ATE496729T1 - Schleifagglomeratpolierverfahren - Google Patents
SchleifagglomeratpolierverfahrenInfo
- Publication number
- ATE496729T1 ATE496729T1 AT06787879T AT06787879T ATE496729T1 AT E496729 T1 ATE496729 T1 AT E496729T1 AT 06787879 T AT06787879 T AT 06787879T AT 06787879 T AT06787879 T AT 06787879T AT E496729 T1 ATE496729 T1 AT E496729T1
- Authority
- AT
- Austria
- Prior art keywords
- abrasive
- workpiece
- particles
- providing
- agglomera
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/013—Application of loose grinding agent as auxiliary tool during truing operation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
- B24B37/245—Pads with fixed abrasives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/007—Cleaning of grinding wheels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
- B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
- B24D7/063—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental with segments embedded in a matrix which is rubbed away during the grinding process
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
- Cosmetics (AREA)
- Saccharide Compounds (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/191,711 US7494519B2 (en) | 2005-07-28 | 2005-07-28 | Abrasive agglomerate polishing method |
PCT/US2006/028061 WO2007015909A1 (en) | 2005-07-28 | 2006-07-19 | Abrasive agglomerate polishing method |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE496729T1 true ATE496729T1 (de) | 2011-02-15 |
Family
ID=37401245
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT06787879T ATE496729T1 (de) | 2005-07-28 | 2006-07-19 | Schleifagglomeratpolierverfahren |
Country Status (9)
Country | Link |
---|---|
US (1) | US7494519B2 (de) |
EP (1) | EP1910025B1 (de) |
JP (1) | JP5620639B2 (de) |
KR (1) | KR101299272B1 (de) |
CN (1) | CN101232969B (de) |
AT (1) | ATE496729T1 (de) |
DE (1) | DE602006019876D1 (de) |
TW (1) | TWI402136B (de) |
WO (1) | WO2007015909A1 (de) |
Families Citing this family (34)
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---|---|---|---|---|
US7594845B2 (en) * | 2005-10-20 | 2009-09-29 | 3M Innovative Properties Company | Abrasive article and method of modifying the surface of a workpiece |
CN101313417B (zh) * | 2005-11-22 | 2011-04-20 | 3M创新有限公司 | 发光制品的阵列及其制造方法 |
WO2008064068A2 (en) * | 2006-11-17 | 2008-05-29 | 3M Innovative Properties Company | Planarized led with optical extractor |
US8026115B2 (en) * | 2006-11-17 | 2011-09-27 | 3M Innovative Properties Company | Optical bonding composition for LED light source |
EP2087532A1 (de) * | 2006-11-20 | 2009-08-12 | 3M Innovative Properties Company | Optische verbindungszusammensetzung für led-lichtquelle |
JP4561732B2 (ja) * | 2006-11-20 | 2010-10-13 | トヨタ自動車株式会社 | 移動体位置測位装置 |
US8323072B1 (en) | 2007-03-21 | 2012-12-04 | 3M Innovative Properties Company | Method of polishing transparent armor |
US8038750B2 (en) | 2007-07-13 | 2011-10-18 | 3M Innovative Properties Company | Structured abrasive with overlayer, and method of making and using the same |
AU2009313815A1 (en) * | 2008-11-17 | 2010-05-20 | Saint-Gobain Abrasifs | Acrylate color-stabilized phenolic bound abrasive products and methods for making same |
