JP2008166655A - Copper foil for electromagnetic shielding material - Google Patents
Copper foil for electromagnetic shielding material Download PDFInfo
- Publication number
- JP2008166655A JP2008166655A JP2007000405A JP2007000405A JP2008166655A JP 2008166655 A JP2008166655 A JP 2008166655A JP 2007000405 A JP2007000405 A JP 2007000405A JP 2007000405 A JP2007000405 A JP 2007000405A JP 2008166655 A JP2008166655 A JP 2008166655A
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- blackened
- nickel
- shielding material
- blackened surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
Description
本発明は、プラズマディスパレイパネルの前面に設けられる電磁波シールド材に適した、黒色外観を有する銅箔およびその製造方法、ならびに該銅箔を用いた電磁波シールド材に関する。 The present invention relates to a copper foil having a black appearance suitable for an electromagnetic shielding material provided on the front surface of a plasma display panel, a manufacturing method thereof, and an electromagnetic shielding material using the copper foil.
プラズマディスパレイパネルは高周波の放電現象を利用して表示が行なわれるため、前面から強力な電磁波が漏洩し、電子回路の誤動作等の原因となるため、電磁波シールド材を設ける必要があり、透明基材上に銅メッシュを形成したフィルムが一般に用いられている。従来は、黒色化した銅箔の黒色表面を接着剤を介してＰＥＴフィルムに接着させ、エッチングにより銅メッシュを形成することが一般に行なわれてきたが、製造工程の合理化を目的として、黒色表面と反対側の面をＰＥＴフィルムに接着させることも行なわれるようになってきた。また、表示品質の向上を目的として、両面を黒色化した銅箔も用いられるようになってきた。従来の製造工程では、黒色化された表面がＰＥＴフィルムと接着剤によって保護されていたが、これらの製造工程では、黒色化された表面が露出されているため、エッチングによりメッシュを形成する工程において、各種の化学薬品によって表面が侵食され、色相が変化する問題点があった。すなわち、赤みをおびたり、部分的に金属光沢を呈するの外観変化により、プラズマパネルディスプレイの表示品質を劣化させる問題点があった。なお、ここでいう黒色には、完全なる黒色以外に褐色などの濃色であり、一般的に黒色と認識されるような色調を含む。
解決しようとする問題点は、露出された黒色表面の色相変化の防止である。 The problem to be solved is to prevent hue change of the exposed black surface.
本発明は、プラズマディスパレイパネルの前面に設けられる電磁波シールド材の製造に用いる黒色化された表面を有する銅箔であって、黒色化された表面がエッチング工程に用いられる各種薬剤に暴露され、エッチングによる銅製メッシュ形成後の黒色化された表面の反射率の変化が２以下であることを特徴とする銅箔である。本発明の銅箔は、黒色化された表面にニッケル層を有することを特徴とする。さらに、本発明は、前記の銅箔を用いたプラズマディスパレイパネルの前面に設けられる電磁波シールド材である。 The present invention is a copper foil having a blackened surface used for the production of an electromagnetic shielding material provided on the front surface of the plasma display panel, and the blackened surface is exposed to various chemicals used in the etching process, The copper foil is characterized in that the change in reflectance of the blackened surface after forming a copper mesh by etching is 2 or less. The copper foil of the present invention is characterized by having a nickel layer on the blackened surface. Furthermore, this invention is an electromagnetic wave shielding material provided in the front surface of the plasma display panel using the said copper foil.
本発明の銅箔は、露出された、すなわち、ＰＥＴフィルムや接着剤によって被覆されていない黒色化された表面が、エッチングによりメッシュを形成する工程において、各種の化学薬品によって表面が侵食されず、赤みをおびたり、部分的に金属光沢を呈する等の外観変化が小さいことから、プラズマパネルディスプレイの表示品質を劣化させない。 The copper foil of the present invention is exposed, that is, the blackened surface that is not covered by the PET film or adhesive is not eroded by various chemicals in the process of forming a mesh by etching, The display quality of the plasma panel display is not deteriorated because the appearance changes such as redness and partial metallic luster are small.
本発明で用いる銅箔の厚さは特に規定するものではないが、コストやエッチング加工によるメッシュの形状から、厚さ８μｍ〜３５μｍが好ましい。表面粗さについても特に規定するものではないが、表面粗さが大きいと、製造した電磁波シールド材の透明性が低下し、画像品質が低下するおそれがあるので好ましくない。 The thickness of the copper foil used in the present invention is not particularly specified, but a thickness of 8 μm to 35 μm is preferable in view of cost and the shape of the mesh formed by etching. The surface roughness is not particularly specified, but if the surface roughness is large, it is not preferable because the transparency of the produced electromagnetic wave shielding material is lowered and the image quality may be lowered.
