TW462103B - Wafer testing device and method - Google Patents

Wafer testing device and method Download PDF

Info

Publication number
TW462103B
TW462103B TW87104656A TW87104656A TW462103B TW 462103 B TW462103 B TW 462103B TW 87104656 A TW87104656 A TW 87104656A TW 87104656 A TW87104656 A TW 87104656A TW 462103 B TW462103 B TW 462103B
Authority
TW
Taiwan
Prior art keywords
test
wafer
burn
present invention
wpc
Prior art date
Application number
TW87104656A
Inventor
Fu-Jia Shiu
Original Assignee
Shiu Fu Jia
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shiu Fu Jia filed Critical Shiu Fu Jia
Priority to TW87104656A priority Critical patent/TW462103B/en
Application granted granted Critical
Publication of TW462103B publication Critical patent/TW462103B/en

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2855Environmental, reliability or burn-in testing
    • G01R31/286External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07307Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2831Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2855Environmental, reliability or burn-in testing
    • G01R31/286External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2862Chambers or ovens; Tanks

Abstract

The present invention discloses a wafer fixing device and its testing method. The present invention includes a wafer probe card (WPC). The WPC can be used to simultaneously test a plurality of chips on a wafer. In addition, the present invention can heat and test the chip speed in the wafer stage without waiting for the chip to be packaged into a product for performing the heating test. The WPC of the present invention produces a probe tip manufactured by wafer manufacturing technique to couple to the wafer under test, and contact points manufactured by printed circuit board technique to couple to the IC tester and/or burn-in system. The WPC also produces the probe tip by mask set same as the one for manufacturing the wafer. The technique disclosed by the present invention can be used in wafer scale screening test and/or burn-in test. Therefore, the present invention can reduce the burn-in test space and replace the conventional burn-in test of packaged product by the wafer burn-in test. In addition, the present invention can use wafer scale test to decrease the load and unload procedures of burn-in test by wafer scale test, thereby reducing the testing cost and packaging cost for those packaged product which can not pass the burn-in test and can not be repaired, and increasing the productivity by repairing the burn-in products.
TW87104656A 1998-03-27 1998-03-27 Wafer testing device and method TW462103B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW87104656A TW462103B (en) 1998-03-27 1998-03-27 Wafer testing device and method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW87104656A TW462103B (en) 1998-03-27 1998-03-27 Wafer testing device and method
US09/275,503 US6265888B1 (en) 1998-03-27 1999-03-24 Wafer probe card

Publications (1)

Publication Number Publication Date
TW462103B true TW462103B (en) 2001-11-01

Family

ID=21629770

Family Applications (1)

Application Number Title Priority Date Filing Date
TW87104656A TW462103B (en) 1998-03-27 1998-03-27 Wafer testing device and method

Country Status (2)

Country Link
US (1) US6265888B1 (en)
TW (1) TW462103B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI385727B (en) * 2009-01-16 2013-02-11 Marketech Int Corp
TWI500942B (en) * 2014-06-09 2015-09-21

