CN1701137B - 具有黑色化处理面的表面处面铜箔、及其制造方法及用该表面处面铜箔的等离子体显示器的前面板用电磁波屏蔽导电丝网 - Google Patents
具有黑色化处理面的表面处面铜箔、及其制造方法及用该表面处面铜箔的等离子体显示器的前面板用电磁波屏蔽导电丝网 Download PDFInfo
- Publication number
- CN1701137B CN1701137B CN2004800010169A CN200480001016A CN1701137B CN 1701137 B CN1701137 B CN 1701137B CN 2004800010169 A CN2004800010169 A CN 2004800010169A CN 200480001016 A CN200480001016 A CN 200480001016A CN 1701137 B CN1701137 B CN 1701137B
- Authority
- CN
- China
- Prior art keywords
- copper foil
- surface treatment
- black
- treated side
- rose vitriol
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 257
- 239000011889 copper foil Substances 0.000 title claims abstract description 232
- 238000000034 method Methods 0.000 title claims abstract description 108
- QUQFTIVBFKLPCL-UHFFFAOYSA-L copper;2-amino-3-[(2-amino-2-carboxylatoethyl)disulfanyl]propanoate Chemical compound [Cu+2].[O-]C(=O)C(N)CSSCC(N)C([O-])=O QUQFTIVBFKLPCL-UHFFFAOYSA-L 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 claims abstract description 78
- 238000005868 electrolysis reaction Methods 0.000 claims abstract description 26
- 238000001035 drying Methods 0.000 claims abstract description 21
- 238000007747 plating Methods 0.000 claims abstract description 20
- 229910000361 cobalt sulfate Inorganic materials 0.000 claims abstract description 4
- 229940044175 cobalt sulfate Drugs 0.000 claims abstract description 4
- KTVIXTQDYHMGHF-UHFFFAOYSA-L cobalt(2+) sulfate Chemical compound [Co+2].[O-]S([O-])(=O)=O KTVIXTQDYHMGHF-UHFFFAOYSA-L 0.000 claims abstract description 4
- 238000004381 surface treatment Methods 0.000 claims description 143
- 241000220317 Rosa Species 0.000 claims description 106
- 239000011248 coating agent Substances 0.000 claims description 84
- 238000000576 coating method Methods 0.000 claims description 84
- 238000012545 processing Methods 0.000 claims description 76
- 239000007788 liquid Substances 0.000 claims description 48
- 238000010586 diagram Methods 0.000 claims description 23
- 238000003756 stirring Methods 0.000 claims description 18
- 150000003839 salts Chemical class 0.000 claims description 9
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 8
- 239000011701 zinc Substances 0.000 claims description 8
- 229910052725 zinc Inorganic materials 0.000 claims description 8
- 229910001297 Zn alloy Inorganic materials 0.000 claims description 4
- 238000005530 etching Methods 0.000 abstract description 74
- 238000005406 washing Methods 0.000 abstract description 34
- 229910017052 cobalt Inorganic materials 0.000 abstract description 25
- 239000010941 cobalt Substances 0.000 abstract description 25
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 abstract description 25
- 229910052802 copper Inorganic materials 0.000 abstract description 24
- 239000010949 copper Substances 0.000 abstract description 24
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 21
- DAYYOITXWWUZCV-UHFFFAOYSA-L cobalt(2+);sulfate;hexahydrate Chemical compound O.O.O.O.O.O.[Co+2].[O-]S([O-])(=O)=O DAYYOITXWWUZCV-UHFFFAOYSA-L 0.000 abstract 1
- 230000001747 exhibiting effect Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 111
- 239000000243 solution Substances 0.000 description 43
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 20
- HSSJULAPNNGXFW-UHFFFAOYSA-N [Co].[Zn] Chemical compound [Co].[Zn] HSSJULAPNNGXFW-UHFFFAOYSA-N 0.000 description 19