JP2010194704A (ja) * | 2009-01-27 | 2010-09-09 | Shinano Denki Seiren Kk | 定盤修正用砥石、定盤修正用研磨装置及び研磨定盤の修正方法 |
KR101271444B1 (ko) * | 2009-06-04 | 2013-06-05 | 가부시키가이샤 사무코 | 고정 연마 입자 가공 장치 및 고정 연마 입자 가공 방법, 그리고 반도체 웨이퍼 제조 방법 |
US8603350B2 (en) * | 2009-07-17 | 2013-12-10 | Ohara Inc. | Method of manufacturing substrate for information storage media |
JP2011045938A (ja) * | 2009-08-25 | 2011-03-10 | Three M Innovative Properties Co | 焼成凝集体の製造方法、焼成凝集体、研磨材組成物及び研磨材物品。 |
US8360823B2 (en) | 2010-06-15 | 2013-01-29 | 3M Innovative Properties Company | Splicing technique for fixed abrasives used in chemical mechanical planarization |
US20130126334A1 (en) * | 2010-08-31 | 2013-05-23 | Yoshihiro Tawara | Method for producing glass substrate for magnetic disks, and method for producing magnetic disk |
US20130065490A1 (en) | 2011-09-12 | 2013-03-14 | 3M Innovative Properties Company | Method of refurbishing vinyl composition tile |
JPWO2013153880A1 (ja) * | 2012-04-10 | 2015-12-17 | 旭硝子株式会社 | ガラス基板の研磨方法 |
WO2013181582A1 (en) * | 2012-05-31 | 2013-12-05 | Ryan Webster | Diamond impregnated polishing pad with diamond pucks |
JP5373171B1 (ja) * | 2012-10-20 | 2013-12-18 | 株式会社ナノテム | 砥石およびそれを用いた研削・研磨装置 |
US10071459B2 (en) | 2013-09-25 | 2018-09-11 | 3M Innovative Properties Company | Multi-layered polishing pads |
WO2015047939A1 (en) | 2013-09-25 | 2015-04-02 | 3M Innovative Properties Company | Composite ceramic abrasive polishing solution |
EP3068581B1 (de) | 2013-11-12 | 2019-12-25 | 3M Innovative Properties Company | Strukturierte schleifartikel und verfahren zur verwendung davon |
JP6561058B2 (ja) | 2013-12-09 | 2019-08-14 | スリーエム イノベイティブ プロパティズ カンパニー | 集塊性研磨粒子、その粒子を含む研磨物品、及びその製造方法 |
US10058970B2 (en) | 2014-05-02 | 2018-08-28 | 3M Innovative Properties Company | Interrupted structured abrasive article and methods of polishing a workpiece |
US9149904B1 (en) | 2014-06-13 | 2015-10-06 | Seagate Technology Llc | Platen for wafer polishing having diamond-ceramic composites |
CN106574147A (zh) * | 2014-08-01 | 2017-04-19 | 3M创新有限公司 | 抛光液及其使用方法 |
US10086500B2 (en) * | 2014-12-18 | 2018-10-02 | Applied Materials, Inc. | Method of manufacturing a UV curable CMP polishing pad |
CN105140155B (zh) * | 2015-07-15 | 2018-06-05 | 桂林电子科技大学 | 一种用于GaAs MMIC减薄工艺的粘片方法 |
EP3192844B1 (de) * | 2016-01-12 | 2021-02-24 | Eoswiss Engineering Sarl | Verfahren und vorrichtung zum chemisch-mechanischen polieren |
US10301508B2 (en) | 2016-01-25 | 2019-05-28 | Cabot Microelectronics Corporation | Polishing composition comprising cationic polymer additive |
US10195713B2 (en) | 2016-08-11 | 2019-02-05 | 3M Innovative Properties Company | Lapping pads and systems and methods of making and using the same |
GB201616955D0 (en) * | 2016-10-06 | 2016-11-23 | University Of Newcastle Upon Tyne | Micro-milling |
US20210380857A1 (en) * | 2018-10-11 | 2021-12-09 | 3M Innovative Properties Company | Supported abrasive particles, abrasive articles, and methods of making the same |
CN113549424B (zh) * | 2021-08-04 | 2022-05-13 | 白鸽磨料磨具有限公司 | 一种抛光用氧化铈团簇粉及其制备方法 |
Family Cites Families (46)
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US4311489A (en) | 1978-08-04 | 1982-01-19 | Norton Company | Coated abrasive having brittle agglomerates of abrasive grain |