銅箔表面を黒色化する方法も、特に限定するものではないが、各種の金属めっきを適宜組み合わせることにより微細構造を形成することが好ましい。このような処理方法としては、例えば、微細な粗化処理を行なった後に、コバルトと亜鉛と銅からなる着色層を形成する方法がある。 The method for blackening the surface of the copper foil is not particularly limited, but it is preferable to form a fine structure by appropriately combining various metal platings. As such a treatment method, for example, there is a method of forming a colored layer made of cobalt, zinc, and copper after performing a fine roughening treatment.
黒色化された表面に、ニッケル層を形成する。ニッケル層は、ニッケルイオンを含有する電解液中で電気めっきすることにより形成することが出来る。ニッケル層の付着量はニッケル換算で０．１〜５ｍｇ／ｄｍ２、好ましくは１．０〜３．０ｍｇ／ｄｍ２である。ニッケルの付着量が０．１ｍｇ／ｄｍ２未満の場合、エッチング後の色相変化が大きく、銅に近い赤味を呈するようになる。一方、付着量が５ｍｇ／ｄｍ２より多いと、明度が高くなり、プラズマディスプレイパネルの表示品質が低下する。なお、電解液には、ニッケルイオンを含有する各種のニッケル塩、たとえば、硫酸ニッケル、塩化ニッケル、炭酸ニッケル、水酸化ニッケル等ニッケルを含むニッケル塩を使用することができる。また、電気抵抗を下げる目的で硫酸ナトリウム等のめっきされない金属塩と、ｐＨを安定化させる目的でクエン酸やホウ酸等の緩衝剤を電解液に加えると、好適である。表面にはさらに防錆効果を向上させる目的でクロメート処理を行なってもよい。なお、ニッケル層には、特性を損なわない範囲で、他の金属を含有してもよい。 A nickel layer is formed on the blackened surface. The nickel layer can be formed by electroplating in an electrolytic solution containing nickel ions. Deposition of nickel layer is 0.1 to 5 mg / dm 2 of nickel in terms of, preferably 1.0 to 3.0 / dm 2. When the adhesion amount of nickel is less than 0.1 mg / dm 2 , the hue change after etching is large, and a redness close to copper is exhibited. On the other hand, when the adhesion amount is more than 5 mg / dm 2 , the brightness is increased and the display quality of the plasma display panel is deteriorated. For the electrolytic solution, various nickel salts containing nickel ions, for example, nickel salts containing nickel such as nickel sulfate, nickel chloride, nickel carbonate, nickel hydroxide and the like can be used. In addition, it is preferable to add an unplated metal salt such as sodium sulfate for the purpose of lowering electric resistance and a buffering agent such as citric acid or boric acid to the electrolyte for the purpose of stabilizing pH. The surface may be subjected to chromate treatment for the purpose of further improving the rust prevention effect. The nickel layer may contain other metals as long as the characteristics are not impaired.
以下に実施例によって本発明を説明する。 The following examples illustrate the invention.
表１に示す組成のめっき液を用いて、電解銅箔（日本電解株式会社製、厚さ１０μｍ、光沢面の中心線平均粗さＲａ＝０．２０μｍ）の光沢面にめっき処理を行い、黒色表面を形成した。さらに、ニッケルめっきとクロメート処理を行なった後、接着剤付ＰＥＴフィルムにラミネートした。ついで、３０℃の１％炭酸水素ナトリウム水溶液に浸漬してレジストを剥離し、水洗した。さらに、４５℃の塩化銅エッチング液に６０秒間浸漬した後、水洗、乾燥した。色彩色差計（コニカミノルタ株式会社製、ＣＲ−２４１型）を用いて色彩色差を測定し、変化を測定した結果を表１に示した。 Using the plating solution having the composition shown in Table 1, plating treatment is performed on a glossy surface of an electrolytic copper foil (manufactured by Nippon Electrolytic Co., Ltd., thickness 10 μm, glossy surface centerline average roughness Ra = 0.20 μm), and black A surface was formed. Further, after nickel plating and chromate treatment, it was laminated on a PET film with an adhesive. Subsequently, the resist was peeled off by immersion in a 1% sodium hydrogen carbonate aqueous solution at 30 ° C. and washed with water. Furthermore, after being immersed in a 45 ° C. copper chloride etching solution for 60 seconds, it was washed with water and dried. Table 1 shows the results of measuring the color difference using a color difference meter (CR-241 type, manufactured by Konica Minolta Co., Ltd.) and measuring the change.
