WO2008102672A1 - 研磨スラリーおよびその製造方法、ならびに窒化物結晶体およびその表面研磨方法 - Google Patents

研磨スラリーおよびその製造方法、ならびに窒化物結晶体およびその表面研磨方法 Download PDF

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Publication number
WO2008102672A1
WO2008102672A1 PCT/JP2008/052303 JP2008052303W WO2008102672A1 WO 2008102672 A1 WO2008102672 A1 WO 2008102672A1 JP 2008052303 W JP2008052303 W JP 2008052303W WO 2008102672 A1 WO2008102672 A1 WO 2008102672A1
Authority
WO
WIPO (PCT)
Prior art keywords
crystalline material
nitride crystalline
polishing
slurry
polishing slurry
Prior art date
Application number
PCT/JP2008/052303
Other languages
English (en)
French (fr)
Inventor
Kazuhiro Kawabata
Shigeyoshi Nakayama
Keiji Ishibashi
Original Assignee
Sumitomo Electric Industries, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries, Ltd. filed Critical Sumitomo Electric Industries, Ltd.
Priority to JP2008530262A priority Critical patent/JPWO2008102672A1/ja
Priority to EP08711161A priority patent/EP2039474A1/en
Priority to US12/297,569 priority patent/US20090317638A1/en
Publication of WO2008102672A1 publication Critical patent/WO2008102672A1/ja

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31—Surface property or characteristic of web, sheet or block

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

窒化物結晶体の表面を研磨するためのスラリーであって、酸化物砥粒と、アニオン性有機分散剤および無機分散剤の少なくともいずれかの分散剤と、酸化剤とを含み、ｐＨが７より小さい研磨スラリーを用いることで、窒化物結晶体の表面を効率的に研磨するスラリーを提供する。
PCT/JP2008/052303 2007-02-20 2008-02-13 研磨スラリーおよびその製造方法、ならびに窒化物結晶体およびその表面研磨方法 WO2008102672A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2008530262A JPWO2008102672A1 (ja) 2007-02-20 2008-02-13 研磨スラリーおよびその製造方法、ならびに窒化物結晶体およびその表面研磨方法
EP08711161A EP2039474A1 (en) 2007-02-20 2008-02-13 Polishing slurry, method for manufacturing the polishing slurry, nitride crystalline material and method for polishing surface of the nitride crystalline material
US12/297,569 US20090317638A1 (en) 2007-02-20 2008-02-13 Polishing slurry, method for manufacturing the polishing slurry, nitride crystalline material and method for plishing surface of the nitride crystalline material

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-039584 2007-02-20
JP2007039584 2007-02-20

Publications (1)

Publication Number Publication Date
WO2008102672A1 true WO2008102672A1 (ja) 2008-08-28

Family

ID=39709949

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/052303 WO2008102672A1 (ja) 2007-02-20 2008-02-13 研磨スラリーおよびその製造方法、ならびに窒化物結晶体およびその表面研磨方法

Country Status (7)

Country Link
US (1) US20090317638A1 (ja)
EP (1) EP2039474A1 (ja)
JP (1) JPWO2008102672A1 (ja)
KR (1) KR20090010169A (ja)
CN (1) CN101541476A (ja)
TW (1) TW200848500A (ja)
WO (1) WO2008102672A1 (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100258528A1 (en) * 2009-04-13 2010-10-14 Sinmat, Inc. Chemical mechanical polishing of silicon carbide comprising surfaces
WO2011142052A1 (ja) * 2010-05-10 2011-11-17 住友電気工業株式会社 研磨剤、化合物半導体の製造方法および半導体デバイスの製造方法
WO2016158328A1 (ja) * 2015-04-01 2016-10-06 三井金属鉱業株式会社 研摩材および研摩スラリー
KR20160138099A (ko) * 2014-03-31 2016-12-02 가부시키가이샤 노리타케 캄파니 리미티드 GaN 단결정 재료의 연마 가공 방법
JPWO2017057155A1 (ja) * 2015-09-30 2017-10-19 株式会社フジミインコーポレーテッド 研磨用組成物

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008010835A (ja) 2006-05-31 2008-01-17 Sumitomo Electric Ind Ltd 窒化物結晶の表面処理方法、窒化物結晶基板、エピタキシャル層付窒化物結晶基板および半導体デバイス、ならびにエピタキシャル層付窒化物結晶基板および半導体デバイスの製造方法
US8828874B2 (en) 2011-03-28 2014-09-09 Sinmat, Inc. Chemical mechanical polishing of group III-nitride surfaces
KR101704411B1 (ko) 2011-09-26 2017-02-08 생-고뱅 세라믹스 앤드 플라스틱스, 인코포레이티드 연마 미립자 소재를 포함하는 연마 물품, 연마 미립자 소재를 이용하는 코팅 연마제 및 형성 방법
KR101861894B1 (ko) * 2015-05-15 2018-05-29 삼성에스디아이 주식회사 유기막 ｃｍｐ 슬러리 조성물 및 이를 이용한 연마방법
CN109153889B (zh) 2016-05-19 2021-10-29 东进世美肯株式会社 用于化学机械抛光的浆料组合物
US11078380B2 (en) * 2017-07-10 2021-08-03 Entegris, Inc. Hard abrasive particle-free polishing of hard materials