- 230000015572 biosynthetic process Effects 0.000 description 18
- 239000000843 powder Substances 0.000 description 18
- 229910000531 Co alloy Inorganic materials 0.000 description 17
- 238000009713 electroplating Methods 0.000 description 16
- 229910000990 Ni alloy Inorganic materials 0.000 description 15
- QELJHCBNGDEXLD-UHFFFAOYSA-N nickel zinc Chemical compound [Ni].[Zn] QELJHCBNGDEXLD-UHFFFAOYSA-N 0.000 description 15
- 238000012360 testing method Methods 0.000 description 14
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 description 13
- 239000002390 adhesive tape Substances 0.000 description 11
- 239000007921 spray Substances 0.000 description 10
- 238000007788 roughening Methods 0.000 description 9
- 230000003278 mimic effect Effects 0.000 description 8
- 229910001429 cobalt ion Inorganic materials 0.000 description 7
- XLJKHNWPARRRJB-UHFFFAOYSA-N cobalt(2+) Chemical compound [Co+2] XLJKHNWPARRRJB-UHFFFAOYSA-N 0.000 description 7
- RFYUQSQGLHNNOY-UHFFFAOYSA-N cobalt;sulfuric acid Chemical compound [Co].OS(O)(=O)=O RFYUQSQGLHNNOY-UHFFFAOYSA-N 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 229910021645 metal ion Inorganic materials 0.000 description 5
- 238000001000 micrograph Methods 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 241000784732 Lycaena phlaeas Species 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 238000010790 dilution Methods 0.000 description 4
- 239000012895 dilution Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000003112 inhibitor Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- RYCLIXPGLDDLTM-UHFFFAOYSA-J tetrapotassium;phosphonato phosphate Chemical compound [K+].[K+].[K+].[K+].[O-]P([O-])(=O)OP([O-])([O-])=O RYCLIXPGLDDLTM-UHFFFAOYSA-J 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- OMSYGYSPFZQFFP-UHFFFAOYSA-J zinc pyrophosphate Chemical compound [Zn+2].[Zn+2].[O-]P([O-])(=O)OP([O-])([O-])=O OMSYGYSPFZQFFP-UHFFFAOYSA-J 0.000 description 4
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 3
- 238000006424 Flood reaction Methods 0.000 description 3
- 208000003351 Melanosis Diseases 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 238000012797 qualification Methods 0.000 description 3
- 238000004088 simulation Methods 0.000 description 3
- 230000003746 surface roughness Effects 0.000 description 3
- MTRFEWTWIPAXLG-UHFFFAOYSA-N 9-phenylacridine Chemical compound C1=CC=CC=C1C1=C(C=CC=C2)C2=NC2=CC=CC=C12 MTRFEWTWIPAXLG-UHFFFAOYSA-N 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 2
- 241000555268 Dendroides Species 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 2
- 238000003287 bathing Methods 0.000 description 2
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 2
- 239000012964 benzotriazole Substances 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 2
- 229910000365 copper sulfate Inorganic materials 0.000 description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 2
- 229960004643 cupric oxide Drugs 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000004070 electrodeposition Methods 0.000 description 2
- 239000012467 final product Substances 0.000 description 2
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 2
- 150000002460 imidazoles Chemical class 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 150000002815 nickel Chemical class 0.000 description 2
