copper foil 1 having a blackening treatment surface having a very good color tone is obtained. In principle, a pure water cleaning process of about 15 seconds is arranged between the above processes to prevent the solution of the pretreatment process. Penetration. <Physical properties of surface treated copper foil>

2213-6405-PF(N2); Ahddub.ptd 1296636 V. Description of the invention (24) The FIB device was used to observe the profile of the surface-treated copper foil having the blackened surface of the blackened portion obtained by the above process, and the result was obtained and the third The phase == surface, the height of the blackened surface is 131 nm, the L value of the black gamma = Lab's chromaticity space is w, and the gloss [Gs(6〇, .)] is Adhesive tape was attached to the blackened surface, and the powder was not tested. <Manufacture of Electromagnetic Wave Screening Screen for Plasma Display> As in Example 1, the obtained surface-treated copper foil was used to dampen the conductive mesh for shielding. As a result, even if the etching prevention layer was extensively etched, it was not affected, and no etching residue was performed, and a relatively good etching was performed. [Embodiment 8] This embodiment is the same as the embodiment 6, and the roughening of the electrolytic copper foil is not roughened, and the copper is not subjected to the above-described roughening treatment to be blackened to produce the second The first surface of the figure is shown in the figure, and the surface of the copper foil lb is shown in the first surface. The shape of the electromagnetic wave shielding is experimentally produced by an etching method to confirm the etching performance. In the present embodiment, a thick acoustic/zm copper foil obtained by electrolyzing a copper sulfate solution is used. Then, use a dilute sulfuric acid solution having a sulfuric acid concentration of 15 〇g/1 and a liquid temperature of ^", and the copper foil is immersed in the solution for 3 〇粆, ^~ C surface cleaning, and then After the 'a glossy surface of the copper box, a) process to form a furnace plating layer. The formation of the cobalt sulfate electric ore layer is a scavenging bath, so that 1 ^, 20 g / l of heptahydrate sulfate, PH value is set to 5·5, liquid 'for

1296636 V. INSTRUCTIONS (25) The cobalt cobalt plating solution is electrolyzed for 7 seconds at a current density of 2 A/dm 2 , and a black cobalt sulfate plating layer (converted to a thickness of 34 〇 mg/m 2 ). This/formation #ion concentration is not specifically adjusted. This is because in order to electrolyze in the short = medium, it is not necessary to adjust the concentration of the metal ions. The shape of the cobalt-plated layer is the same as that shown in Fig. 14. In the process of the claw acid b), it is rinsed with sufficient pure water, and left in a drying oven with a temperature of 150 t, for about 4 seconds, to give the ring a surface with a very good color blackening surface. Process ^ and ib. Between the above processes, in principle, about 15 seconds are cleared to prevent penetration of the solution of the pretreatment process. ^Unscrupulous <Physical properties of surface-treated copper foil> A cross-section of a surface-treated copper foil having a blackened surface obtained by the above-described process was observed by a FIB apparatus, and as a result, the surface of the surface-treated copper foil was obtained, and the blackened surface was obtained. The height of the section is 124 nm, and the L value in the Lab color space of the blackened wide face is 33, and the glossiness [Gs (6 〇.) In addition, the adhesive tape is attached to the blackened surface, and the tape is applied. In the test of 龅, no powder detachment was observed. <Manufacture of Electromagnetic Wave Shielding Screen for Electro-Polymer Display> As in Example 1, the obtained surface-treated copper foil was used to prepare a conductive stencil for shielding. Even if the etching of the rust-preventing treatment layer is not affected, and the etching residue is not performed, a relatively good etching is performed. 4 Case 疋 [Example 9] This example is the same as Example 6 except for the rough surface of the electrolytic copper box. Enter

