JPS5585689A - Black color plating bath - Google Patents

Black color plating bath

Info

Publication number
JPS5585689A
JPS5585689A JP16217278A JP16217278A JPS5585689A JP S5585689 A JPS5585689 A JP S5585689A JP 16217278 A JP16217278 A JP 16217278A JP 16217278 A JP16217278 A JP 16217278A JP S5585689 A JPS5585689 A JP S5585689A
Authority
JP
Japan
Prior art keywords
plating bath
black color
alloys
amino acids
base material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16217278A
Other languages
Japanese (ja)
Inventor
Kiyomi Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Instruments Inc
Original Assignee
Seiko Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Instruments Inc filed Critical Seiko Instruments Inc
Priority to JP16217278A priority Critical patent/JPS5585689A/en
Publication of JPS5585689A publication Critical patent/JPS5585689A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To form a black plating layer having a superior appearance, adhesive and chemical resisting properties, by adding amino acids containing sulfur in plating bath at the time of electroplating the surface of metal base material with Ni, Co or these alloys.
CONSTITUTION: Firm black plating layer excellent in color tone and luster, is formed on the surface of metal base material, by carrying out electroplating adding amino acids containing sulfur, such as methionine, cystine or glutathione etc., in plating bath of Ni, Co or these alloys. Accordingly, this method is able to substitute for chromium plating bath having many troubles in draining treatment.
COPYRIGHT: (C)1980,JPO&Japio
JP16217278A 1978-12-25 1978-12-25 Black color plating bath Pending JPS5585689A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16217278A JPS5585689A (en) 1978-12-25 1978-12-25 Black color plating bath

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16217278A JPS5585689A (en) 1978-12-25 1978-12-25 Black color plating bath

Publications (1)

Publication Number Publication Date
JPS5585689A true JPS5585689A (en) 1980-06-27

Family

ID=15749380

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16217278A Pending JPS5585689A (en) 1978-12-25 1978-12-25 Black color plating bath

Country Status (1)

Country Link
JP (1) JPS5585689A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005010241A1 (en) * 2003-07-28 2005-02-03 Mitsui Mining & Smelting Co.,Ltd. Surface-treated copper foil having blackening-treated surface, process for producing the surface-treated copper foil and, using the surface-treated copper foil, electromagnetic wave shielding conductive mesh for front panel of plasma display
JP2005248221A (en) * 2004-03-02 2005-09-15 Mitsui Mining & Smelting Co Ltd Surface-treated copper foil having grayish-treated surface, method for manufacturing the copper foil, and electromagnetic wave shielding conductive mesh for front panel of plasma display using the copper foil
CN104032337A (en) * 2013-03-07 2014-09-10 罗门哈斯电子材料有限公司 Tin alloy plating solution

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5562188A (en) * 1978-06-19 1980-05-10 Oosakashi Bright black nickel electroplating bath

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5562188A (en) * 1978-06-19 1980-05-10 Oosakashi Bright black nickel electroplating bath

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005010241A1 (en) * 2003-07-28 2005-02-03 Mitsui Mining & Smelting Co.,Ltd. Surface-treated copper foil having blackening-treated surface, process for producing the surface-treated copper foil and, using the surface-treated copper foil, electromagnetic wave shielding conductive mesh for front panel of plasma display
JP2005139544A (en) * 2003-07-28 2005-06-02 Mitsui Mining & Smelting Co Ltd Surface-treated copper foil having blackening-treated surface, process for producing the surface-treated copper foil and, using the surface-treated copper foil, electromagnetic wave shielding conductive mesh for front panel of plasma display
JP2005248221A (en) * 2004-03-02 2005-09-15 Mitsui Mining & Smelting Co Ltd Surface-treated copper foil having grayish-treated surface, method for manufacturing the copper foil, and electromagnetic wave shielding conductive mesh for front panel of plasma display using the copper foil
CN104032337A (en) * 2013-03-07 2014-09-10 罗门哈斯电子材料有限公司 Tin alloy plating solution

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