- HIRWGWMTAVZIPF-UHFFFAOYSA-N nickel;sulfuric acid Chemical compound [Ni].OS(O)(=O)=O HIRWGWMTAVZIPF-UHFFFAOYSA-N 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000004321 preservation Methods 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 239000011593 sulfur Substances 0.000 description 2
- 229910052717 sulfur Inorganic materials 0.000 description 2
- 229910000563 Arsenical copper Inorganic materials 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 229910021503 Cobalt(II) hydroxide Inorganic materials 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- 241000446313 Lamella Species 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- ASKVAEGIVYSGNY-UHFFFAOYSA-L cobalt(ii) hydroxide Chemical compound [OH-].[OH-].[Co+2] ASKVAEGIVYSGNY-UHFFFAOYSA-L 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- XEMZLVDIUVCKGL-UHFFFAOYSA-N hydrogen peroxide;sulfuric acid Chemical compound OO.OS(O)(=O)=O XEMZLVDIUVCKGL-UHFFFAOYSA-N 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- LVIYYTJTOKJJOC-UHFFFAOYSA-N nickel phthalocyanine Chemical compound [Ni+2].C12=CC=CC=C2C(N=C2[N-]C(C3=CC=CC=C32)=N2)=NC1=NC([C]1C=CC=CC1=1)=NC=1N=C1[C]3C=CC=CC3=C2[N-]1 LVIYYTJTOKJJOC-UHFFFAOYSA-N 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000010183 spectrum analysis Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0094—Shielding materials being light-transmitting, e.g. transparent, translucent
- H05K9/0096—Shielding materials being light-transmitting, e.g. transparent, translucent for television displays, e.g. plasma display panel
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/38—Chromatising
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Electromagnetism (AREA)
- Electroplating Methods And Accessories (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Laminated Bodies (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003281288 | 2003-07-28 | ||
| JP281288/2003 | 2003-07-28 | ||
| JP2003353198 | 2003-10-14 | ||
| JP353198/2003 | 2003-10-14 | ||
| JP027706/2004 | 2004-02-04 | ||
| JP2004027706A JP4458519B2 (ja) | 2003-07-28 | 2004-02-04 | 黒色化処理面を備える表面処理銅箔、その表面処理銅箔の製造方法及びその表面処理銅箔を用いたプラズマディスプレイの前面パネル用の電磁波遮蔽導電性メッシュ |
| PCT/JP2004/010100 WO2005010241A1 (ja) | 2003-07-28 | 2004-07-15 | 黒色化処理面を備える表面処理銅箔、その表面処理銅箔の製造方法及びその表面処理銅箔を用いたプラズマディスプレイの前面パネル用の電磁波遮蔽導電性メッシュ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1701137A CN1701137A (zh) | 2005-11-23 |
| CN1701137B true CN1701137B (zh) | 2010-04-21 |
Family
ID=34108578
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2004800010169A Expired - Fee Related CN1701137B (zh) | 2003-07-28 | 2004-07-15 | 具有黑色化处理面的表面处面铜箔、及其制造方法及用该表面处面铜箔的等离子体显示器的前面板用电磁波屏蔽导电丝网 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP4458519B2 (ko) |
| KR (1) | KR100686789B1 (ko) |
| CN (1) | CN1701137B (ko) |
| TW (1) | TW200504148A (ko) |
| WO (1) | WO2005010241A1 (ko) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4575719B2 (ja) * | 2003-11-13 | 2010-11-04 | 三井金属鉱業株式会社 | 茶褐色化処理面を備える表面処理銅箔、その表面処理銅箔の製造方法及びその表面処理銅箔を用いたプラズマディスプレイの前面パネル用の電磁波遮蔽導電性メッシュ |
| TW200718347A (en) * | 2005-07-14 | 2007-05-01 | Mitsui Mining & Smelting Co | Blackening surface treated copper foil and electromagnetic wave shielding conductive mesh for front panel of plasma display using the blackening surface treated copper foil |