1296636 V. INSTRUCTIONS (26) -- Roughening treatment, blackening the shiny surface to produce the first If-hand treated copper box lb ' as shown in Fig. 2 and experimentally using electromagnetic etching ^ ^ ^ Conductive 纟 m shape, so it is difficult to inscribe performance. The present embodiment uses a copper ruthenium having a thickness of 15 Å obtained by electrolyzing a copper sulfate solution. Then, a dilute sulfuric acid solution having a sulfuric acid concentration of 15 〇g / 1, liquid temperature was used, and the copper foil was immersed in the solution for 3 sec seconds, after which the surface was cleaned. Thereafter, the glossy side of the mi is subjected to a) process to form a sulfur plating layer. The formation of the sulphate plating layer is carried out by using a bath, using a cobalt sulfate solution containing 40 g/l of cobalt sulfate heptahydrate, a pH of 55, and a liquid temperature of 27, at a current density of 1 A/dm 2 for 15 seconds. Electrolysis of the clock, color sulfuric acid initial plating (converted thickness of 338mg/m2). At this time, the concentration of 饴 ions in the solution is not specially adjusted. $ is because the concentration of the metal ions is not required to be solved, and the form of the plating layer is the same as that shown in Fig. 11. In the process of taking the guacame b), rinse with sufficient pure water, and leave it in a drying oven with a temperature of 1501 to hold the water for about 4 seconds to remove the water; dry to obtain a black color with a very good color tone. Surface treated copper foil 1 = of the treated surface. Between the above processes, a pure water cleaning process of about 15 seconds is arranged in principle to prevent penetration of the solution of the pretreatment process. <Physical properties of surface-treated copper foil> The cross-section of the surface-treated copper enamel having the blackened surface obtained by the above process was observed by a FIB apparatus. As a result, the same surface as that of the third figure was obtained, and the height of the blackened surface was obtained. 134nm, the blackening process

1296636

V. Description of invention (27) The L value of the Lab's Lab color space is 34, and the gloss [Gs(6〇.)] is 21 In addition, the adhesive tape is attached to the blackened surface, and the adhesive tape is applied. . In the test, no powder shedding was found. / 彳 <Manufacture of Electromagnetic Wave Screening Screen for Plasma Display> As in Example 1, the obtained surface-treated copper foil was used to fabricate a conductive screen for wave shielding. As a result, even if there is a rust-proof treatment, the magnetic remnant of the reed is not affected, and there is no rhyme residue ‘: two is performed quite well. [Example 10] In this embodiment, the second surface-treated copper crucible ld having the anti-rust treatment of the lead-cobalt alloy layer shown in Fig. 7 was produced, and the electromagnetic wave shielding conductive was produced by etching the crucible. The shape of the stencil to ensure 2 performance. Therefore, the blackening treatment layer to form the cobalt sulfate plating layer is the same as in the second embodiment. Therefore, only the conversion thickness of the anti-money treatment condition and the color cobalt sulfate plating layer are the same as in the seventh embodiment, ... 3 3 4 mg / m2 〇 Prepare a star foil of Example 7; ρ &gt; The copper foil formed by the plating layer is formed on the same surface as the # 2 ”, cobalt sulfate surface. However, the pure water of V:" is rinsed, and it is kept in a sufficient temperature in the furnace for about 4 seconds, and the water is removed to the surface of the medium. The surface of the treated surface is dehydrated to obtain a solution having a very good color, which is arranged in principle for about 15 seconds between the above respective processes. ^washing process' to prevent pretreatment process

i 1296636 V. INSTRUCTIONS (28) ------ <Physical properties of surface-treated copper box> The surface of the surface-treated copper enamel having the blackened surface obtained by the above process was observed by a FIB apparatus, and the result was obtained. In the same plane as in Fig. 3, the cross-sectional height of the blackened surface was 128 nm, and the L value in the Lab chromaticity space of the blackened surface was 28 'gloss [Gs (6 Å)) was 3 Å. Further, in the test in which the adhesive tape was attached to the blackened surface and the tape was peeled off, no powder peeling was observed. <Manufacturing of Electromagnetic Wave Screening Screen for Plasma Display> As in Example 1, the obtained surface-treated copper foil was used to produce a conductive mesh for electromagnetic shielding. As a result, even if there is a rust-preventing treatment layer, the button is not affected, and there is no etching residue, which can be said to be a relatively good etching. n [Example 11] This example is a second surface-treated copper foil 丨f / having a ruthenium-cobalt alloy layer as a rust-preventing treatment layer and a chromium-treated layer shown in Fig. 9 and tested by an etching method. The shape of the conductive mesh for electromagnetic wave shielding was prepared in a manner to confirm the etching performance. Therefore, the black blackening of the cobalt sulfate plating layer is the same as that of the seventh embodiment, and therefore only the rustproof treatment conditions &amp; The converted thickness of the black cobalt sulfate plating layer was the same as in Example 7, and was 334 mg/m2. The rust-preventing treatment layer was formed as in Example 4, and after forming a sub-lead-cobalt alloy layer on both surfaces using a lead-cobalt alloy ruthenium solution, the two surfaces were treated with chromium. Then, when the element is formed into a chrome layer, it is rushed with sufficient pure water.