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01205973A (ja) * 1988-02-09 1989-08-18 Mitsubishi Kasei Corp 研磨用組成物
JP2001035819A (ja) 1999-07-16 2001-02-09 Nippei Toyama Corp 研磨スラリー及びこれを用いた研磨方法
JP2001342456A (ja) * 2000-01-18 2001-12-14 Praxair St Technol Inc 研磨性スラリー
JP2003306669A (ja) 2002-04-16 2003-10-31 Nihon Micro Coating Co Ltd 研磨スラリー
JP2005123577A (ja) * 2003-08-05 2005-05-12 Rohm & Haas Electronic Materials Cmp Holdings Inc 半導体ウェーハにおけるエロ−ジョンを低減させるためのケミカルメカニカルプラナリゼーション組成物
JP2006310362A (ja) * 2005-04-26 2006-11-09 Sumitomo Electric Ind Ltd Ｉｉｉ族窒化物結晶の表面処理方法、ｉｉｉ族窒化物結晶基板、エピタキシャル層付ｉｉｉ族窒化物結晶基板および半導体デバイス

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4956015A (en) * 1988-01-19 1990-09-11 Mitsubishi Kasei Corporation Polishing composition

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01205973A (ja) * 1988-02-09 1989-08-18 Mitsubishi Kasei Corp 研磨用組成物
JP2001035819A (ja) 1999-07-16 2001-02-09 Nippei Toyama Corp 研磨スラリー及びこれを用いた研磨方法
JP2001342456A (ja) * 2000-01-18 2001-12-14 Praxair St Technol Inc 研磨性スラリー
JP2003306669A (ja) 2002-04-16 2003-10-31 Nihon Micro Coating Co Ltd 研磨スラリー
JP2005123577A (ja) * 2003-08-05 2005-05-12 Rohm & Haas Electronic Materials Cmp Holdings Inc 半導体ウェーハにおけるエロ−ジョンを低減させるためのケミカルメカニカルプラナリゼーション組成物
JP2006310362A (ja) * 2005-04-26 2006-11-09 Sumitomo Electric Ind Ltd Ｉｉｉ族窒化物結晶の表面処理方法、ｉｉｉ族窒化物結晶基板、エピタキシャル層付ｉｉｉ族窒化物結晶基板および半導体デバイス

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100258528A1 (en) * 2009-04-13 2010-10-14 Sinmat, Inc. Chemical mechanical polishing of silicon carbide comprising surfaces
US9368367B2 (en) * 2009-04-13 2016-06-14 Sinmat, Inc. Chemical mechanical polishing of silicon carbide comprising surfaces
WO2011142052A1 (ja) * 2010-05-10 2011-11-17 住友電気工業株式会社 研磨剤、化合物半導体の製造方法および半導体デバイスの製造方法
JP2011238763A (ja) * 2010-05-10 2011-11-24 Sumitomo Electric Ind Ltd 研磨剤、化合物半導体の製造方法および半導体デバイスの製造方法
US8841215B2 (en) 2010-05-10 2014-09-23 Sumitomo Electric Industries, Ltd. Polishing agent, compound semiconductor manufacturing method, and semiconductor device manufacturing method
KR20160138099A (ko) * 2014-03-31 2016-12-02 가부시키가이샤 노리타케 캄파니 리미티드 GaN 단결정 재료의 연마 가공 방법
JP2018050065A (ja) * 2014-03-31 2018-03-29 株式会社ノリタケカンパニーリミテド ＧａＮ単結晶材料の研磨加工方法
US10272537B2 (en) 2014-03-31 2019-04-30 Noritake Co., Limited Method for polishing GaN single crystal material
KR20210000328A (ko) * 2014-03-31 2021-01-04 가부시키가이샤 노리타케 캄파니 리미티드 GaN 단결정 재료의 연마 가공 방법
KR102230101B1 (ko) 2014-03-31 2021-03-18 가부시키가이샤 노리타케 캄파니 리미티드 GaN 단결정 재료의 연마 가공 방법
KR102230096B1 (ko) 2014-03-31 2021-03-18 가부시키가이샤 노리타케 캄파니 리미티드 GaN 단결정 재료의 연마 가공 방법
WO2016158328A1 (ja) * 2015-04-01 2016-10-06 三井金属鉱業株式会社 研摩材および研摩スラリー
JPWO2016158328A1 (ja) * 2015-04-01 2017-09-14 三井金属鉱業株式会社 研摩材および研摩スラリー
JPWO2017057155A1 (ja) * 2015-09-30 2017-10-19 株式会社フジミインコーポレーテッド 研磨用組成物

Also Published As

Publication number Publication date
US20090317638A1 (en) 2009-12-24
KR20090010169A (ko) 2009-01-29
CN101541476A (zh) 2009-09-23
TW200848500A (en) 2008-12-16
JPWO2008102672A1 (ja) 2010-05-27
EP2039474A1 (en) 2009-03-25

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