WO2003046976A1 - Appareil d'essai d'evaluation de la fiabilite, systeme d'essai d'evaluation de la fiabilite, contacteur et procede d'essai d'evaluation de la fiabilite - Google Patents

Appareil d'essai d'evaluation de la fiabilite, systeme d'essai d'evaluation de la fiabilite, contacteur et procede d'essai d'evaluation de la fiabilite Download PDF

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Publication number
WO2003046976A1
WO2003046976A1 PCT/JP2002/012348 JP0212348W WO03046976A1 WO 2003046976 A1 WO2003046976 A1 WO 2003046976A1 JP 0212348 W JP0212348 W JP 0212348W WO 03046976 A1 WO03046976 A1 WO 03046976A1
Authority
WO
WIPO (PCT)
Prior art keywords
reliability evaluation
wafer
contactor
tester
evaluation test
Prior art date
Application number
PCT/JP2002/012348
Other languages
English (en)
French (fr)
Inventor
Kiyoshi Takekoshi
Hisatomi Hosaka
Junichi Hagihara
Kunihiko Hatsushika
Takamasa Usui
Hisashi Kaneko
Nobuo Hayasaka
Yoshiyuki Ido
Original Assignee
Tokyo Electron Limited
Kabushiki Kaisha Toshiba
Ibiden Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Limited, Kabushiki Kaisha Toshiba, Ibiden Co., Ltd. filed Critical Tokyo Electron Limited
Priority to KR1020047005962A priority Critical patent/KR100600154B1/ko
Priority to DE60226484T priority patent/DE60226484D1/de
Priority to EP02788667A priority patent/EP1455388B1/en
Publication of WO2003046976A1 publication Critical patent/WO2003046976A1/ja
Priority to US10/813,257 priority patent/US7091733B2/en
Priority to US11/179,538 priority patent/US7242206B2/en
Priority to US11/769,432 priority patent/US8456186B2/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2862—Chambers or ovens; Tanks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0491—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets for testing integrated circuits on wafers, e.g. wafer-level test cartridge
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2868—Complete testing stations; systems; procedures; software aspects
    • G01R31/287—Procedures; Software aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Environmental & Geological Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Measuring Leads Or Probes (AREA)
PCT/JP2002/012348 2001-11-30 2002-11-27 Appareil d'essai d'evaluation de la fiabilite, systeme d'essai d'evaluation de la fiabilite, contacteur et procede d'essai d'evaluation de la fiabilite WO2003046976A1 (fr)

Priority Applications (6)

Application Number Priority Date Filing Date Title
KR1020047005962A KR100600154B1 (ko) 2001-11-30 2002-11-27 신뢰성 평가 시험 장치, 신뢰성 평가 시험 시스템, 및 신뢰성 평가 시험 방법
DE60226484T DE60226484D1 (de) 2001-11-30 2002-11-27 System und verfahren zur zuverlässigkeitsbewertung
EP02788667A EP1455388B1 (en) 2001-11-30 2002-11-27 System and method for reliability evaluation
US10/813,257 US7091733B2 (en) 2001-11-30 2004-03-31 Reliability evaluation test apparatus, reliability evaluation test system, contactor, and reliability evaluation test method
US11/179,538 US7242206B2 (en) 2001-11-30 2005-07-13 Reliability evaluation test apparatus, reliability evaluation test system, contactor, and reliability evaluation test method
US11/769,432 US8456186B2 (en) 2001-11-30 2007-06-27 Reliability evaluation test apparatus, reliability evaluation test system, contactor, and reliability evaluation test method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001-367268 2001-11-30
JP2001367268A JP4173306B2 (ja) 2001-11-30 2001-11-30 信頼性評価試験装置、信頼性評価試験システム及び信頼性評価試験方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US10/813,257 Continuation US7091733B2 (en) 2001-11-30 2004-03-31 Reliability evaluation test apparatus, reliability evaluation test system, contactor, and reliability evaluation test method

Publications (1)

Publication Number Publication Date
WO2003046976A1 true WO2003046976A1 (fr) 2003-06-05

Family

ID=19177043

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2002/012348 WO2003046976A1 (fr) 2001-11-30 2002-11-27 Appareil d'essai d'evaluation de la fiabilite, systeme d'essai d'evaluation de la fiabilite, contacteur et procede d'essai d'evaluation de la fiabilite

Country Status (9)

Country Link
US (3) US7091733B2 (ja)
EP (2) EP1455388B1 (ja)
JP (1) JP4173306B2 (ja)
KR (2) KR100600154B1 (ja)
CN (2) CN101126768B (ja)
DE (1) DE60226484D1 (ja)
SG (2) SG159379A1 (ja)
TW (1) TWI298917B (ja)
WO (1) WO2003046976A1 (ja)

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CN105629105A (zh) * 2015-12-25 2016-06-01 工业和信息化部电子第五研究所 静电换能器可靠性试验方法和系统

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US8456186B2 (en) 2013-06-04
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DE60226484D1 (de) 2008-06-19
EP1455388A4 (en) 2005-10-19
SG127775A1 (en) 2006-12-29
SG159379A1 (en) 2010-03-30
KR100600154B1 (ko) 2006-07-12
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EP1696479A1 (en) 2006-08-30
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US20050253575A1 (en) 2005-11-17
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US20040183561A1 (en) 2004-09-23
EP1455388B1 (en) 2008-05-07
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JP2003168709A (ja) 2003-06-13
US7091733B2 (en) 2006-08-15
EP1455388A1 (en) 2004-09-08
KR100682194B1 (ko) 2007-02-12
CN1575514A (zh) 2005-02-02
US7242206B2 (en) 2007-07-10
JP4173306B2 (ja) 2008-10-29
US20080018355A1 (en) 2008-01-24

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