Ａ１〜Ａ９は、表面にニッケル層が形成されているため明度の変化が小さく、２以下であリ、また、赤みや黄色みは見られなかった。一方、ニッケル金属層を形成しないＢ１〜Ｂ３においては、明度の変化が大きく、また、あきらかに赤みを呈していた。一方、ニッケルの付着量の大きいＢ４では、明度の変化は２以下であったが、金属光沢を呈していた。
In A1 to A9, since the nickel layer was formed on the surface, the change in brightness was small, and it was 2 or less, and neither redness nor yellowness was observed. On the other hand, in B1 to B3 in which the nickel metal layer is not formed, the change in brightness is large, and it is clearly reddish. On the other hand, in B4 with a large amount of nickel adhered, the change in brightness was 2 or less, but exhibited a metallic luster.
以上の結果から明らかなように、本発明の銅箔は、露出された、すなわち、ＰＥＴフィルムや接着剤によって被覆されていない黒色化された表面が、エッチングによりメッシュを形成する工程において、各種の化学薬品によって表面が侵食されず、赤みをおびたり、部分的に金属光沢を呈する等の外観変化が小さいことから、プラズマパネルディスプレイの表示品質を劣化させない。 As is clear from the above results, the copper foil of the present invention is exposed to a blackened surface that is not covered with a PET film or an adhesive, in the process of forming a mesh by etching. Since the surface is not eroded by chemicals, and the appearance changes such as redness and partial metallic luster are small, the display quality of the plasma panel display is not deteriorated.
本発明の銅箔は、露出された、すなわち、ＰＥＴフィルムや接着剤によって被覆されていない黒色化された表面が、エッチングによりメッシュを形成する工程において、各種の化学薬品によって表面が侵食されず、赤みをおびたり、部分的に金属光沢を呈する等の外観変化が小さいことから、プラズマパネルディスプレイの表示品質を劣化させない。 The copper foil of the present invention is exposed, that is, the blackened surface that is not covered by the PET film or adhesive is not eroded by various chemicals in the process of forming a mesh by etching, The display quality of the plasma panel display is not deteriorated because the appearance changes such as redness and partial metallic luster are small.
Claims (3)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007000405A JP2008166655A (en) | 2007-01-05 | 2007-01-05 | Copper foil for electromagnetic shielding material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007000405A JP2008166655A (en) | 2007-01-05 | 2007-01-05 | Copper foil for electromagnetic shielding material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2008166655A true JP2008166655A (en) | 2008-07-17 |
Family
ID=39695706
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007000405A Pending JP2008166655A (en) | 2007-01-05 | 2007-01-05 | Copper foil for electromagnetic shielding material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2008166655A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011121801A1 (en) * | 2010-03-30 | 2011-10-06 | Jx日鉱日石金属株式会社 | Composite for electromagnetic shielding |
| CN102964899A (en) * | 2012-11-14 | 2013-03-13 | 马鞍山绿盾防护材料科技有限公司 | Low-reflectivity high-efficiency electromagnetic shielding material |
| US9549471B2 (en) | 2010-07-15 | 2017-01-17 | Jx Nippon Mining & Metals Corporation | Copper foil composite |
| US9955574B2 (en) | 2012-01-13 | 2018-04-24 | Jx Nippon Mining & Metals Corporation | Copper foil composite, formed product and method of producing the same |
| US9981450B2 (en) | 2012-01-13 | 2018-05-29 | Jx Nippon Mining & Metals Corporation | Copper foil composite, formed product and method of producing the same |
| US10178816B2 (en) | 2011-05-13 | 2019-01-08 | Jx Nippon Mining & Metals Corporation | Copper foil composite, copper foil used for the same, formed product and method of producing the same |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0794871A (en) * | 1993-09-27 | 1995-04-07 | Hitachi Chem Co Ltd | Manufacture of multilayered wiring board |
| JP2006278881A (en) * | 2005-03-30 | 2006-10-12 | Furukawa Circuit Foil Kk | Copper foil for shielding electromagnetic wave and electromagnetic wave shielding body produced thereby |
-
2007
- 2007-01-05 JP JP2007000405A patent/JP2008166655A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0794871A (en) * | 1993-09-27 | 1995-04-07 | Hitachi Chem Co Ltd | Manufacture of multilayered wiring board |
| JP2006278881A (en) * | 2005-03-30 | 2006-10-12 | Furukawa Circuit Foil Kk | Copper foil for shielding electromagnetic wave and electromagnetic wave shielding body produced thereby |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011121801A1 (en) * | 2010-03-30 | 2011-10-06 | Jx日鉱日石金属株式会社 | Composite for electromagnetic shielding |
| JP5000792B2 (en) * | 2010-03-30 | 2012-08-15 | Ｊｘ日鉱日石金属株式会社 | Electromagnetic wave shielding composite |
| KR101363183B1 (en) | 2010-03-30 | 2014-02-13 | 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 | Composite for electromagnetic shielding |
