WO2003065470A1 - Encapsulation of organic electronic devices using adsorbent loaded adhesives - Google Patents

Encapsulation of organic electronic devices using adsorbent loaded adhesives Download PDF

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Publication number
WO2003065470A1
WO2003065470A1 PCT/US2002/038144 US0238144W WO03065470A1 WO 2003065470 A1 WO2003065470 A1 WO 2003065470A1 US 0238144 W US0238144 W US 0238144W WO 03065470 A1 WO03065470 A1 WO 03065470A1
Authority
WO
WIPO (PCT)
Prior art keywords
adhesive
adhesives
lid
substrate
organic electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2002/038144
Other languages
English (en)
French (fr)
Inventor
Fred B. Mccormick
Paul F. Baude
Michael A. Haase
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=27610199&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=WO2003065470(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Priority to JP2003564950A priority Critical patent/JP2005516369A/ja
Priority to EP02792308.5A priority patent/EP1470596B1/en
Priority to KR1020047011852A priority patent/KR100986539B1/ko
Publication of WO2003065470A1 publication Critical patent/WO2003065470A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H10W72/07339—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy hardening the adhesive by cooling, e.g. thermoplastics
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/917—Electroluminescent
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/23—Sheet including cover or casing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/23—Sheet including cover or casing
    • Y10T428/239—Complete cover or casing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions

Definitions

  • This invention relates to encapsulated organic electronic devices.
  • Laminating Adhesive 501FL and Optically Clear Laminating Adhesive 8141 both available from 3M Bonding Systems Division, St. Paul, M ⁇ , rubbers such as KRATO ⁇ styrenic block copolymers from Shell Chemicals, Houston, TX, silicones such as RHODOTAK 343 from Rhodia Silicones, Lyon, France, and polyolefins such as poly(l-hexene), poly(l-octene), and poly(4-ethyl-l-octene) described in US 5,112,882; hot melt adhesives such as unloaded versions of the tackified polyamide-polyether copolymers described in U.S. Pat. No.

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
PCT/US2002/038144 2002-01-31 2002-11-26 Encapsulation of organic electronic devices using adsorbent loaded adhesives Ceased WO2003065470A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2003564950A JP2005516369A (ja) 2002-01-31 2002-11-26 吸着剤入り接着剤を使用する有機電子デバイスの封入
EP02792308.5A EP1470596B1 (en) 2002-01-31 2002-11-26 Encapsulation of organic electronic devices using adsorbent loaded adhesives
KR1020047011852A KR100986539B1 (ko) 2002-01-31 2002-11-26 흡착 로드식 접착제를 사용한 유기 전자 장치의 캡슐화

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/061,851 US6936131B2 (en) 2002-01-31 2002-01-31 Encapsulation of organic electronic devices using adsorbent loaded adhesives
US10/061,851 2002-01-31

Publications (1)

Publication Number Publication Date
WO2003065470A1 true WO2003065470A1 (en) 2003-08-07

Family

ID=27610199

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/038144 Ceased WO2003065470A1 (en) 2002-01-31 2002-11-26 Encapsulation of organic electronic devices using adsorbent loaded adhesives

Country Status (6)

Country Link
US (1) US6936131B2 (https=)
EP (1) EP1470596B1 (https=)
JP (1) JP2005516369A (https=)
KR (1) KR100986539B1 (https=)
CN (1) CN1618134A (https=)
WO (1) WO2003065470A1 (https=)

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DE102008062130A1 (de) 2008-12-16 2010-06-17 Tesa Se Verfahren zur Kapselung einer elektronischen Anordnung
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DE102010043866A1 (de) 2010-11-12 2012-05-16 Tesa Se Klebmasse und Verfahren zur Kapselung einer elektronischen Anordnung
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US20030143423A1 (en) 2003-07-31
EP1470596A1 (en) 2004-10-27
KR100986539B1 (ko) 2010-10-07
EP1470596B1 (en) 2016-05-25
US6936131B2 (en) 2005-08-30
CN1618134A (zh) 2005-05-18
JP2005516369A (ja) 2005-06-02

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