JPS61226260A (ja) * | 1985-03-30 | 1986-10-08 | Mitsubishi Metal Corp | 研削盤におけるドレツシング装置 |
US4652275A (en) | 1985-08-07 | 1987-03-24 | Minnesota Mining And Manufacturing Company | Erodable agglomerates and abrasive products containing the same |
US4799939A (en) | 1987-02-26 | 1989-01-24 | Minnesota Mining And Manufacturing Company | Erodable agglomerates and abrasive products containing the same |
JPS63274782A (ja) | 1987-05-02 | 1988-11-11 | Mishima Kosan Co Ltd | ステンレス鋼のラッピング液 |
JPS63283862A (ja) * | 1987-05-15 | 1988-11-21 | Shintou Bureetaa Kk | 研摩方法及び研摩装置 |
JPH01183370A (ja) * | 1988-01-11 | 1989-07-21 | Noritake Dia Kk | 複合ボンドダイヤモンド砥石とその製造法 |
US5078753A (en) | 1990-10-09 | 1992-01-07 | Minnesota Mining And Manufacturing Company | Coated abrasive containing erodable agglomerates |
JPH04250983A (ja) * | 1990-11-01 | 1992-09-07 | Noritake Co Ltd | 研削用複合砥石 |
US5152917B1 (en) | 1991-02-06 | 1998-01-13 | Minnesota Mining & Mfg | Structured abrasive article |
US5437754A (en) | 1992-01-13 | 1995-08-01 | Minnesota Mining And Manufacturing Company | Abrasive article having precise lateral spacing between abrasive composite members |
JPH0615572A (ja) * | 1992-07-01 | 1994-01-25 | Matsushita Electric Ind Co Ltd | 研削砥石 |
MY114512A (en) | 1992-08-19 | 2002-11-30 | Rodel Inc | Polymeric substrate with polymeric microelements |
US5435816A (en) | 1993-01-14 | 1995-07-25 | Minnesota Mining And Manufacturing Company | Method of making an abrasive article |
CH686787A5 (de) | 1993-10-15 | 1996-06-28 | Diametal Ag | Schleifbelag fuer Schleifwerkzeuge und Verfahren zur Herstellung des Schleifbelages. |
US5632668A (en) | 1993-10-29 | 1997-05-27 | Minnesota Mining And Manufacturing Company | Method for the polishing and finishing of optical lenses |
US5454844A (en) | 1993-10-29 | 1995-10-03 | Minnesota Mining And Manufacturing Company | Abrasive article, a process of making same, and a method of using same to finish a workpiece surface |
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US5958794A (en) | 1995-09-22 | 1999-09-28 | Minnesota Mining And Manufacturing Company | Method of modifying an exposed surface of a semiconductor wafer |
US5702811A (en) | 1995-10-20 | 1997-12-30 | Ho; Kwok-Lun | High performance abrasive articles containing abrasive grains and nonabrasive composite grains |
US6595831B1 (en) | 1996-05-16 | 2003-07-22 | Ebara Corporation | Method for polishing workpieces using fixed abrasives |
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JPH10156704A (ja) * | 1996-12-03 | 1998-06-16 | Toshiba Mach Co Ltd | 研磨方法およびその装置 |
US6648733B2 (en) | 1997-04-04 | 2003-11-18 | Rodel Holdings, Inc. | Polishing pads and methods relating thereto |
US6117000A (en) * | 1998-07-10 | 2000-09-12 | Cabot Corporation | Polishing pad for a semiconductor substrate |
US6183346B1 (en) | 1998-08-05 | 2001-02-06 | 3M Innovative Properties Company | Abrasive article with embossed isolation layer and methods of making and using |
JP2000117606A (ja) * | 1998-10-09 | 2000-04-25 | Asahi Glass Co Ltd | ブラウン管用ガラスパネルのフェース面研削方法 |
JP4049510B2 (ja) | 1999-03-24 | 2008-02-20 | 株式会社オハラ | 情報記憶媒体用ガラス基板材またはガラスセラミックス基板材の加工方法 |
