JP4776393B2 - 有機el表示装置 - Google Patents
有機el表示装置 Download PDFInfo
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- JP4776393B2 JP4776393B2 JP2006042275A JP2006042275A JP4776393B2 JP 4776393 B2 JP4776393 B2 JP 4776393B2 JP 2006042275 A JP2006042275 A JP 2006042275A JP 2006042275 A JP2006042275 A JP 2006042275A JP 4776393 B2 JP4776393 B2 JP 4776393B2
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- 239000010410 layer Substances 0.000 claims description 148
- 239000000758 substrate Substances 0.000 claims description 48
- 238000007789 sealing Methods 0.000 claims description 35
- 239000012790 adhesive layer Substances 0.000 claims description 24
- 239000003795 chemical substances by application Substances 0.000 claims description 11
- 229910052782 aluminium Inorganic materials 0.000 claims description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 10
- 239000011888 foil Substances 0.000 claims description 10
- 230000002093 peripheral effect Effects 0.000 claims description 10
- 230000004888 barrier function Effects 0.000 claims description 7
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 5
- 239000011575 calcium Substances 0.000 claims description 5
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical group N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 5
- 239000005001 laminate film Substances 0.000 claims description 4
- -1 polyethylene terephthalate Polymers 0.000 claims description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 4
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 4
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical group [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 claims description 3
- 229910052791 calcium Inorganic materials 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 2
- 239000010408 film Substances 0.000 description 30
- 239000002274 desiccant Substances 0.000 description 13
- 101100091498 Arabidopsis thaliana ROS1 gene Proteins 0.000 description 9
- 101150064551 DML1 gene Proteins 0.000 description 9
- 239000007789 gas Substances 0.000 description 9
- 239000010409 thin film Substances 0.000 description 8
- 101100331657 Arabidopsis thaliana DML2 gene Proteins 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 239000011521 glass Substances 0.000 description 6
- 238000010521 absorption reaction Methods 0.000 description 5
- 239000003990 capacitor Substances 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 4
- 101100191136 Arabidopsis thaliana PCMP-A2 gene Proteins 0.000 description 3
- 101100048260 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) UBX2 gene Proteins 0.000 description 3
- 101100489584 Solanum lycopersicum TFT1 gene Proteins 0.000 description 3
- 101100214488 Solanum lycopersicum TFT2 gene Proteins 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000005684 electric field Effects 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 101100422768 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) SUL2 gene Proteins 0.000 description 2
- 229910021536 Zeolite Inorganic materials 0.000 description 2
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical group O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000010457 zeolite Substances 0.000 description 2
- PIYVNGWKHNMMAU-UHFFFAOYSA-N [O].O Chemical compound [O].O PIYVNGWKHNMMAU-UHFFFAOYSA-N 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- 239000003230 hygroscopic agent Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/874—Passivation; Containers; Encapsulations including getter material or desiccant