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7382142B2 (en) 2000-05-23 2008-06-03 Nanonexus, Inc. High density interconnect system having rapid fabrication cycle
US7952373B2 (en) 2000-05-23 2011-05-31 Verigy (Singapore) Pte. Ltd. Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies
US20050068054A1 (en) * 2000-05-23 2005-03-31 Sammy Mok Standardized layout patterns and routing structures for integrated circuit wafer probe card assemblies
US6812718B1 (en) 1999-05-27 2004-11-02 Nanonexus, Inc. Massively parallel interface for electronic circuits
JP2001007165A (en) * 1999-06-21 2001-01-12 Mitsubishi Electric Corp Probe card unit
US6799976B1 (en) * 1999-07-28 2004-10-05 Nanonexus, Inc. Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies
US6879172B1 (en) * 2000-06-02 2005-04-12 Advanced Micro Devices, Inc. Integrated circuit heating system and method therefor
US6815965B1 (en) * 2000-06-02 2004-11-09 Advanced Micro Devices, Inc. Integrated circuit internal heating system and method therefor
US7247035B2 (en) * 2000-06-20 2007-07-24 Nanonexus, Inc. Enhanced stress metal spring contactor
US7700379B2 (en) * 2001-08-13 2010-04-20 Finisar Corporation Methods of conducting wafer level burn-in of electronic devices
US6714828B2 (en) * 2001-09-17 2004-03-30 Formfactor, Inc. Method and system for designing a probe card
JP4173306B2 (en) * 2001-11-30 2008-10-29 イビデン株式会社 Reliability evaluation test apparatus, reliability evaluation test system and reliability evaluation test method
US6667631B2 (en) 2001-12-27 2003-12-23 Stmicroelectronics, Inc. High temperature probe card
TW583395B (en) * 2002-03-13 2004-04-11 Scs Hightech Inc Method for producing micro probe tips
US7412639B2 (en) * 2002-05-24 2008-08-12 Verigy (Singapore) Pte. Ltd. System and method for testing circuitry on a wafer
US7032193B1 (en) * 2002-09-30 2006-04-18 Advanced Micro Devices, Inc. Differentially mis-aligned contacts in flash arrays to calibrate failure modes
DE10260766A1 (en) * 2002-12-23 2004-04-01 Infineon Technologies Ag Integrated circuit contacting device for front-end testing has positioning device for defined positioning of test card relative to substrate disc provided with integrated circuits in given configuration
US7157923B2 (en) * 2004-11-18 2007-01-02 Infineon Technologies Ag Method for full wafer contact probing, wafer design and probe card device with reduced probe contacts
JP4145293B2 (en) * 2004-12-28 2008-09-03 株式会社ルネサステクノロジ The method of manufacturing a semiconductor inspection apparatus and semiconductor device
KR100656586B1 (en) * 2005-01-07 2006-12-13 삼성전자주식회사 Wafer burn-in system with air blower for cooling probe card
TWI308773B (en) * 2006-07-07 2009-04-11 Chipmos Technologies Inc Method for manufacturing probe card
JP2008130905A (en) * 2006-11-22 2008-06-05 Toshiba Corp Manufacturing method of semiconductor device and its test equipment
KR20080053768A (en) * 2006-12-11 2008-06-16 삼성전자주식회사 Wafer chuck and apparatus having the same and method for testing the electrical characteristic of wafer
KR101278131B1 (en) * 2009-04-28 2013-07-05 가부시키가이샤 어드밴티스트 Wiring board unit and testing apparatus
US8436631B2 (en) * 2009-06-12 2013-05-07 Semicaps Pte Ltd Wafer stage
DE102009054678A1 (en) 2009-12-15 2011-06-16 Robert Bosch Gmbh Controller for e.g. detecting components in faulty conditions before manufacturing process, has heating element, where controller supplies current so that controller is heated to temperature at which defective components do not operate
US20130093453A1 (en) * 2010-08-17 2013-04-18 Advantest Corporation Connecting device, semiconductor wafer test apparatus comprising same, and connecting method
JP5943742B2 (en) * 2012-07-04 2016-07-05 三菱電機株式会社 The semiconductor test fixture and semiconductor testing method using the same
CN104347120B (en) * 2013-08-07 2017-06-06 上海华虹宏力半导体制造有限公司 Implemented method of increasing the number of the memory tester with measured
JP2017227478A (en) * 2016-06-21 2017-12-28 株式会社日本マイクロニクス Probe card, inspection device, and inspection method

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4065717A (en) * 1970-09-15 1977-12-27 Signetics Corporation Multi-point microprobe for testing integrated circuits
US5325052A (en) * 1990-11-30 1994-06-28 Tokyo Electron Yamanashi Limited Probe apparatus
JPH0653299A (en) * 1992-07-31 1994-02-25 Tokyo Electron Yamanashi Kk Burn-in apparatus
KR0140034B1 (en) * 1993-12-16 1998-07-15 모리시다 요이치 Semiconductor wafer case, connection method and apparatus, and inspection method for semiconductor integrated circuit, probe card, and its manufacturing method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI385727B (en) * 2009-01-16 2013-02-11 Marketech Int Corp
TWI500942B (en) * 2014-06-09 2015-09-21

Also Published As

Publication number Publication date
US6265888B1 (en) 2001-07-24

Similar Documents

Publication Publication Date Title
US5239191A (en) Semiconductor wafer
US4567432A (en) Apparatus for testing integrated circuits
US8315730B2 (en) Methods for non lot-based integrated circuit manufacturing
US3746973A (en) Testing of metallization networks on insulative substrates supporting semiconductor chips
US5047711A (en) Wafer-level burn-in testing of integrated circuits
TW455977B (en) Testing apparatus for non-packaged semiconductor chip
US6853206B2 (en) Method and probe card configuration for testing a plurality of integrated circuits in parallel
US4985988A (en) Method for assembling, testing, and packaging integrated circuits
US6870381B2 (en) Insulative covering of probe tips
KR101176858B1 (en) Test method for yielding a known good die
EP0834124B1 (en) Parallel testing of cpu cache and instruction units
WO2000003252A3 (en) Multi-point probe
SG97819A1 (en) Structures for wafer level test and burn-in
TW263558B (en) Probe card for high temperature application
TWI286214B (en) Device test apparatus and test method
KR950023986A (en) Interconnects inspection of printed circuit board inspection apparatus and method for a printed circuit board
JPH09503577A (en) Burn-in reusable die carrier and burn treatment
TWI287099B (en) Electronic component testing apparatus and method for configuring electronic component testing apparatus
TW358997B (en) Method and apparatus for performing operative testing on an IC
TW425649B (en) Probe card for testing semiconductor device, and semiconductor device test method
TW579431B (en) Parallel testing of integrated circuit devices using cross-DUT and within-DUT comparisons
TWI264074B (en) Measuring method, inspection method, inspection device, semiconductor device, method of manufacturing a semiconductor device, and method of manufacturing an element substrate
JPS5661136A (en) Semiconductor test equipment
TW498533B (en) Semiconductor device and its manufacturing method
US6204679B1 (en) Low cost memory tester with high throughput

Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees