CN1618134A - 使用含吸附剂的粘合剂封装有机电子器件 - Google Patents

使用含吸附剂的粘合剂封装有机电子器件 Download PDF

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Publication number
CN1618134A
CN1618134A CNA028276973A CN02827697A CN1618134A CN 1618134 A CN1618134 A CN 1618134A CN A028276973 A CNA028276973 A CN A028276973A CN 02827697 A CN02827697 A CN 02827697A CN 1618134 A CN1618134 A CN 1618134A
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CN
China
Prior art keywords
adhesive
lid
described product
product
organic electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA028276973A
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English (en)
Chinese (zh)
Inventor
F·B·麦克科米克
P·F·宝德
M·A·哈斯
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3M Innovative Properties Co
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3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=27610199&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=CN1618134(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of CN1618134A publication Critical patent/CN1618134A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H10W72/07339—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy hardening the adhesive by cooling, e.g. thermoplastics
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/917—Electroluminescent
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/23—Sheet including cover or casing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/23—Sheet including cover or casing
    • Y10T428/239—Complete cover or casing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
CNA028276973A 2002-01-31 2002-11-26 使用含吸附剂的粘合剂封装有机电子器件 Pending CN1618134A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/061,851 US6936131B2 (en) 2002-01-31 2002-01-31 Encapsulation of organic electronic devices using adsorbent loaded adhesives
US10/061,851 2002-01-31

Publications (1)

Publication Number Publication Date
CN1618134A true CN1618134A (zh) 2005-05-18

Family

ID=27610199

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA028276973A Pending CN1618134A (zh) 2002-01-31 2002-11-26 使用含吸附剂的粘合剂封装有机电子器件

Country Status (6)

Country Link
US (1) US6936131B2 (https=)
EP (1) EP1470596B1 (https=)
JP (1) JP2005516369A (https=)
KR (1) KR100986539B1 (https=)
CN (1) CN1618134A (https=)
WO (1) WO2003065470A1 (https=)

Cited By (26)

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CN101422078B (zh) * 2006-04-12 2011-01-26 Lg化学株式会社 有机发光二极管元件及其制备方法
CN101577289B (zh) * 2008-05-06 2011-06-22 乐金显示有限公司 柔性有机电致发光显示器件及其制造方法
CN102237319A (zh) * 2010-04-23 2011-11-09 三星半导体(中国)研究开发有限公司 封装件
CN102447077A (zh) * 2011-12-27 2012-05-09 福州华映视讯有限公司 有机发光二极管封装结构及其制造方法
CN102447063A (zh) * 2010-09-30 2012-05-09 原子能与替代能源委员会 制造可变形系统以移动包封于其中的物体
CN101771133B (zh) * 2009-01-04 2013-01-23 京东方科技集团股份有限公司 有机电致发光板及其制造方法
CN103165643A (zh) * 2011-12-09 2013-06-19 三星显示有限公司 有机发光二极管显示器及其制造方法
CN103187455A (zh) * 2006-11-01 2013-07-03 普林斯顿大学理事会 用于电子器件或其它制品上的涂层的杂化层
CN103199199A (zh) * 2013-03-05 2013-07-10 京东方科技集团股份有限公司 一种oled器件封装薄膜、制备方法以及oled器件、封装方法
CN103325813A (zh) * 2013-05-24 2013-09-25 京东方科技集团股份有限公司 一种oled显示面板及其封装方法、显示装置
CN103477464A (zh) * 2011-03-17 2013-12-25 造型逻辑有限公司 电子开关器件的封装阵列
CN103872258A (zh) * 2012-12-07 2014-06-18 乐金显示有限公司 有机发光二极管显示装置及其制造方法
CN103956435A (zh) * 2014-04-28 2014-07-30 上海大学 一种有机发光二极管的胶带封装结构
CN104064684A (zh) * 2013-03-21 2014-09-24 海洋王照明科技股份有限公司 有机电致发光器件
CN104167394A (zh) * 2014-07-14 2014-11-26 京东方科技集团股份有限公司 一种电子器件封装用组合物及封装方法和oled显示装置
CN104218176A (zh) * 2013-05-30 2014-12-17 海洋王照明科技股份有限公司 有机电致发光器件
CN104508063A (zh) * 2012-06-29 2015-04-08 德莎欧洲公司 用于封装有机电子组件的胶带
WO2016141704A1 (zh) * 2015-03-06 2016-09-15 京东方科技集团股份有限公司 Oled显示母板、封装系统及其封装方法
CN106206661A (zh) * 2016-08-04 2016-12-07 深圳爱易瑞科技有限公司 柔性有机发光二极管显示面板及装置
CN106229293A (zh) * 2016-08-04 2016-12-14 深圳爱易瑞科技有限公司 柔性有机发光二极管显示装置及面板的制造方法
CN104302032B (zh) * 2013-07-19 2017-04-12 株式会社小糸制作所 有机el 面板以及车辆用灯具
CN107722894A (zh) * 2010-11-02 2018-02-23 Lg化学株式会社 粘合剂
TWI625880B (zh) * 2013-07-30 2018-06-01 三星顯示器有限公司 有機發光顯示設備
CN108281566A (zh) * 2018-01-03 2018-07-13 深圳市华星光电半导体显示技术有限公司 Oled面板及其制作方法
CN109346623A (zh) * 2018-11-14 2019-02-15 信利（惠州）智能显示有限公司 Amoled显示产品封边方法、封边结构及显示产品
CN109903678A (zh) * 2017-12-11 2019-06-18 乐金显示有限公司 显示装置和可卷曲显示系统

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KR100986539B1 (ko) 2010-10-07
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US6936131B2 (en) 2005-08-30
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