FR2780792B1 - Appareillage de test de puces electroniques - Google Patents
Appareillage de test de puces electroniquesInfo
- Publication number
- FR2780792B1 FR2780792B1 FR9808561A FR9808561A FR2780792B1 FR 2780792 B1 FR2780792 B1 FR 2780792B1 FR 9808561 A FR9808561 A FR 9808561A FR 9808561 A FR9808561 A FR 9808561A FR 2780792 B1 FR2780792 B1 FR 2780792B1
- Authority
- FR
- France
- Prior art keywords
- testing apparatus
- electronic chip
- chip testing
- electronic
- testing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/44—Modifications of instruments for temperature compensation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9808561A FR2780792B1 (fr) | 1998-07-03 | 1998-07-03 | Appareillage de test de puces electroniques |
US09/346,880 US6580282B1 (en) | 1998-07-03 | 1999-07-02 | Machine for testing electronic chips |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9808561A FR2780792B1 (fr) | 1998-07-03 | 1998-07-03 | Appareillage de test de puces electroniques |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2780792A1 FR2780792A1 (fr) | 2000-01-07 |
FR2780792B1 true FR2780792B1 (fr) | 2000-09-22 |
Family
ID=9528254
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9808561A Expired - Fee Related FR2780792B1 (fr) | 1998-07-03 | 1998-07-03 | Appareillage de test de puces electroniques |
Country Status (2)
Country | Link |
---|---|
US (1) | US6580282B1 (fr) |
FR (1) | FR2780792B1 (fr) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6972578B2 (en) | 2001-11-02 | 2005-12-06 | Formfactor, Inc. | Method and system for compensating thermally induced motion of probe cards |
US7071714B2 (en) | 2001-11-02 | 2006-07-04 | Formfactor, Inc. | Method and system for compensating for thermally induced motion of probe cards |
JP4173306B2 (ja) * | 2001-11-30 | 2008-10-29 | 東京エレクトロン株式会社 | 信頼性評価試験装置、信頼性評価試験システム及び信頼性評価試験方法 |
US9577667B2 (en) | 2002-04-23 | 2017-02-21 | Ntt Docomo, Inc. | System and method for arithmetic encoding and decoding |
JP4252532B2 (ja) * | 2002-04-23 | 2009-04-08 | 株式会社エヌ・ティ・ティ・ドコモ | 算術的符号化及び復号のためのシステム及び方法 |
KR100790817B1 (ko) * | 2006-12-06 | 2008-01-03 | 삼성전자주식회사 | 반도체 제조관리 시스템 |
JP5535492B2 (ja) * | 2009-02-12 | 2014-07-02 | ラピスセミコンダクタ株式会社 | 半導体集積回路の検査装置及び半導体集積回路の検査方法 |
JP6031238B2 (ja) * | 2012-03-09 | 2016-11-24 | 東京エレクトロン株式会社 | ウエハ検査用インターフェース及びウエハ検査装置 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3963985A (en) * | 1974-12-12 | 1976-06-15 | International Business Machines Corporation | Probe device having probe heads and method of adjusting distances between probe heads |
US5198752A (en) * | 1987-09-02 | 1993-03-30 | Tokyo Electron Limited | Electric probing-test machine having a cooling system |
US4962355A (en) * | 1988-10-27 | 1990-10-09 | The United States Of America As Represented By The Secretary Of The Army | Thermal test chamber device |
US5124639A (en) * | 1990-11-20 | 1992-06-23 | Motorola, Inc. | Probe card apparatus having a heating element and process for using the same |
US5325052A (en) * | 1990-11-30 | 1994-06-28 | Tokyo Electron Yamanashi Limited | Probe apparatus |
US5321352A (en) * | 1991-08-01 | 1994-06-14 | Tokyo Electron Yamanashi Limited | Probe apparatus and method of alignment for the same |
KR100196195B1 (ko) * | 1991-11-18 | 1999-06-15 | 이노우에 쥰이치 | 프로우브 카드 |
US5479109A (en) * | 1992-06-03 | 1995-12-26 | Trw Inc. | Testing device for integrated circuits on wafer |
JP3066784B2 (ja) * | 1992-12-14 | 2000-07-17 | 東京エレクトロン株式会社 | プローブカード及びその製造方法 |
JPH0792479B2 (ja) * | 1993-03-18 | 1995-10-09 | 東京エレクトロン株式会社 | プローブ装置の平行度調整方法 |
US5510724A (en) * | 1993-05-31 | 1996-04-23 | Tokyo Electron Limited | Probe apparatus and burn-in apparatus |
US5550482A (en) * | 1993-07-20 | 1996-08-27 | Tokyo Electron Kabushiki Kaisha | Probe device |
JPH11145215A (ja) * | 1997-11-11 | 1999-05-28 | Mitsubishi Electric Corp | 半導体検査装置およびその制御方法 |
US6073681A (en) * | 1997-12-31 | 2000-06-13 | Temptronic Corporation | Workpiece chuck |
-
1998
- 1998-07-03 FR FR9808561A patent/FR2780792B1/fr not_active Expired - Fee Related
-
1999
- 1999-07-02 US US09/346,880 patent/US6580282B1/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US6580282B1 (en) | 2003-06-17 |
FR2780792A1 (fr) | 2000-01-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |
Effective date: 20080331 |