2213-6405-PF(N2); Ahddub.ptd Page 32 1296636 V. Description of invention (29) =, stay in a drying oven with a heater to an ambient temperature of 150 °C for about 4 seconds to remove moisture A surface-treated copper foil 1 f having a blackened surface having a very good hue is obtained. Between the above processes, a pure water cleaning process of about 5 矜 is arranged in principle to prevent penetration of the solution of the pretreatment process. <Physical properties of surface-treated copper foil> The cross-section of the surface-treated copper foil having the blackened surface obtained by the above-mentioned process was observed by a FIB apparatus, and as a result, the section height of the blackened surface was obtained as in the third figure. For ii 5nm: the L value in the Ub chromaticity space of the surface is 29, and the gloss [Gs (6〇m ly) is attached to the test towel of the adhesive tape on the blackened surface, and no powder drop is found. The production of the electromagnetic wave shielding mesh plate of the plasma display device is as follows. As in the first embodiment, the obtained surface-treated steel wave shielding conductive mesh plate is used. As a result, even if there is an anti-recording treatment, the coating is not electromagnetically etched. Will be affected, and there is no erosive existence, quite good (4). J Remnant, can be said to be industrially profitable: there will be no black etching solution for conductive use with surface treatment in the process The invention has the problem of powder detachment of the surface treatment coloration treatment surface with the blackened surface, and can be used as the self-engaged X, and can be made into a high-quality stencil for the plasma display panel. Quality The color mask and to close, when the blackening of the surface of the surface-treated copper foil can be omitted and right blackening process Further, with this blackening treatment:. ^

2213-6405-PF(N2); Ahddub.ptd Page 33 _ 1296636

2213-6405-PF(N2); Ahddub.ptd Page 34 1296636 Brief Description of the Drawings Figs. 1 and 2 show a cross-sectional structural view of a surface-treated copper foil having a blackened surface. Fig. 3 to Fig. 5 are F I B diagrams showing the cross-sectional structure of the surface-treated copper foil having a blackened surface. Fig. 6 to Fig. 9 show various changes in the cross-sectional structure of the surface-treated copper foil having a blackened surface. Figure 10 is a scanning electron micrograph of the roughened copper foil surface. Figure 11 is a scanning electron micrograph of a cobalt sulphate plating layer. Figure 12 is a scanning electron microscope image of the etching test pattern. Fig. 1 3 and Fig. 14 are scanning electron micrographs of the surface of a copper pig forming a cobalt sulfate plating layer without roughening. [Description] 2~ roughening layer; 3~ copper particles; 4~ cobalt sulfate plating layer; 5~ anti-rust treatment layer; 6~chromium treatment layer; 7~ electrolytic copper foil layer; la, lb, lc, ld , le, lf ~ surface treated copper foil.

