JPS5585689A - Black color plating bath - Google Patents
Black color plating bathInfo
- Publication number
- JPS5585689A JPS5585689A JP16217278A JP16217278A JPS5585689A JP S5585689 A JPS5585689 A JP S5585689A JP 16217278 A JP16217278 A JP 16217278A JP 16217278 A JP16217278 A JP 16217278A JP S5585689 A JPS5585689 A JP S5585689A
- Authority
- JP
- Japan
- Prior art keywords
- plating bath
- black color
- alloys
- amino acids
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To form a black plating layer having a superior appearance, adhesive and chemical resisting properties, by adding amino acids containing sulfur in plating bath at the time of electroplating the surface of metal base material with Ni, Co or these alloys.
CONSTITUTION: Firm black plating layer excellent in color tone and luster, is formed on the surface of metal base material, by carrying out electroplating adding amino acids containing sulfur, such as methionine, cystine or glutathione etc., in plating bath of Ni, Co or these alloys. Accordingly, this method is able to substitute for chromium plating bath having many troubles in draining treatment.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16217278A JPS5585689A (en) | 1978-12-25 | 1978-12-25 | Black color plating bath |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16217278A JPS5585689A (en) | 1978-12-25 | 1978-12-25 | Black color plating bath |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5585689A true JPS5585689A (en) | 1980-06-27 |
Family
ID=15749380
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16217278A Pending JPS5585689A (en) | 1978-12-25 | 1978-12-25 | Black color plating bath |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5585689A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005010241A1 (en) * | 2003-07-28 | 2005-02-03 | Mitsui Mining & Smelting Co.,Ltd. | Surface-treated copper foil having blackening-treated surface, process for producing the surface-treated copper foil and, using the surface-treated copper foil, electromagnetic wave shielding conductive mesh for front panel of plasma display |
JP2005248221A (en) * | 2004-03-02 | 2005-09-15 | Mitsui Mining & Smelting Co Ltd | Surface-treated copper foil having grayish-treated surface, method for manufacturing the copper foil, and electromagnetic wave shielding conductive mesh for front panel of plasma display using the copper foil |
CN104032337A (en) * | 2013-03-07 | 2014-09-10 | 罗门哈斯电子材料有限公司 | Tin alloy plating solution |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5562188A (en) * | 1978-06-19 | 1980-05-10 | Oosakashi | Bright black nickel electroplating bath |
-
1978
- 1978-12-25 JP JP16217278A patent/JPS5585689A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5562188A (en) * | 1978-06-19 | 1980-05-10 | Oosakashi | Bright black nickel electroplating bath |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005010241A1 (en) * | 2003-07-28 | 2005-02-03 | Mitsui Mining & Smelting Co.,Ltd. | Surface-treated copper foil having blackening-treated surface, process for producing the surface-treated copper foil and, using the surface-treated copper foil, electromagnetic wave shielding conductive mesh for front panel of plasma display |
JP2005139544A (en) * | 2003-07-28 | 2005-06-02 | Mitsui Mining & Smelting Co Ltd | Surface-treated copper foil having blackening-treated surface, process for producing the surface-treated copper foil and, using the surface-treated copper foil, electromagnetic wave shielding conductive mesh for front panel of plasma display |
JP2005248221A (en) * | 2004-03-02 | 2005-09-15 | Mitsui Mining & Smelting Co Ltd | Surface-treated copper foil having grayish-treated surface, method for manufacturing the copper foil, and electromagnetic wave shielding conductive mesh for front panel of plasma display using the copper foil |
CN104032337A (en) * | 2013-03-07 | 2014-09-10 | 罗门哈斯电子材料有限公司 | Tin alloy plating solution |
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