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Description
前記有機EL層の側面における前記第1防湿層と吸湿層および第2防湿層は、前記有機EL層の上面から前記側面に屈曲し、さらに前記側面から前記絶縁基板の主面と平行に屈曲して、それぞれの屈曲した端部の下面が前記基板の主面に密着していることを特徴とする。
前記第2防湿層と共に、前記第1防湿層と吸湿層が前記接着層により前記基板の主面に固着されていることを特徴とする。
前記第1防湿層が前記第1の接着層で前記基板の主面に固着されていると共に、前記吸湿層と前記第2防湿層が前記第2の接着層により前記基板の主面に固着されていることを特徴とする。
Claims (8)
- 絶縁基板の主面に形成された第1の電極と、該第1の電極の上に形成された多層構造の有機EL層と、該有機EL層の上層に成膜された第2の電極と、該第2の電極を覆って周縁端部が前記絶縁基板の周縁部に封着された封止部材を有し、
前記有機EL層の上面および側面を覆って、第1防湿層と吸湿層および第2防湿層をこの順で積層された耐湿構造体を備え、
前記第1防湿層と前記第2防湿層の少なくとも一方がアルミニウム箔からなり、
前記第1防湿層と吸湿層および第2防湿層は、前記有機EL層の上面から前記側面に屈曲し、さらに前記側面から前記絶縁基板の主面と平行に屈曲して、前記側面から屈曲した端部の下面が前記基板の主面に密着し、
前記アルミニウム箔からなる防湿層が接着層により前記基板に固着されていることを特徴とする有機EL表示装置。 - 請求項1に記載の有機EL表示装置において、
前記吸湿層と前記第2防湿層の間に接着層を有し、
前記第2防湿層と共に、前記第1防湿層と吸湿層が前記接着層により前記基板の主面に固着されていることを特徴とする有機EL表示装置。 - 請求項2に記載の表示装置において、
前記第1防湿層が窒化シリコン、前記吸湿層がカルシウム、前記第2防湿層がアルミニウム箔であることを特徴とする有機EL表示装置。 - 請求項1に記載の有機EL表示装置において、
前記有機EL層と前記第1防湿層の間に第1の接着層を有し、前記第1の防湿層と前記吸湿層の間に第2の接着層を有し、
前記第1防湿層が前記第1の接着層で前記基板の主面に固着されていると共に、前記吸湿層と前記第2防湿層が前記第2の接着層により前記基板の主面に固着されていることを特徴とする有機EL表示装置。 - 請求項4に記載の表示装置において、
前記第1防湿層と前記第2防湿層がアルミニウム箔であることを特徴とする有機EL表示装置。 - 請求項2乃至5の何れかに記載の表示装置において、
前記封止部材がポリエチレンテレフタレートのラミネートフィルムであることを特徴とする有機EL表示装置。 - 請求項2乃至6の何れかに記載の有機EL表示装置において、
前記封止部材の周縁と前記絶縁基板の封着領域にコーキング剤が塗布されていることを特徴とする有機EL表示装置。 - 請求項7に記載の有機EL表示装置において、
コーキング剤がシリコン系防水コーキング剤であることを特徴とする有機EL表示装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006042275A JP4776393B2 (ja) | 2006-02-20 | 2006-02-20 | 有機el表示装置 |
TW096105328A TWI363576B (en) | 2006-02-20 | 2007-02-13 | Organic electroluminescent display deive |
KR1020070017112A KR100883484B1 (ko) | 2006-02-20 | 2007-02-20 | 유기 el 표시 장치 |
US11/676,615 US7898174B2 (en) | 2006-02-20 | 2007-02-20 | Organic electroluminescent display device with moisture resistant structural body including adhesive layer |
CN2007100858489A CN101026228B (zh) | 2006-02-20 | 2007-02-25 | 有机el显示装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006042275A JP4776393B2 (ja) | 2006-02-20 | 2006-02-20 | 有機el表示装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007220593A JP2007220593A (ja) | 2007-08-30 |
JP4776393B2 true JP4776393B2 (ja) | 2011-09-21 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006042275A Active JP4776393B2 (ja) | 2006-02-20 | 2006-02-20 | 有機el表示装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7898174B2 (ja) |
JP (1) | JP4776393B2 (ja) |
KR (1) | KR100883484B1 (ja) |
CN (1) | CN101026228B (ja) |
TW (1) | TWI363576B (ja) |
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2007
- 2007-02-13 TW TW096105328A patent/TWI363576B/zh active
- 2007-02-20 US US11/676,615 patent/US7898174B2/en active Active
- 2007-02-20 KR KR1020070017112A patent/KR100883484B1/ko active IP Right Grant
- 2007-02-25 CN CN2007100858489A patent/CN101026228B/zh active Active
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Publication number | Publication date |
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TWI363576B (en) | 2012-05-01 |
US7898174B2 (en) | 2011-03-01 |
JP2007220593A (ja) | 2007-08-30 |
CN101026228A (zh) | 2007-08-29 |
US20070194711A1 (en) | 2007-08-23 |
KR100883484B1 (ko) | 2009-02-16 |
KR20070083213A (ko) | 2007-08-23 |
TW200746884A (en) | 2007-12-16 |
CN101026228B (zh) | 2011-04-06 |
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