UA97126C2 - Процесс шлифования сапфирной основы - Google Patents

Процесс шлифования сапфирной основы

Info

Publication number
UA97126C2
UA97126C2 UAA200906861A UAA200906861A UA97126C2 UA 97126 C2 UA97126 C2 UA 97126C2 UA A200906861 A UAA200906861 A UA A200906861A UA A200906861 A UAA200906861 A UA A200906861A UA 97126 C2 UA97126 C2 UA 97126C2
Authority
UA
Ukraine
Prior art keywords
sapphire substrate
fixed abrasive
machining
machining sapphire
grinding
Prior art date
Application number
UAA200906861A
Other languages
English (en)
Russian (ru)
Ukrainian (uk)
Inventor
Брахманандам В. Таникелла
Паланиаппан ЧИННАКАРУППАН
Роберт А. Риццуто
Исаак К. ЧЕРИАН
Рамануджам Ведантхам
Original Assignee
Сейнт-Гобейн Серамикс Энд Пластик, Инк.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Сейнт-Гобейн Серамикс Энд Пластик, Инк. filed Critical Сейнт-Гобейн Серамикс Энд Пластик, Инк.
Publication of UA97126C2 publication Critical patent/UA97126C2/ru

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
UAA200906861A 2006-12-28 2007-12-21 Процесс шлифования сапфирной основы UA97126C2 (ru)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US88235106P 2006-12-28 2006-12-28
PCT/US2007/088548 WO2008083071A1 (en) 2006-12-28 2007-12-21 Method of grinding a sapphire substrate

Publications (1)

Publication Number Publication Date
UA97126C2 true UA97126C2 (ru) 2012-01-10

Family

ID=39253929

Family Applications (1)

Application Number Title Priority Date Filing Date
UAA200906861A UA97126C2 (ru) 2006-12-28 2007-12-21 Процесс шлифования сапфирной основы

Country Status (13)

Country Link
US (1) US8197303B2 (zh)
EP (1) EP2121242B1 (zh)
JP (3) JP5481198B2 (zh)
KR (7) KR20140131598A (zh)
CN (2) CN101600539B (zh)
AT (1) ATE545481T1 (zh)
CA (1) CA2673523C (zh)
IN (1) IN2014MN01903A (zh)
PL (1) PL2121242T3 (zh)
RU (1) RU2422259C2 (zh)
TW (1) TWI360457B (zh)
UA (1) UA97126C2 (zh)
WO (1) WO2008083071A1 (zh)

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