2213-6405-PF(N2); Ahddub.ptd第35页

Claims (1)

1296636 VI. Patent Application No. 1 · A surface-treated copper foil having a blackened surface on a glossy surface, wherein the blackened surface is disposed on a single surface of the copper foil layer and has a thickness of 200 mg/ni 2 . The 400 mg/ni2 sulfuric acid staggered ore layer has a cross-sectional height of 2 〇〇 nm or less. 7 Dan 1f, wherein, among them, with the chromium portion 2 · The surface treatment copper pig blackening surface described in the first application of the patent scope, the L value of the Lab color space is 27 or more. 3. The surface-treated copper case according to claim 1, wherein the blackened surface includes a rust-preventing layer. 4. If the surface of the anti-pound treatment layer described in item 3 of the patent application scope is an error or sub-alloy. (4) Poor 5 · If the patent application scope The anti-rust treatment layer includes the surface treatment copper enamel layer described by the sub-members. A film layer formed of a rabbit or a lead-lead alloy, and a blackening treatment surface according to the above-mentioned surface-treated copper foil, wherein the blackened surface is formed. The surface of the copper foil or the rolled copper foil is 7. The surface treatment of the milk is light, and the twist [Gs (60.)] is 30 or less. The surface of the surface is treated with copper foil! The coating k method is a process having a blackening treatment b): k square to 'characterized by including the following a) and a) using a non-stirring bath, cobalt cobalt, pH value above 4 · 曰" § / Bu l〇g / l of the sulphuric acid current density of the thunderstone range of cobalt sulfate plating solution, 2A / dm2 or more acid cobalt plating; and d, the shiny surface of the smelting of black sulfur 1296636 VI. Application for patent scope b) Afterwards, it is washed and dried. 8. A method for producing a surface-treated copper foil, which is a method for producing a surface treated copper with a blackened surface, characterized by comprising the following processes a) and b): a) using a mixing bath, including 10 g/ Bu 40 starts with sulphuric acid, and has a pH of 4 〇 or more and a liquid temperature of 3 〇. The following cobalt sulfate plating solution is electrolyzed at a current density of 4 A/dni/ or more to form a black cobalt sulfate plating layer on the shiny side of the copper foil; and b) thereafter, washed with water and dried. A method for producing a surface-treated copper foil, which is a method for producing a surface-treated copper foil having a rust-preventing treatment layer and a blackening treatment layer, which comprises the following processes a) to c): a) using a non-stirred bath 'Using a sulfated cobalt sulfate solution containing 8g/1~1〇g/1 of heptahydrate sulfate and a pH value of 4. 〇 or more, electrolysis at a current density of 2A/dm2 or more, on the shiny side of copper foil Forming a black cobalt sulfate plating layer thereon; b) forming a rustproof treatment layer on both surfaces or a single surface of the copper foil forming the black cobalt sulfate plating layer; and c) thereafter washing and drying. 10. A method for producing a surface-treated copper foil, which is a method for producing a surface-treated copper foil having a blackened layer containing a rust-preventing layer, comprising the following a) to C): a) Using a stirring bath, using a cobalt sulphate heptahydrate containing 1〇g/b 4〇g/1, a pH of 4.0 or more, and a liquid temperature of 3 〇t or less. 1296636 6. Applying for the patent range liquid, electrolysis is performed at a current density of 4 A/dm2 or less, forming a black cobalt sulfate plating layer on the shiny side of the copper foil; b) forming two surfaces of the copper foil of the black sulfuric acid drill plating layer Or forming a rust-preventing treatment layer on a single surface; and c) thereafter, washing with water and drying. A conductive mesh for electromagnetic wave shielding for a plasma display panel, which is formed by the surface-treated copper foil according to claim 1 of the patent application. 1 2. A conductive mesh for electromagnetic wave shielding for a plasma display panel, which is formed by the surface-treated copper foil described in claim 2 of the patent application. 1 3. A conductive mesh for electromagnetic wave shielding for a plasma display panel, which is formed by the surface-treated copper foil described in claim 3 of the patent application. 1 . A conductive mesh for electromagnetic wave shielding for a plasma display panel, which is formed by the surface-treated copper foil described in claim 4 of the patent application. 1 5. A conductive mesh for electromagnetic wave shielding for a plasma display panel, which is formed by the surface-treated copper foil described in claim 5 of the patent application. 1 6. A conductive mesh for electromagnetic wave shielding for a plasma display panel, which is formed by the surface-treated copper foil described in claim 6 of the patent application. 2213-6405-PF(N2); Ahddub.ptd第38页