| JP2009021412A (ja) * | 2007-07-12 | 2009-01-29 | Hitachi Chem Co Ltd | 表面黒化銅金属の製造法、導体層パターン付き基材の製造法、導体層パターン付き基材及びそれを用いた電磁波遮蔽部材 |
| TWI466779B (zh) | 2006-12-27 | 2015-01-01 | Hitachi Chemical Co Ltd | Gravure and use of its substrate with a conductive layer pattern |
| JP2009152285A (ja) * | 2007-12-19 | 2009-07-09 | Hitachi Chem Co Ltd | 金属パターン及び導体層パターン付き基材の製造法、導体層パターン付き基材並びにそれを用いた電磁波遮蔽部材 |
| JP2009158842A (ja) * | 2007-12-27 | 2009-07-16 | Hitachi Chem Co Ltd | 表面黒化銅金属の製造法、導体層パターン付き基材の製造法、導体層パターン付き基材及びそれを用いた電磁波遮蔽部材 |
| CN101906630B (zh) * | 2010-08-03 | 2011-08-10 | 山东金宝电子股份有限公司 | 电解铜箔的黑色表面处理工艺 |
| CN102660695B (zh) * | 2012-04-17 | 2015-07-29 | 重庆材料研究院 | 一种铜丝及其制备屏蔽铜网的方法 |
| JP7476791B2 (ja) | 2018-03-09 | 2024-05-01 | 大日本印刷株式会社 | 導電性フィルム、センサー、タッチパネル、および画像表示装置 |
| CN109680307A (zh) * | 2019-01-21 | 2019-04-26 | 苏州宝士杰塑料科技有限公司 | 一种装饰性单盐无镍枪色电镀工艺 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003201597A (ja) * | 2002-01-09 | 2003-07-18 | Nippon Denkai Kk | 銅箔とその製造方法及び該銅箔を用いた電磁波シールド体 |
| CN1525492A (zh) * | 2003-02-27 | 2004-09-01 | �źӵ�·ͭ����ʽ���� | 电磁波屏蔽用铜箔及其制造方法及电磁波屏蔽体 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5585689A (en) * | 1978-12-25 | 1980-06-27 | Seiko Instr & Electronics Ltd | Black color plating bath |
| JPS6191385A (ja) * | 1984-10-12 | 1986-05-09 | Nippon Kagaku Sangyo Kk | 黒色電気鍍金浴 |
| JPH0654831B2 (ja) * | 1990-08-14 | 1994-07-20 | 株式会社ジャパンエナジー | 印刷回路用銅箔の処理方法 |
| JP2717910B2 (ja) * | 1992-11-19 | 1998-02-25 | 日鉱グールド・フォイル株式会社 | 印刷回路用銅箔及びその製造方法 |
| US6224991B1 (en) * | 1999-09-13 | 2001-05-01 | Yates Foil Usa, Inc. | Process for electrodeposition of barrier layer over copper foil bonding treatment, products thereof and electrolyte useful in such process |
| JP3330925B2 (ja) * | 2000-04-05 | 2002-10-07 | 株式会社日鉱マテリアルズ | レーザー穴開け用銅箔 |
| JP3998975B2 (ja) * | 2001-12-28 | 2007-10-31 | 大日本印刷株式会社 | 電磁波遮蔽用シート |
| JP2004119961A (ja) * | 2002-09-02 | 2004-04-15 | Furukawa Techno Research Kk | チップオンフィルム用、プラズマディスプレイ用、または高周波プリント配線板用銅箔 |
| JP4573254B2 (ja) * | 2002-10-25 | 2010-11-04 | Ｊｘ日鉱日石金属株式会社 | プラズマディスプレーパネル用銅箔及びその製造方法 |
| JP2004162143A (ja) * | 2002-11-15 | 2004-06-10 | Nippon Denkai Kk | プリント配線板用銅箔の製造方法 |
| JP2004172343A (ja) * | 2002-11-20 | 2004-06-17 | Nikko Materials Co Ltd | レーザー穴開け用銅箔及びその製造方法 |
-
2004
- 2004-02-04 JP JP2004027706A patent/JP4458519B2/ja not_active Expired - Fee Related
- 2004-06-28 TW TW093118760A patent/TW200504148A/zh unknown
- 2004-07-15 CN CN2004800010169A patent/CN1701137B/zh not_active Expired - Fee Related
- 2004-07-15 WO PCT/JP2004/010100 patent/WO2005010241A1/ja active Application Filing
- 2004-07-15 KR KR1020057006660A patent/KR100686789B1/ko active IP Right Grant
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003201597A (ja) * | 2002-01-09 | 2003-07-18 | Nippon Denkai Kk | 銅箔とその製造方法及び該銅箔を用いた電磁波シールド体 |
| CN1525492A (zh) * | 2003-02-27 | 2004-09-01 | �źӵ�·ͭ����ʽ���� | 电磁波屏蔽用铜箔及其制造方法及电磁波屏蔽体 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4458519B2 (ja) | 2010-04-28 |
| TW200504148A (en) | 2005-02-01 |
| WO2005010241A1 (ja) | 2005-02-03 |
| KR20050063784A (ko) | 2005-06-28 |
| JP2005139544A (ja) | 2005-06-02 |
| TWI296636B (ko) | 2008-05-11 |
| CN1701137A (zh) | 2005-11-23 |
| KR100686789B1 (ko) | 2007-02-26 |
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