ES2275500T3 (es) * | 1999-04-23 | 2007-06-16 | Takeda Pharmaceutical Company Limited | Compuestos de 5-piridil-1,3-azol, procedimiento para su produccion y uso de los mismos. |
US20020077037A1 (en) * | 1999-05-03 | 2002-06-20 | Tietz James V. | Fixed abrasive articles |
US6319108B1 (en) | 1999-07-09 | 2001-11-20 | 3M Innovative Properties Company | Metal bond abrasive article comprising porous ceramic abrasive composites and method of using same to abrade a workpiece |
US6602117B1 (en) | 2000-08-30 | 2003-08-05 | Micron Technology, Inc. | Slurry for use with fixed-abrasive polishing pads in polishing semiconductor device conductive structures that include copper and tungsten and polishing methods |
US6645624B2 (en) | 2000-11-10 | 2003-11-11 | 3M Innovative Properties Company | Composite abrasive particles and method of manufacture |
US6551366B1 (en) | 2000-11-10 | 2003-04-22 | 3M Innovative Properties Company | Spray drying methods of making agglomerate abrasive grains and abrasive articles |
KR20030022105A (ko) | 2001-02-20 | 2003-03-15 | 가부시키 가이샤 에바라 세이사꾸쇼 | 폴리싱장치 및 드레싱방법 |
US6485355B1 (en) | 2001-06-22 | 2002-11-26 | International Business Machines Corporation | Method to increase removal rate of oxide using fixed-abrasive |
CN1649802B (zh) | 2001-08-02 | 2012-02-01 | 3M创新有限公司 | 陶瓷材料、磨粒、磨具及制造和使用方法 |
JP2003251560A (ja) * | 2002-02-28 | 2003-09-09 | Sanwa Kenma Kogyo Kk | ドレッシング用成形体およびその製造方法 |
US6910951B2 (en) | 2003-02-24 | 2005-06-28 | Dow Global Technologies, Inc. | Materials and methods for chemical-mechanical planarization |
IL156094A0 (en) | 2003-05-25 | 2003-12-23 | J G Systems Inc | Fixed abrasive cmp pad with built-in additives |
JP4443870B2 (ja) * | 2003-07-07 | 2010-03-31 | 克雄 庄司 | 超砥粒ホイール及びその製造方法 |
JP2005088153A (ja) * | 2003-09-19 | 2005-04-07 | Allied Material Corp | ダイヤモンドラップ定盤による硬脆材料の平面研削加工法 |
JP2005271157A (ja) * | 2004-03-25 | 2005-10-06 | Noritake Super Abrasive:Kk | ラップホイール |
US7169031B1 (en) * | 2005-07-28 | 2007-01-30 | 3M Innovative Properties Company | Self-contained conditioning abrasive article |
-
2005
- 2005-07-28 US US11/191,711 patent/US7494519B2/en active Active
-
2006
- 2006-07-19 JP JP2008523964A patent/JP5620639B2/ja not_active Expired - Fee Related
- 2006-07-19 EP EP06787879A patent/EP1910025B1/de not_active Not-in-force
- 2006-07-19 DE DE602006019876T patent/DE602006019876D1/de active Active
- 2006-07-19 KR KR1020087002051A patent/KR101299272B1/ko active IP Right Grant
- 2006-07-19 CN CN2006800276462A patent/CN101232969B/zh active Active
- 2006-07-19 WO PCT/US2006/028061 patent/WO2007015909A1/en active Application Filing
- 2006-07-19 AT AT06787879T patent/ATE496729T1/de not_active IP Right Cessation
- 2006-07-27 TW TW095127479A patent/TWI402136B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JP5620639B2 (ja) | 2014-11-05 |
US7494519B2 (en) | 2009-02-24 |
EP1910025A1 (de) | 2008-04-16 |
DE602006019876D1 (de) | 2011-03-10 |
WO2007015909A1 (en) | 2007-02-08 |
JP2009502532A (ja) | 2009-01-29 |
KR20080030057A (ko) | 2008-04-03 |
TWI402136B (zh) | 2013-07-21 |
KR101299272B1 (ko) | 2013-08-23 |
CN101232969A (zh) | 2008-07-30 |
EP1910025B1 (de) | 2011-01-26 |
TW200720020A (en) | 2007-06-01 |
CN101232969B (zh) | 2011-05-11 |
US20070026770A1 (en) | 2007-02-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |