MX2009010119A - Metodos para remover defectos en superficies. - Google Patents

Metodos para remover defectos en superficies.

Info

Publication number
MX2009010119A
MX2009010119A MX2009010119A MX2009010119A MX2009010119A MX 2009010119 A MX2009010119 A MX 2009010119A MX 2009010119 A MX2009010119 A MX 2009010119A MX 2009010119 A MX2009010119 A MX 2009010119A MX 2009010119 A MX2009010119 A MX 2009010119A
Authority
MX
Mexico
Prior art keywords
methods
removing defects
abrasive
rotationally reciprocating
rotationally
Prior art date
Application number
MX2009010119A
Other languages
English (en)
Inventor
Michael J Annen
Peter A Felipe
Lowell W Holland
Adam M Spah
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of MX2009010119A publication Critical patent/MX2009010119A/es

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B23/00—Portable grinding machines, e.g. hand-guided; Accessories therefor
    • B24B23/04—Portable grinding machines, e.g. hand-guided; Accessories therefor with oscillating grinding tools; Accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D9/00—Wheels or drums supporting in exchangeable arrangement a layer of flexible abrasive material, e.g. sandpaper
    • B24D9/08—Circular back-plates for carrying flexible material

Abstract

La presente invención se refiere a métodos para abradir superficies oscilando rotacionalmente superficies abrasivas en contacto con las superficies, artículos abrasivos para uso en herramientas rotacionalmente oscilantes, y métodos para remover defectos en una superficie, donde los métodos incluyen lijado usando una superficie abrasiva rotacionalmente oscilante seguido por una o más operaciones de pulido.
MX2009010119A 2007-03-21 2008-03-20 Metodos para remover defectos en superficies. MX2009010119A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US89614507P 2007-03-21 2007-03-21
PCT/US2008/057621 WO2008116049A2 (en) 2007-03-21 2008-03-20 Methods of removing defects in surfaces

Publications (1)

Publication Number Publication Date
MX2009010119A true MX2009010119A (es) 2009-10-19

Family

ID=39591077

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2009010119A MX2009010119A (es) 2007-03-21 2008-03-20 Metodos para remover defectos en superficies.

Country Status (11)

Country Link
US (1) US8057281B2 (es)
EP (1) EP2136964A2 (es)
JP (1) JP2010522093A (es)
KR (1) KR20090122302A (es)
CN (1) CN101641184B (es)
AU (1) AU2008228858B2 (es)
BR (1) BRPI0809139A2 (es)
CA (1) CA2681316C (es)
MX (1) MX2009010119A (es)
RU (1) RU2009134876A (es)
WO (1) WO2008116049A2 (es)

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KR102001370B1 (ko) * 2018-11-02 2019-07-18 이규동 플라스틱 흠집 제거 방법
WO2020091275A1 (ko) * 2018-11-02 2020-05-07 이규동 플라스틱 흠집 제거 장치 및 방법
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CN114589619B (zh) * 2020-12-03 2023-04-25 中国科学院微电子研究所 半导体研磨垫及制备方法
CN112676962B (zh) * 2020-12-22 2021-11-30 全椒赛德利机械有限公司 一种用于散热器加工的磨床装置
CN113427322A (zh) * 2021-05-26 2021-09-24 杨连军 一种去除模具烧焊后印痕的方法

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Also Published As

Publication number Publication date
CA2681316C (en) 2016-07-19
CN101641184B (zh) 2012-11-28
WO2008116049A2 (en) 2008-09-25
JP2010522093A (ja) 2010-07-01
US20080233837A1 (en) 2008-09-25
US8057281B2 (en) 2011-11-15
BRPI0809139A2 (pt) 2019-07-30
RU2009134876A (ru) 2011-04-27
WO2008116049A3 (en) 2008-12-18
CN101641184A (zh) 2010-02-03
EP2136964A2 (en) 2009-12-30
KR20090122302A (ko) 2009-11-26
AU2008228858A1 (en) 2008-09-25
CA2681316A1 (en) 2008-09-25
AU2008228858B2 (en) 2011-10-20

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