CN110722692B - 一种控制研磨产品bow值加工的方法 - Google Patents
一种控制研磨产品bow值加工的方法 Download PDFInfo
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- CN110722692B CN110722692B CN201910967920.3A CN201910967920A CN110722692B CN 110722692 B CN110722692 B CN 110722692B CN 201910967920 A CN201910967920 A CN 201910967920A CN 110722692 B CN110722692 B CN 110722692B
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- product
- bow
- processing
- cutting
- controlled
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
- B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201910967920.3A CN110722692B (zh) | 2019-10-12 | 2019-10-12 | 一种控制研磨产品bow值加工的方法 |
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CN201910967920.3A CN110722692B (zh) | 2019-10-12 | 2019-10-12 | 一种控制研磨产品bow值加工的方法 |
Publications (2)
Publication Number | Publication Date |
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CN110722692A CN110722692A (zh) | 2020-01-24 |
CN110722692B true CN110722692B (zh) | 2021-09-07 |
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CN201910967920.3A Active CN110722692B (zh) | 2019-10-12 | 2019-10-12 | 一种控制研磨产品bow值加工的方法 |
Country Status (1)
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CN (1) | CN110722692B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114068773A (zh) * | 2022-01-11 | 2022-02-18 | 江西兆驰半导体有限公司 | 一种蓝宝石衬底制作方法 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE69518202T2 (de) * | 1994-08-29 | 2001-02-08 | Shinetsu Handotai Kk | Verfahren und Vorrichtung zum Oberflächenschleifen eines Werkstücks |
CN1787181A (zh) * | 2004-12-08 | 2006-06-14 | 中国电子科技集团公司第四十六研究所 | 一种可以改善半导体晶片几何参数的晶片加工方法 |
CN101600539A (zh) * | 2006-12-28 | 2009-12-09 | 圣戈本陶瓷及塑料股份有限公司 | 研磨蓝宝石基材的方法 |
CN102569055A (zh) * | 2010-12-14 | 2012-07-11 | 北京天科合达蓝光半导体有限公司 | 一种SiC单晶平整度的调整方法—湿法刻蚀 |
CN103817806A (zh) * | 2013-12-24 | 2014-05-28 | 珠海东精大电子科技有限公司 | 用于制备石英晶片的游轮及方法 |
CN104813439A (zh) * | 2012-10-26 | 2015-07-29 | 道康宁公司 | 平坦的SiC半导体基板 |
CN107097148A (zh) * | 2017-06-13 | 2017-08-29 | 江苏吉星新材料有限公司 | 一种蓝宝石衬底片切片后的分类方法 |
CN108406575A (zh) * | 2018-02-05 | 2018-08-17 | 上海华虹宏力半导体制造有限公司 | Cmp研磨方法 |
CN110270924A (zh) * | 2019-07-31 | 2019-09-24 | 上海华虹宏力半导体制造有限公司 | Cmp研磨方法 |
-
2019
- 2019-10-12 CN CN201910967920.3A patent/CN110722692B/zh active Active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE69518202T2 (de) * | 1994-08-29 | 2001-02-08 | Shinetsu Handotai Kk | Verfahren und Vorrichtung zum Oberflächenschleifen eines Werkstücks |
CN1787181A (zh) * | 2004-12-08 | 2006-06-14 | 中国电子科技集团公司第四十六研究所 | 一种可以改善半导体晶片几何参数的晶片加工方法 |
CN101600539A (zh) * | 2006-12-28 | 2009-12-09 | 圣戈本陶瓷及塑料股份有限公司 | 研磨蓝宝石基材的方法 |
CN102569055A (zh) * | 2010-12-14 | 2012-07-11 | 北京天科合达蓝光半导体有限公司 | 一种SiC单晶平整度的调整方法—湿法刻蚀 |
CN104813439A (zh) * | 2012-10-26 | 2015-07-29 | 道康宁公司 | 平坦的SiC半导体基板 |
CN103817806A (zh) * | 2013-12-24 | 2014-05-28 | 珠海东精大电子科技有限公司 | 用于制备石英晶片的游轮及方法 |
CN107097148A (zh) * | 2017-06-13 | 2017-08-29 | 江苏吉星新材料有限公司 | 一种蓝宝石衬底片切片后的分类方法 |
CN108406575A (zh) * | 2018-02-05 | 2018-08-17 | 上海华虹宏力半导体制造有限公司 | Cmp研磨方法 |
CN110270924A (zh) * | 2019-07-31 | 2019-09-24 | 上海华虹宏力半导体制造有限公司 | Cmp研磨方法 |
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CN110722692A (zh) | 2020-01-24 |
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Address after: 223001 No. 6, Jingxiu Road, Huai'an City, Jiangsu Province Patentee after: Jiangsu Aoyang Shunchang integrated circuit Co.,Ltd. Address before: 223001 No. 6, Jingxiu Road, Huai'an City, Jiangsu Province Patentee before: JIANGSU AUCKSUN INTEGRATED CIRCUIT Co.,Ltd. |
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Effective date of registration: 20220228 Address after: 223001 No. 6, Jingxiu Road, Qinghe New District, Huai'an City, Jiangsu Province Patentee after: HUAIAN AUCKSUN OPTOELECTRONICS TECHNOLOGY Co.,Ltd. Address before: 223001 No. 6, Jingxiu Road, Huai'an City, Jiangsu Province Patentee before: Jiangsu Aoyang Shunchang integrated circuit Co.,Ltd. |