| US9549471B2 (en) | 2010-07-15 | 2017-01-17 | Jx Nippon Mining & Metals Corporation | Copper foil composite |
| US10178816B2 (en) | 2011-05-13 | 2019-01-08 | Jx Nippon Mining & Metals Corporation | Copper foil composite, copper foil used for the same, formed product and method of producing the same |
| US9955574B2 (en) | 2012-01-13 | 2018-04-24 | Jx Nippon Mining & Metals Corporation | Copper foil composite, formed product and method of producing the same |
| US9981450B2 (en) | 2012-01-13 | 2018-05-29 | Jx Nippon Mining & Metals Corporation | Copper foil composite, formed product and method of producing the same |
| CN102964899A (en) * | 2012-11-14 | 2013-03-13 | 马鞍山绿盾防护材料科技有限公司 | Low-reflectivity high-efficiency electromagnetic shielding material |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9078353B2 (en) | Copper foil structure having blackened ultra-thin foil and manufacturing method thereof | |
| JP2007332418A (en) | Surface treated copper foil | |
| SG183311A1 (en) | Copper foil for printed circuit | |
| TW201002165A (en) | Copper foil for printed circuit board and copper clad laminate plate for printed circuit board | |
| WO2006001594A1 (en) | Method for manufacturing black surface- treated copper foil for emi shield and copper foil the same and the composite material using it | |
| JPH0529740A (en) | Electrolytic copper foil for printed circuit board | |
| WO2005083157A1 (en) | Surface-treated copper foil having grayed surface, process for producing the same and electromagnetic wave shielding conductive mesh for front panel of plasma display wherein use is made of the surface-treated copper foil | |
| JP2008166655A (en) | Copper foil for electromagnetic shielding material | |
| JP5441945B2 (en) | An extremely thin copper foil using a very low profile copper foil as a carrier and a method for producing the same. | |
| TWI462662B (en) | Composite double-side blackening foil and manufacturing method thereof | |
| JP2003201597A (en) | Copper foil, production method therefor and electromagnetic wave shield body obtained by using the copper foil | |
| JP2010201804A (en) | Composite metal foil, method for producing the same, and printed wiring board | |
| JP4326019B2 (en) | Method for producing blackened surface-treated copper foil for electromagnetic wave shielding | |
| JP2007009261A (en) | Copper foil for printed circuit board, and its manufacturing method | |
| JP4941204B2 (en) | Copper foil for printed wiring board and surface treatment method thereof | |
| JP2004256832A (en) | Surface treated copper foil provided with blackening treated face, and magnetic shielding conductive mesh for front panel of plasma display obtained by using the surface treated copper foil | |
| WO2005064044A1 (en) | Bronzing-surface-treated copper foil, process for producing the same, and electromagnetic wave shielding conductive mesh for front panel of plasma display utilizing the bronzing-surface-treated copper foil | |
| JP2008270659A (en) | Method of manufacturing blackened shield mesh for plasma display front plate | |
| KR20130082320A (en) | Copper foil attached to carrier foil, a method for preparing the same and printed circuit board using the same | |
| JP2008184657A (en) | Surface treated copper foil and method of manufacturing the same | |
| JP5728117B1 (en) | Surface-treated copper foil, method for producing the surface-treated copper foil, and copper-clad laminate using the surface-treated copper foil | |
| JP3869433B2 (en) | Method for producing blackened surface-treated copper foil for electromagnetic wave shielding | |
| JP2009021342A (en) | Manufacturing method of blackened shield mesh for plasma display front plate | |
| JP2009231426A (en) | Manufacturing method of blackened shield mesh for plasma display front substrate, blackened shield mesh for plasma display front substrate, and plasma display panel | |
| JP2005139546A (en) | Blacking surface-treated copper foil, process for producing the blackening surface-treated copper foil and, using the blacking surface-treated copper foil, electromagnetic wave shielding conductive mesh |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Effective date: 20091119 Free format text: JAPANESE INTERMEDIATE CODE: A621 |
|
| RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20091119 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20110715 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20110726 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20111213 |